公开(公告)号：US11929729B2

公开(公告)日：2024-03-12

申请号：US15734202

申请日：2019-04-16

申请人： RF360 SINGAPORE PTE. LTD.

发明人： Markus Schieber

IPC分类号： H03H9/10 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02 ,  H10N30/02 ,  H10N30/06 ,  H10N30/87 ,  H10N30/88

CPC分类号： H03H9/1071 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02086 ,  H03H9/02913 ,  H03H9/1014 ,  H10N30/02 ,  H10N30/06 ,  H10N30/875 ,  H10N30/883

摘要： A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer.

公开(公告)号：US20240039516A1

公开(公告)日：2024-02-01

申请号：US18221122

申请日：2023-07-12

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Rei Goto ,  Atsushi Takano

IPC分类号： H03H9/72 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05

CPC分类号： H03H9/725 ,  H03H3/08 ,  H03H9/02897 ,  H03H9/02913 ,  H03H9/0576

摘要： A multi-layer piezoelectric substrate silicon package comprises a bottom filter including a cap wafer of the bottom filter, and a device wafer of the bottom filter, the cap wafer of the bottom filter and the device wafer of the bottom filter each having a first through silicon via configured to provide an electrical path from a first bottom terminal of the device wafer of the bottom filter to a first top terminal of the cap wafer of the bottom filter.

公开(公告)号：US20190089329A1

公开(公告)日：2019-03-21

申请号：US16193153

申请日：2018-11-16

申请人： Murata Manufacturing Co., Ltd.

发明人： Yohei KONAKA

IPC分类号： H03H9/02 ,  H03H9/00 ,  H03H9/54 ,  H03H9/56 ,  H03H9/64 ,  H03H9/70 ,  H03H9/72 ,  H01Q1/52 ,  H01Q5/328

CPC分类号： H03H9/02913 ,  H01Q1/526 ,  H01Q5/328 ,  H03H9/0009 ,  H03H9/0014 ,  H03H9/02086 ,  H03H9/542 ,  H03H9/568 ,  H03H9/6483 ,  H03H9/706 ,  H03H9/725

摘要： A filter device includes an antenna terminal to be connected to an antenna, first inductors connected between the antenna terminal and a ground potential and defined by parallel divided inductors, and first and second acoustic wave filters commonly connected to the antenna terminal and including second inductors, respectively. The first inductors and the second inductors are electromagnetically coupled to each other mainly in a one-to-one relationship.

公开(公告)号：US20180033737A1

公开(公告)日：2018-02-01

申请号：US15224538

申请日：2016-07-30

申请人： Avago Technologies General IP (Singapore) Pte. Ltd

发明人： Mark Kuhlman

IPC分类号： H01L23/552 ,  H01L25/065 ,  H01L23/498 ,  H01L23/60 ,  H05K1/11 ,  H03H9/02

CPC分类号： H01L23/552 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/60 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73257 ,  H03H9/02913 ,  H03H9/1014 ,  H03H9/1071 ,  H01L2924/00014

摘要： A self-shielded die includes a substrate, an electronic device attached to the substrate, one or more electrical pads disposed on a bottom surface of the substrate, and an electromagnetic interference (EMI) shield formed of at least one electrically conductive material and connected to ground. At least one of the one or more electrical pads is electrically connected to the electronic device. The EMI shield includes a top shield layer, disposed directly on and substantially completely covering a top surface of the substrate opposite the bottom surface of the substrate, and side shield layers substantially completely covering all sides of the substrate, extending between the top surface of the substrate and the bottom surface of the substrate.

公开(公告)号：US20170077900A1

公开(公告)日：2017-03-16

申请号：US15190286

申请日：2016-06-23

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Seung Wook PARK ,  Christian ROMERO ,  Seong Hun NA ,  Tae Sung JEONG

IPC分类号： H03H9/54 ,  H03H3/08 ,  H03H9/72 ,  H03H3/02 ,  H03H9/64 ,  H03H9/70

CPC分类号： H03H9/105 ,  H01L41/23 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02913 ,  H03H9/02992 ,  H03H9/0504 ,  H03H9/059 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/1078 ,  H03H9/1092 ,  H03H9/706 ,  H03H9/725 ,  H01L2924/00012

摘要： An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.

