公开(公告)号：US20240196749A1

公开(公告)日：2024-06-13

申请号：US18553066

申请日：2022-03-24

Applicant: Council of Scientific and Industrial Research

Inventor： Mousumi Majumder ,  Swati Samanta ,  Mousumi Baral Narjinary

IPC: H10N30/077 ,  H10N30/02 ,  H10N30/06 ,  H10N30/081 ,  H10N30/092 ,  H10N30/30

CPC classification number: H10N30/077 ,  H10N30/02 ,  H10N30/06 ,  H10N30/081 ,  H10N30/092 ,  H10N30/302

Abstract: The present invention provides a process for the fabrication of a flexible strain and pressure sensor using a synergistic composition of ZnO nanoparticle and graphene nanoplatelets. The substrate used is PDMS, a polymer that imparts the desired properties of flexibility and durability to the sensor. The invention also discloses a simple and facile process of sensor fabrication, wherein the sensing element is embedded in the substrate material, and thereby prevents any deformation or peeling even after repeated stretch/release cycles. The reported flexible sensors can replace the conventional stiff sensors due to their ability to be contoured on curved surfaces, such as body parts. These sensors can find applications in wearable electronics and can have myriad of uses in healthcare monitoring, human-machine interface, electronic skin on prosthetics, and so on.

公开(公告)号：US11929729B2

公开(公告)日：2024-03-12

申请号：US15734202

申请日：2019-04-16

Applicant: RF360 SINGAPORE PTE. LTD.

Inventor： Markus Schieber

IPC: H03H9/10 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02 ,  H10N30/02 ,  H10N30/06 ,  H10N30/87 ,  H10N30/88

CPC classification number: H03H9/1071 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02086 ,  H03H9/02913 ,  H03H9/1014 ,  H10N30/02 ,  H10N30/06 ,  H10N30/875 ,  H10N30/883

Abstract: A wafer level package comprises a functional wafer with a first surface, device structures connected to device pads arranged on the first surface. A cap wafer, having an inner and an outer surface, is bonded with the inner surface to the first surface of the functional wafer. A frame structure surrounding the device structures is arranged between functional wafer and cap wafer. Connection posts are connecting the device pads on the first surface to inner cap pads on the inner surface. Electrically conducting vias are guided through the cap wafer connecting inner cap pads on the inner surface and package pads on the outer surface of the cap wafer.

公开(公告)号：US11867317B1

公开(公告)日：2024-01-09

申请号：US18547602

申请日：2021-10-26

Applicant: LINTEC CO., LTD.

Inventor： Hirofumi Ono ,  Kenta Yamamoto

IPC: F16K7/14 ,  F16K31/00 ,  H10N30/88 ,  H10N30/02

CPC classification number: F16K7/14 ,  F16K31/004 ,  H10N30/02 ,  H10N30/88

Abstract: A flow rate control valve includes a base block and a valve opening/closing mechanism. The base block is provided with a valve chamber in which a valve seat through which a liquid raw material L flows, and a diaphragm that is brought into contact with or separated from the valve seat so as to close/open the valve seat are installed. The valve opening/closing mechanism includes a slide bearing part, a support post part, a piezoelectric actuator part, and a valve-actuating part. The slide bearing part is installed on the base block 1 and is provided with a bearing. The support post part includes a support post that is inserted slidably in the bearing and that moves upward and downward in a diaphragm direction.

公开(公告)号：US20230270016A1

公开(公告)日：2023-08-24

申请号：US18020284

申请日：2021-07-23

Applicant: TDK Electronics AG

Inventor： Sandro Kappert ,  Stefan Sax ,  Dominik Taferner

IPC: H10N30/88 ,  H10N30/02 ,  H10N30/30 ,  H10N30/857

CPC classification number: H10N30/883 ,  H10N30/02 ,  H10N30/302 ,  H10N30/857

Abstract: --A piezoelectric transducer including a piezoelectric element and an encapsulation which encloses the piezoelectric element. The encapsulation is configured to set the electro-mechanical properties of the transducer. For example, the hardness of a material of the encapsulation and/or or the geometry of the encapsulation is suitably selected.--

公开(公告)号：US20230163743A1

公开(公告)日：2023-05-25

申请号：US18157881

申请日：2023-01-23

Applicant: Akoustis, Inc.

Inventor： Jeffrey B. Shealy ,  Mary Winters ,  Craig Moe

IPC: H03H3/02 ,  H03H9/13 ,  H03H9/17 ,  H03H9/10 ,  H03H9/05 ,  H03H9/02 ,  H03H9/54 ,  H10N30/02 ,  H10N30/06 ,  H10N30/077 ,  H10N30/85 ,  H10N30/086 ,  H10N30/88 ,  H10N30/87 ,  H10N30/00

CPC classification number: H03H3/02 ,  H03H9/13 ,  H03H9/105 ,  H03H9/173 ,  H03H9/175 ,  H03H9/177 ,  H03H9/0523 ,  H03H9/547 ,  H03H9/02015 ,  H03H9/02118 ,  H10N30/02 ,  H10N30/06 ,  H10N30/077 ,  H10N30/85 ,  H10N30/086 ,  H10N30/88 ,  H10N30/875 ,  H10N30/877 ,  H10N30/10513 ,  H03H2003/021 ,  H03H2003/025 ,  H10N30/072 ,  Y10T29/42

Abstract: An RF integrated circuit device can includes a substrate and a High Electron Mobility Transistor (HEMT) device on the substrate including a ScAlN layer configured to provide a buffer layer of the HEMT device to confine formation of a 2DEG channel region of the HEMT device. An RF piezoelectric resonator device can be on the substrate including the ScAlN layer sandwiched between a top electrode and a bottom electrode of the RF piezoelectric resonator device to provide a piezoelectric resonator for the RF piezoelectric resonator device.

