公开(公告)号：US12127595B2

公开(公告)日：2024-10-29

申请号：US17593135

申请日：2020-03-09

Applicant: Nicoventures Trading Limited

Inventor： Thomas Paul Blandino ,  Ashley John Sayed ,  Mitchel Thorsen ,  Luke James Warren

IPC: A24F40/57 ,  A24F40/465 ,  H05B6/10 ,  H05K1/02 ,  H05K1/18

CPC classification number: A24F40/465 ,  A24F40/57 ,  H05B6/105 ,  H05K1/0278 ,  H05K1/189 ,  H05K2201/1003 ,  H05K2201/10189

Abstract: Aerosol provision devices having printed circuit boards are described. One such aerosol provision device defines a longitudinal axis and comprises an electrical connector, a heater assembly configured to heat aerosol generating material received within the device and a printed circuit board (PCB). The PCB comprises a first portion arranged substantially parallel to the longitudinal axis and a second portion arranged substantially perpendicular to the longitudinal axis. The heater assembly is electrically coupled to the first portion. The second portion is electrically coupled to the first portion and the electrical connector is electrically coupled to the second portion. Another such aerosol provision device comprises a first coil for heating a heater component and a PCB arranged adjacent to the first coil. The PCB comprises: a first through hole connected to a first end of the first coil; and a second through hole connected to a second end of the first coil.

公开(公告)号：US12063741B2

公开(公告)日：2024-08-13

申请号：US17671975

申请日：2022-02-15

Applicant: Bel Fuse (MACAO COMMERCIAL OFFSHORE) Limited

Inventor： Hangdong Yu ,  Hai Huang ,  Hongliang Lu

IPC: H05K1/18 ,  H05K1/14

CPC classification number: H05K1/181 ,  H05K1/14 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: A power converter includes a power transformer having a body housing two secondary windings, the body having first and second opposing and substantially parallel planar faces, each of the secondary windings having respective first coils and second coils having respective terminals. The terminals of the first coils extend through the first face of the transformer body, and the terminals of the second coils extend through the second face of the transformer body. The converter further includes two printed circuit boards (PCBs) each disposed at a corresponding face of the transformer body, each PCB carrying switches and capacitors of a respective rectifier circuit connected to the terminals of the coils of the respective secondary winding, each PCB including external connections for connecting the rectifier circuits in parallel to form an output of the power converter.

公开(公告)号：US12058814B2

公开(公告)日：2024-08-06

申请号：US16862109

申请日：2020-04-29

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Shouyu Hong ,  Jinping Zhou ,  Min Zhou ,  Xiaoni Xin ,  Pengkai Ji ,  Kai Lu ,  Le Liang ,  Zhenqing Zhao

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/29 ,  H01F41/076 ,  H05K1/14 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/181 ,  H01F27/24 ,  H01F27/292 ,  H01F41/076 ,  H05K1/14 ,  H05K1/185 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36 ,  H05K3/4644 ,  H05K2201/1003

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a first board, a magnetic component, a second board and a power device. The first board includes a conductive component disposed between a first side and a second side opposite to each other. The magnetic component is disposed between the first side and the second side and includes a magnetic core and a winding. A first conductive terminal and a second conductive terminal are led out on the first side and the second side, respectively. The second board is disposed on the first board and includes a third side and a fourth side opposite to each other. The fourth side faces the first side. The power device is disposed on the third side of the second board and electrically connected to the first board.

公开(公告)号：US20240249875A1

公开(公告)日：2024-07-25

申请号：US18409713

申请日：2024-01-10

Applicant: SHANGHAI METAPWR ELECTRONICS CO. , LTD

Inventor： Xiangfei KANG ,  Yayu LI

IPC: H01F27/29 ,  H01F27/24 ,  H01F41/02 ,  H05K1/18

CPC classification number: H01F27/292 ,  H01F27/24 ,  H01F41/02 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/1003

Abstract: A method includes disposing a substrate layer on a copper layer to form a pin assembly and adhering the pin assembly to a side surface of an inductor with bonding pads on either of the upper and lower surfaces, wherein welding surfaces are coplanarly aligned. An assembled magnetic apparatus including sheet-shaped pin assembly or pin assemblies and an inductor is thereby manufactured. A power module includes the magnetic apparatus, IPM units, a wiring board and output capacitors. The pin assembly may meet a PCB process specification for panel production, and the pin pitch is configured to be lessened.

