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公开(公告)号：US12096552B2
公开(公告)日：2024-09-17
申请号：US17216722
申请日：2021-03-30
发明人： Yuji Takematsu , Takanori Uejima , Sho Matsumoto , Tetsuro Harada , Dai Nakagawa , Naoya Matsumoto , Yutaka Sasaki , Yuuki Fukuda
CPC分类号： H05K1/0243 , H03F3/195 , H03F3/245 , H04B1/44 , H03F2200/294 , H03F2200/318 , H03F2200/451 , H05K2201/1006 , H05K2201/10098
摘要： A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.
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公开(公告)号：US12041711B2
公开(公告)日：2024-07-16
申请号：US17802697
申请日：2021-03-09
CPC分类号： H05K1/0243 , H05K2201/1006 , H05K2201/10189
摘要： A communication device includes a communication connector, a communication control circuit, and a common mode filter. The communication control circuit controls communication that is established by way of the communication connector. The common mode filter is connected to each of the communication control circuit and the communication connector to relay the communication. Letting a wavelength corresponding to a clock frequency of an electric signal sent out from the communication control circuit be denoted as λ, an electrical length of a signal path at which resonance is produced by a reflected wave resulting from reflection of the electric signal by the common mode filter is closer to an even multiple of λ/2 than to an odd multiple thereof.
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3.发明公开公开(公告)号：US20240162887A1
公开(公告)日：2024-05-16
申请号：US18423375
申请日：2024-01-26
发明人： Jin Gook KIM , Sang Yeong Jeong
CPC分类号： H03H11/04 , H03H1/0007 , H03H11/126 , H05K1/14 , H05K2201/1006
摘要： This application relates to an independent active electromagnetic interference filter module. In one aspect, the filter module includes a first element group including a noise sensing unit provided to sense electromagnetic noise, and a second element group including a compensating unit provided to generate a compensation signal for the electromagnetic noise. The first group and the second group may be respectively mounted on different substrates. According to some embodiments, the filter module can reduce a volume of each element constituting an electromagnetic interference filter module, implement a single modularization of a compact structure. The filter module can also improve electromagnetic interference noise reduction performance and a manufacturing method thereof.
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公开(公告)号：US11901108B2
公开(公告)日：2024-02-13
申请号：US16953365
申请日：2020-11-20
发明人： Jin-Fa Zhang , Hai-Jun Yang , Zhong-Wei Ke , Kai Dong , Shuai-Lin Du
IPC分类号： H01F27/28 , H05K7/20 , H05K1/18 , H05K1/14 , H01F17/04 , H02M1/42 , H01F17/00 , H02M1/00 , H02M3/00 , H02M3/335
CPC分类号： H01F27/2804 , H01F17/04 , H01F27/28 , H02M1/4225 , H05K1/141 , H05K1/181 , H05K7/20909 , H01F2017/0093 , H02M1/0085 , H02M3/003 , H02M3/01 , H02M3/33573 , H05K2201/045 , H05K2201/1003 , H05K2201/1006
摘要： A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.
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公开(公告)号：US11894195B2
公开(公告)日：2024-02-06
申请号：US17521500
申请日：2021-11-08
申请人： TDK CORPORATION
发明人： Yoji Tozawa , Masashi Shimoyasu , Makoto Yoshino , Takuo Abe , Akihiko Oide , Tsutomu Ono , Shinichi Sato , Makoto Morita , Shinichi Sato , Hidekazu Sato
IPC分类号： H01F27/32 , H01F27/29 , H01G4/232 , H01G4/252 , H01G13/00 , H05K1/03 , H01B1/22 , H01G4/30 , H03H7/42 , H01F17/00 , H01G4/12 , H03H1/00 , H05K3/34
CPC分类号： H01G4/2325 , H01B1/22 , H01F17/0013 , H01F27/29 , H01F27/292 , H01F27/32 , H01F27/324 , H01G4/232 , H01G4/252 , H01G4/30 , H01G13/006 , H03H7/427 , H05K1/0306 , H01F2017/0066 , H01F2017/0093 , H01G4/12 , H03H2001/0057 , H03H2001/0085 , H05K3/3442 , H05K2201/1006 , H05K2201/10636
摘要： An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
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公开(公告)号：US11839028B2
公开(公告)日：2023-12-05
申请号：US17464309
申请日：2021-09-01
申请人： Sidus Space, Inc.
