公开(公告)号：US20240356255A1

公开(公告)日：2024-10-24

申请号：US18683758

申请日：2022-08-12

申请人： Tesla, Inc.

发明人： Rishabh Bhandari ,  Yong guo Li ,  Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Shiva Farzinazar ,  Mitchell Heschke

IPC分类号： H01R12/71 ,  H01R13/24 ,  H01R13/46 ,  H05K7/20

CPC分类号： H01R12/716 ,  H01R13/2421 ,  H01R13/46 ,  H05K7/20927

摘要： An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

公开(公告)号：US20240357729A1

公开(公告)日：2024-10-24

申请号：US18683754

申请日：2022-08-16

申请人： Tesla, Inc.

发明人： Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Rishabh Bhandari ,  Yong guo Li ,  Zheng Gao

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0204 ,  H05K1/181 ,  H05K2201/064 ,  H05K2201/066

摘要： Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

公开(公告)号：US20240061482A1

公开(公告)日：2024-02-22

申请号：US18260216

申请日：2022-01-20

申请人： Tesla, Inc.

发明人： Vijaykumar Krithivasan ,  Samuel Lichy ,  Yong guo Li

IPC分类号： G06F1/26 ,  H01L23/498 ,  H01L23/367 ,  H01L25/18 ,  H01L23/00

CPC分类号： G06F1/26 ,  H01L23/49816 ,  H01L23/367 ,  H01L25/18 ,  H01L23/562

摘要： A voltage regulating module design is provided. In one aspect, a voltage regulating module (VRM) includes a first layer configured to output a regulated voltage that is based on a stepped down voltage, and a second layer stacked with the first layer, and a plurality of contacts, such as a ball grid array (BGA), on the first layer. The second layer includes a plurality of active components configured to provide the stepped down voltage to the first layer. The first and second layers have overlapping recesses, and the recess of the first layer has a larger footprint than the recess of the second layer. A plurality of the VRMS can be arranged to form an opening including a counterbore. A faster, such as a bolt, can be positioned in the opening. The first layer can have a larger clearance from the fastener positioned in the opening than the second layer.