公开(公告)号：US20240107887A1

公开(公告)日：2024-03-28

申请号：US18473362

申请日：2023-09-25

Applicant: SEIKO EPSON CORPORATION

Inventor： Toshiki KANAI ,  Kenichi KUROKAWA ,  Yukio YAMAUCHI

IPC: H10N30/06 ,  H10N30/02

CPC classification number: H10N30/06 ,  H10N30/02

Abstract: A method for manufacturing a device including an active layer and a support substrate bonded to the active layer on one surface side, the active layer including an element, an electrode configured to drive the element, a frame portion disposed around the element, and an electrode pad disposed in the frame portion and coupled to the electrode, the method including: forming a protective film at the other surface side of the frame portion and the other surface side of the element, the protective film being resistant to an etchant and including a first opening portion formed between an outer shape of the element and the frame portion and a second opening portion formed on the electrode pad; and forming a space between the element and the support substrate by etching the support substrate with the etchant passing through the first opening portion.

公开(公告)号：US11884537B2

公开(公告)日：2024-01-30

申请号：US17201661

申请日：2021-03-15

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC: B81B7/00 ,  B81C1/00 ,  H10N30/02 ,  H10N30/88

CPC classification number: B81B7/0077 ,  B81C1/00269 ,  H10N30/02 ,  H10N30/88 ,  B81B2203/0315 ,  B81C2203/0109 ,  B81C2203/032

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20240032197A1

公开(公告)日：2024-01-25

申请号：US18357852

申请日：2023-07-24

Applicant: Eric Oleg Bodnar ,  Jacob Van Reenen Pretorius

Inventor： Eric Oleg Bodnar ,  Jacob Van Reenen Pretorius

IPC: H05K1/14 ,  H10N30/87 ,  H10N30/00 ,  H10N30/02

CPC classification number: H05K1/147 ,  H10N30/87 ,  H10N30/00 ,  H10N30/02 ,  G01D11/245

Abstract: A thin, flexible computerized sensing platform which can be affixed to a structure to be sensed, which has excellent mechanical coupling between the sensors and the object to be sensed, which can be self-powered and rechargeable, and which can be environmentally sealed, and a method for assembling and utilizing the same.

公开(公告)号：US11690593B2

公开(公告)日：2023-07-04

申请号：US16499359

申请日：2018-03-30

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Dino Francesco Cuscuna ,  Elizabeth Brunelle ,  Loriann Davidsen ,  Martha Gail Grewe Wilson ,  Jeffrey Scott Hart ,  Harry Amon Kunkel, III ,  Gerred Allen Price ,  James William Hackenberry

IPC: A61B8/00 ,  H10N30/02 ,  H10N30/08 ,  H10N30/09 ,  H10N30/88

CPC classification number: A61B8/4281 ,  A61B8/4444 ,  H10N30/02 ,  H10N30/08 ,  H10N30/09 ,  H10N30/88

Abstract: An ultrasound probe has an acoustic window (10) or lens (20) through which ultrasound is transmitted and received by a transducer array (30) located behind the lens or window inside a probe enclosure. The external, patient-contacting surface (24) of the acoustic lens or window is textured. The texturing of the surface of the lens or window better retains gel spread over the lens or window for an ultrasound procedure, reduces reverberation artifacts, and diminishes the appearance of scratches on the lens or window.

公开(公告)号：US11646710B2

公开(公告)日：2023-05-09

申请号：US17865092

申请日：2022-07-14

Applicant: Akoustis, Inc.

Inventor： Dae Ho Kim ,  Mary Winters ,  Ramakrishna Vetury ,  Jeffrey B. Shealy

IPC: H03H3/02 ,  H03H9/10 ,  H03H9/13 ,  H03H9/17 ,  H03H9/54 ,  H03H9/02 ,  H03H9/05

CPC classification number: H03H3/02 ,  H03H9/02015 ,  H03H9/02118 ,  H03H9/0523 ,  H03H9/105 ,  H03H9/13 ,  H03H9/173 ,  H03H9/175 ,  H03H9/177 ,  H03H9/547 ,  H10N30/02 ,  H10N30/06 ,  H10N30/077 ,  H10N30/086 ,  H10N30/10513 ,  H10N30/85 ,  H10N30/875 ,  H10N30/877 ,  H10N30/88 ,  H03H2003/021 ,  H03H2003/025 ,  Y10T29/42

Abstract: A bulk acoustic wave (BAW) resonator includes a solidly mounted reflector, for example, a Bragg-type reflector, a piezoelectric layer, and first and second electrodes on first and second surfaces, respectively, of the piezoelectric layer. A filter device or filter system includes at least one BAW resonator. Related methods of fabrication include forming the BAW resonator.