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    HANDLE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
    2.
    发明公开
    HANDLE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240315435A1

    公开(公告)日：2024-09-26

    申请号：US18239091

    申请日：2023-08-28

    申请人： Fulian Precision Electronics (Tianjin) Co., LTD.

    发明人： YU-WEN CHANG

    IPC分类号： A45F5/10 ,  H05K1/02

    CPC分类号： A45F5/10 ,  H05K1/0203 ,  A45F2200/0525 ,  H05K2201/066

    摘要： A handle includes a handle member, two fixing mechanisms, and two fixing mechanisms. The handle member includes a gripping portion and two extending portions connected to two ends of the gripping portion. The gripping portion extends along a first direction, each extending portion extends from the gripping portion along a second direction. The two fixing mechanisms are spaced apart from each other and can connect to a product. Each linkage mechanism is connected between one extending portion and one fixing mechanism. Each linkage mechanism includes a first connecting member and a second connecting member connected to each other. Each first connecting member is rotatably connected to each fixing mechanism. Each second connecting member is telescopically connected to each extending portion along the second direction. The present application further provides a circuit board assembly and an electronic device.

    Ceramic carrier substrate and power module
    4.
    发明授权
    Ceramic carrier substrate and power module 有权

    公开(公告)号：US12028974B2

    公开(公告)日：2024-07-02

    申请号：US17789124

    申请日：2021-02-04

    申请人： Robert Bosch GmbH

    发明人： Peter Tauber ,  Josef Weber ,  Ralf Winkler

    IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K3/46

    CPC分类号： H05K1/0306 ,  H05K1/0201 ,  H05K1/0265 ,  H05K3/4667 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/066

    摘要： A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.

    Stacking system
    5.
    发明授权
    Stacking system 有权

    公开(公告)号：US12022605B2

    公开(公告)日：2024-06-25

    申请号：US17856808

    申请日：2022-07-01

    申请人： Delta Electronics, Inc.

    发明人： Yahong Xiong ,  Xiaodong Chen ,  Wei Liu ,  Litao Qian ,  Shengli Lu

    IPC分类号： H05K7/20 ,  H05K1/02

    CPC分类号： H05K1/0203 ,  H05K7/20254 ,  H05K7/2039 ,  H05K2201/064 ,  H05K2201/066

    摘要： A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.

    Thermal Interface for Electronic Control Unit
    8.
    发明公开
    Thermal Interface for Electronic Control Unit 审中-公开

    公开(公告)号：US20240147601A1

    公开(公告)日：2024-05-02

    申请号：US18498499

    申请日：2023-10-31

    申请人： Aptiv Technologies AG

    发明人： Falk Rademacher ,  Peter Reinhold

    IPC分类号： H05K1/02 ,  H05K7/20

    CPC分类号： H05K1/0203 ,  H05K7/20509 ,  H05K2201/066

    摘要： A method for manufacturing an electronic control unit includes providing a printed circuit board with at least one electric component attached thereon. The method includes arranging a lower layer of thermal interface material on top of the electric component and arranging an integrated heat spreader on top of the lower layer. The method includes determining the distance of the top surface of the integrated heat spreader perpendicular to the printed circuit board and arranging an upper layer of thermal interface material on the top surface of the integrated heat spreader. A layer thickness of the upper layer is selected based on the determined distance. The method includes arranging a heat sink with a contact surface such that the contact surface contacts the upper layer.