公开(公告)号：US12048097B2

公开(公告)日：2024-07-23

申请号：US17358318

申请日：2021-06-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/24 ,  H01F41/02 ,  H01F41/04 ,  H01F41/32 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H01F41/046 ,  H01F41/32 ,  H05K1/0298 ,  H05K1/115 ,  H01F2017/0066 ,  H05K1/0233 ,  H05K1/0306 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/50 ,  Y10T29/4913

Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

公开(公告)号：US20240237217A9

公开(公告)日：2024-07-11

申请号：US18546796

申请日：2022-03-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Sun JEONG ,  Jung Ki LEE ,  Sang Won LEE

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/28 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01F27/24 ,  H01F27/28 ,  H05K1/0233 ,  H05K2201/1003

Abstract: The present invention relates to a main magnetic component applicable to a core module of an electric vehicle. A composite magnetic component according to one embodiment of the present invention comprises: a transformer that converts power on an input side to transmit same to an output side, and has a first core and a first coil disposed in the first core; a ZVS inductor that refluxes a residual current to the input side without FET operation loss, and has a second core and a second coil disposed within the second core; an output inductor that removes the ripple of a current on the output side, and has a third core and a third coil disposed in the third core; and an EMI inductor that reduces electric noise of the current on the output side, and has a fourth core and a fourth coil disposed in the fourth core. Here, the second core, the third core, and the fourth core are made of different materials, and the first core and the second core are made of the same material.

公开(公告)号：US12035460B2

公开(公告)日：2024-07-09

申请号：US18056187

申请日：2022-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tarou Higuchi ,  Yoshihiro Imanishi ,  Hiroyuki Honda ,  Akiko Sakane

IPC: H05K1/02

CPC classification number: H05K1/0233 ,  H05K2201/093 ,  H05K2201/09427 ,  H05K2201/1003 ,  H05K2201/10545

Abstract: A mounting structure for mounting inductors to suppress cross talk and a stub effect due to a mounting land, and reduce deterioration of signal transmission characteristics. A first Bias-T inductor is mounted on a circuit board with one electrode terminal connected to a first mounting land with an axial direction of the first Bias-T inductor oriented perpendicular to the first mounting land and the one electrode terminal extends along the first mounting land. A second Bias-T inductor is mounted on the circuit board in the vicinity of the first Bias-T inductor with one electrode terminal connected to a second mounting land with an axial direction of the second Bias-T inductor inclined by 90° with respect to the axial direction of the first Bias-T inductor and the second Bias-T inductor is oriented perpendicular to the second mounting land and the one electrode terminal extends along the second mounting land.

公开(公告)号：US12028969B2

公开(公告)日：2024-07-02

申请号：US17687339

申请日：2022-03-04

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Shouyu Hong ,  Haibin Xu ,  Tao Wang ,  Ganyu Zhou ,  Xin Zou ,  Liping Sun ,  Chao Ji ,  Weiqiang Zhang

IPC: H05K1/00 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/025 ,  H02M7/003 ,  H02M7/537 ,  H05K1/0204 ,  H05K1/0216 ,  H05K1/0243 ,  H01L25/115 ,  H01L25/18 ,  H05K1/181 ,  H05K7/20509 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer, which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.

公开(公告)号：US20240195379A1

公开(公告)日：2024-06-13

申请号：US18288081

申请日：2022-04-29

Applicant: Schaeffler Technologies AG & Co. KG

Inventor： Julian Körner ,  Linbo Tang ,  Eduard Enderle ,  Bao Ngoc An ,  Momo Lažetic ,  Mihai Cretu

IPC: H03H7/01 ,  H05K1/02 ,  H05K1/14

CPC classification number: H03H7/0115 ,  H05K1/0243 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: An EMC filter device for power electronics of an electric machine includes an electrical conductor structure having at least two separate conducting layers that are insulated from one another; an inductor that cooperates with the electrical conductor structure; and a plurality of additional electronic components fastened to the electrical conductor structure.

公开(公告)号：US20240194390A1

公开(公告)日：2024-06-13

申请号：US18444674

申请日：2024-02-17

Applicant: Delta Electronics, Inc.

Inventor： Yahong Xiong ,  Da Jin ,  Qinghua Su

IPC: H01F27/28 ,  G05F1/575 ,  G06F1/18 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/29 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/00 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/28 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01F27/2804 ,  G05F1/575 ,  G06F1/183 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/292 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/003 ,  H02M3/1584 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/117 ,  H05K1/145 ,  H05K1/165 ,  H05K1/181 ,  H05K1/186 ,  H05K3/284 ,  H05K7/1427 ,  H05K7/2089 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: An apparatus includes a heat-dissipating substrate, a power circuit and a magnetic assembly. The heat-dissipating substrate includes a thermal contact surface. The power circuit includes at least one switch element in contact with the thermal contact surface of the heat-dissipating substrate. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The heat-dissipating substrate, the power circuit and the magnetic assembly are arranged in sequence along a same direction. A projection of the power circuit on the thermal contact surface partially overlaps a projection of the magnetic assembly on the thermal contact surface.