发明人： Valerij Ojdanic
CPC分类号： H05K1/181 , B64D43/00 , H05K7/1427 , H05K2201/1003 , H05K2201/1006
摘要： A filter unit is provided to retrofit within signal lines that couple analog cockpit gauges to transducers in rotorcraft systems. The filter unit may include a housing assembly and an electromagnetic interference (EMI) filter assembly housed therein. The filter assembly may include a printed circuit board (PCB) having conductive PCB traces and a signal line input connector configured to connect to multiple transducer signal lines. The filter assembly may also include a signal line output connector configured to connect to multiple analog cockpit gauge signal lines and a plurality of common mode chokes electrically connected between the signal line input connector and the signal line output connector. Each common mode choke may be positioned on the PCB so that it does not electrically/magnetically interfere with the other common mode chokes of the plurality of common mode chokes.
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公开(公告)号：US20230380120A1
公开(公告)日：2023-11-23
申请号：US18366008
申请日：2023-08-07
发明人： Kunitoshi HANAOKA
IPC分类号： H05K9/00 , H03H9/00 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/64 , H03H9/72 , H05K1/18 , H05K1/02
CPC分类号： H05K9/0022 , H03H9/0009 , H03H9/02913 , H03H9/0576 , H03H9/059 , H03H9/1085 , H03H9/6483 , H03H9/725 , H05K1/181 , H05K1/023 , H05K2201/10053 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006 , H05K2201/10371
摘要： The radio frequency module includes a mounting board, a first metal member, and a second metal member. The first metal member and the second metal member are disposed on the mounting board. The first metal member has a longitudinal direction along a first direction in plan view from a thickness direction of the mounting board. The second metal member has a longitudinal direction along a second direction in plan view from the thickness direction of the mounting board. The first or second metal member is placed between a first electronic component and a second electronic component. The first metal member has a first recessed portion. The second metal member has a through hole and a second recessed portion. The through hole passes through the second metal member in the direction intersecting with the second direction. The second recessed portion faces and is in contact with the first recessed portion.
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公开(公告)号：US20230344460A1
公开(公告)日：2023-10-26
申请号：US18342743
申请日：2023-06-28
发明人： Masanari MIURA , Kiyoshi AIKAWA , Hiroyuki NAGAMORI , Takanori UEJIMA , Yuji TAKEMATSU , Takahiro YAMASHITA , Ryo WAKABAYASHI , Yoshihiro YOSHIMURA , Takashi HIROSE
IPC分类号： H04B1/40 , H05K1/18 , H05K9/00 , H01L25/16 , H01L23/552
CPC分类号： H04B1/40 , H05K1/181 , H05K9/0022 , H01L25/16 , H01L23/552 , H05K2201/1006 , H05K2201/10015 , H05K2201/1003 , H05K2201/10053 , H05K2201/10371
摘要： A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.
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公开(公告)号：US20230309230A1
公开(公告)日：2023-09-28
申请号：US18298451
申请日：2023-04-11
IPC分类号： H05K1/18 , H01L25/16 , H01L23/552 , H05K9/00 , H01L25/00 , H01L25/065 , H05K3/34 , H05K3/32
CPC分类号： H05K1/18 , H01L23/552 , H01L25/0657 , H01L25/162 , H01L25/50 , H05K3/321 , H05K3/34 , H05K9/0022 , H01L24/16 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053
摘要： The present disclosure is directed to an electronic component module including: a substrate; an electronic component mounted on the substrate; and a sub-module mounted on the substrate, the sub-module including a wiring board, a first electronic component disposed on one of two main surfaces of the wiring board, a second electronic component disposed on the other of the two main surfaces of the wiring board, and a first sealing member that covers the wiring board, the first electronic component, and the second electronic component.
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公开(公告)号：US20230189432A1
公开(公告)日：2023-06-15
申请号：US18164707
申请日：2023-02-06
发明人： Yoichi SAWADA
IPC分类号： H05K1/02
CPC分类号： H05K1/0243 , H05K1/0216 , H05K2201/1006 , H05K2201/10053 , H05K2201/10098
摘要： A high-frequency module includes a module substrate having main surfaces, one or more module components disposed on the main surface, a resin member covering the main surface, and a metal shield layer covering a top surface of each of the resin member and the one or more module components, and set to ground potential. A sub-module component, which is one of the one or more module components, has a sub-module substrate having main surfaces, a first circuit component disposed on the main surface, one or more second circuit components disposed on the main surface, a resin member covering the main surface, and a side surface shield layer covering a side surface of each of the resin member and the sub-module substrate, and set to the ground potential. An end surface on a top surface side of the side surface shield layer contacts the metal shield layer.
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