摘要翻译： 声波装置包括：衬底，其包括一个表面，声波发生器和至少一个接地焊盘包括在该表面上; 由绝缘材料形成并沿着声波发生器的圆周设置在基板上的支撑部件; 以及屏蔽构件，其电连接到接地焊盘并阻止在声波发生器处的电磁波的接收或发射。

公开(公告)号：US20120326808A1

公开(公告)日：2012-12-27

申请号：US13576653

申请日：2011-02-14

申请人： Guillermo Moreno Granado ,  Jürgen Kiwitt ,  Maximilian Pitschi ,  Tilo Gärtner

发明人： Guillermo Moreno Granado ,  Jürgen Kiwitt ,  Maximilian Pitschi ,  Tilo Gärtner

IPC分类号： H03H9/25

CPC分类号： H03H9/02874 ,  H03H9/02913 ,  H03H9/02952 ,  H03H9/02992 ,  H03H9/6493

摘要： The invention relates to a micro-acoustic filter having a first and a second converter, in which the electromagnetic and capacitive cross-talk between the first and second converters is compensated for by providing additional coupling capacitors and additional current loops. Additional coupling capacitors and current loops are arranged in such a manner that they can counteract the sign of the natural coupling specified by the design and thus completely compensate for said coupling.

摘要翻译： 本发明涉及一种具有第一和第二转换器的微声滤波器，其中第一和第二转换器之间的电磁和电容串扰通过提供额外的耦合电容器和附加的电流回路被补偿。 额外的耦合电容器和电流回路以这样的方式布置，使得它们可以抵消由设计指定的自然耦合的符号，从而完全补偿所述耦合。

公开(公告)号：US08138858B1

公开(公告)日：2012-03-20

申请号：US12260703

申请日：2008-10-29

申请人： Jayanti Jaganatha Rao ,  Aleh Loseu ,  Kevin J. Gamble

发明人： Jayanti Jaganatha Rao ,  Aleh Loseu ,  Kevin J. Gamble

IPC分类号： H03H9/64

CPC分类号： H03H9/6459 ,  H03H9/02913 ,  H03H9/64

摘要： The present invention relates to dual-mode SAW devices (DMSDs), which may allow for clean layouts of SAW device elements and provide low impedance with reduced insertion loss, and may increase broadband rejection by improving parasitic characteristics. In one embodiment of the present invention, a parallel set of DMSDs is cascaded with another parallel set of DMSDs. Internal connections between the four DMSDs may be electrically floating, which may further improve parasitic characteristics. With electrically floating internal connections, the parallel set of DMSDs may share a common grating structure, thereby reducing the size and complexity of a DMSD, which may further improve parasitic characteristics. The DMSDs may be used in radio frequency (RF) applications, such as SAW filters.

摘要翻译： 本发明涉及双模SAW器件（DMSD），其可以允许SAW器件元件的清洁布局并且提供具有降低的插入损耗的低阻抗，并且可以通过改善寄生特性来增加宽带抑制。 在本发明的一个实施例中，并行的一组DMSD与另一个并行的一组DMSD级联。 四个DMSD之间的内部连接可以是电浮动的，这可进一步改善寄生特性。 通过电浮动内部连接，DMSD的并行组可以共享公共的光栅结构，从而减小DMSD的尺寸和复杂性，这可以进一步改善寄生特性。 DMSD可用于射频（RF）应用中，例如SAW滤波器。

公开(公告)号：US20090261921A1

公开(公告)日：2009-10-22

申请号：US12392622

申请日：2009-02-25

申请人： Akira MORIYA ,  Yasufumi Kaneda ,  Osamu Kawachi

发明人： Akira MORIYA ,  Yasufumi Kaneda ,  Osamu Kawachi

IPC分类号： H03H9/54 ,  H03H9/64 ,  H03H7/42

CPC分类号： H03H9/0076 ,  H03H9/02913 ,  H03H9/1092

摘要： A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned.

