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    Stacking system
    2.
    发明授权
    Stacking system 有权

    公开(公告)号：US12022605B2

    公开(公告)日：2024-06-25

    申请号：US17856808

    申请日：2022-07-01

    Applicant: Delta Electronics, Inc.

    Inventor： Yahong Xiong ,  Xiaodong Chen ,  Wei Liu ,  Litao Qian ,  Shengli Lu

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K7/2039 ,  H05K2201/064 ,  H05K2201/066

    Abstract: A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.

    Electronic device
    7.
    发明授权
    Electronic device 有权

    公开(公告)号：US11716831B2

    公开(公告)日：2023-08-01

    申请号：US17437047

    申请日：2019-04-22

    Applicant: Mitsubishi Electric Corporation

    Inventor： Koji Kise ,  Hiroaki Ishikawa ,  Takashi Moriyama ,  Yuki Sakata

    IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  F28D15/02 ,  F28D21/00 ,  H01L23/427

    CPC classification number: H05K7/20327 ,  H05K1/0203 ,  H05K1/14 ,  H05K7/20272 ,  F28D15/025 ,  F28D2021/0021 ,  H01L23/427 ,  H05K2201/064

    Abstract: A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

    Liquid Ejecting Head Unit And Liquid Ejecting Apparatus
    8.
    发明公开
    Liquid Ejecting Head Unit And Liquid Ejecting Apparatus 审中-公开

    公开(公告)号：US20230219340A1

    公开(公告)日：2023-07-13

    申请号：US18153419

    申请日：2023-01-12

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Ryota KINOSHITA ,  Taiki HANAGAMI

    IPC: B41J2/14 ,  H05K1/02

    CPC classification number: B41J2/14 ,  H05K1/0201 ,  B41J2002/14491 ,  H05K2201/064

    Abstract: A liquid ejecting head unit includes a first connector configured to be coupled to an external wiring member. The liquid ejecting head unit includes a wiring board having the first connector, a housing for the liquid ejecting head unit, the housing having an opening through which the first connector is exposed outside and having a housing space accommodating the wiring board, and a flexible member in the housing space. The flexible member separates the housing space into a first space that has at least a portion of the first connector and the opening and a second space that is larger than the first space.

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