摘要翻译： 平衡滤波器包括连接在单个不平衡端子和两个平衡端子之间的两个声波滤波器，以及经由第一互连部分和第二互连部分连接到两个声波滤波器的接地端子。 第一互连部分连接到两个声波滤波器，并且第二互连部分在位于两个声波滤波器之间的区域中连接到第一互连部分，并且在与两个声波滤波器的方向正交的方向上延伸 声波滤波器对齐。

公开(公告)号：US07477117B2

公开(公告)日：2009-01-13

申请号：US10559508

申请日：2004-04-16

申请人： Maximilian Pitschi ,  Matthias Jungkunz

发明人： Maximilian Pitschi ,  Matthias Jungkunz

IPC分类号： H03H9/00

CPC分类号： H03H9/0057 ,  H03H9/0061 ,  H03H9/0071 ,  H03H9/0076 ,  H03H9/02913 ,  H03H9/14588

摘要： A surface acoustic wave (SAW) filter includes a piezoelectric substrate, and acoustic tracks on the piezoelectric substrate. The acoustic tracks are adjacent and electrically interconnected. The acoustic tracks include electro-acoustic transducers. The electro-acoustic transducers include an input transducer and an output transducer. The SAW filter also includes a shielding structure that is metallic and that is connected to ground. The shielding structure is between the acoustic tracks. The shielding structure shields a first electro-acoustic transducer in a first acoustic track from a second electro-acoustic transducer in a second acoustic track.

摘要翻译： 表面声波（SAW）滤波器包括压电基片和压电基片上的声轨。 声轨相邻并电互连。 声轨包括电声换能器。 电声换能器包括输入换能器和输出换能器。 SAW滤波器还包括金属的并且连接到地面的屏蔽结构。 屏蔽结构位于声轨之间。 屏蔽结构将第一声轨道中的第一电声换能器与第二声道中的第二电声换能器屏蔽。

公开(公告)号：US07292122B2

公开(公告)日：2007-11-06

申请号：US10992116

申请日：2004-11-19

申请人： Hiroshi Kanasaki ,  Osamu Kawachi

发明人： Hiroshi Kanasaki ,  Osamu Kawachi

IPC分类号： H03H9/64

CPC分类号： H03H9/0028 ,  H03H9/0038 ,  H03H9/0042 ,  H03H9/0057 ,  H03H9/0061 ,  H03H9/0071 ,  H03H9/02874 ,  H03H9/02913

摘要： A surface acoustic wave (SAW) filter includes a piezoelectric substrate, a first interdigital transducer (IDT) for input and a second IDT for output that are provided on the piezoelectric substrate, the first IDT and the second IDT being arranged in a propagation direction, and a shield electrode arranged between the first IDT and the second IDT and/or between interconnection lines that connect the first IDT and the second IDT, at least one of the first IDT and the second IDT being of a longitudinal coupling multi-mode type having a balanced operation. Thus, it is possible to suppress a stray capacitance between the first IDT and the second IDT, and thereby to improve the symmetry of balanced operation signals.

摘要翻译： 表面声波（SAW）滤波器包括压电基片，用于输入的第一指叉式换能器（IDT）和设置在压电基片上的第二输出IDT，第一IDT和第二IDT沿传播方向布置， 以及设置在所述第一IDT和所述第二IDT之间和/或连接所述第一IDT和所述第二IDT的互连线之间的屏蔽电极，所述第一IDT和所述第二IDT中的至少一个是纵向耦合多模式， 平衡的操作。 因此，可以抑制第一IDT和第二IDT之间的杂散电容，从而提高平衡操作信号的对称性。