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1.发明公开公开(公告)号：US20230163743A1
公开(公告)日：2023-05-25
申请号：US18157881
申请日：2023-01-23
Applicant: Akoustis, Inc.
Inventor： Jeffrey B. Shealy , Mary Winters , Craig Moe
IPC: H03H3/02 , H03H9/13 , H03H9/17 , H03H9/10 , H03H9/05 , H03H9/02 , H03H9/54 , H10N30/02 , H10N30/06 , H10N30/077 , H10N30/85 , H10N30/086 , H10N30/88 , H10N30/87 , H10N30/00
CPC classification number: H03H3/02 , H03H9/13 , H03H9/105 , H03H9/173 , H03H9/175 , H03H9/177 , H03H9/0523 , H03H9/547 , H03H9/02015 , H03H9/02118 , H10N30/02 , H10N30/06 , H10N30/077 , H10N30/85 , H10N30/086 , H10N30/88 , H10N30/875 , H10N30/877 , H10N30/10513 , H03H2003/021 , H03H2003/025 , H10N30/072 , Y10T29/42
Abstract: An RF integrated circuit device can includes a substrate and a High Electron Mobility Transistor (HEMT) device on the substrate including a ScAlN layer configured to provide a buffer layer of the HEMT device to confine formation of a 2DEG channel region of the HEMT device. An RF piezoelectric resonator device can be on the substrate including the ScAlN layer sandwiched between a top electrode and a bottom electrode of the RF piezoelectric resonator device to provide a piezoelectric resonator for the RF piezoelectric resonator device.
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公开(公告)号：US20180254764A1
公开(公告)日：2018-09-06
申请号：US15797265
申请日：2017-10-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Kyung LEE , Won HAN , Tae Yoon KIM , Jong Woon KIM , Moon Chul LEE , Chang Hyun LIM , Sang Kee YOON , Hwa Sun LEE , Dae Hun JEONG
CPC classification number: H03H9/174 , H03H3/02 , H03H9/02118 , H03H9/0504 , H03H9/173 , H03H9/547 , H03H2003/021 , H03H2003/023
Abstract: An acoustic resonator includes: a central portion; an extension portion extended outwardly of the central portion; a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a substrate, in the central portion; and an insertion layer disposed below the piezoelectric layer in the extension portion, wherein the piezoelectric layer includes a piezoelectric portion disposed in the central portion, and a bent portion disposed in the extension portion and extended from the piezoelectric portion at an incline depending on a shape of the insertion layer.
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公开(公告)号：US20180226947A1
公开(公告)日：2018-08-09
申请号：US15810675
申请日：2017-11-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Won Jin BAEK , Sung Tae KIM , Jung Woo SUNG
Abstract: A filter comprises a series unit, and a shunt unit disposed between the series unit and a ground. The shunt unit includes resonators that are selectively operated, and each of the shunt resonators includes a film bulk acoustic resonator.
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公开(公告)号：US20180062608A1
公开(公告)日：2018-03-01
申请号：US15647660
申请日：2017-07-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Kyung LEE , Tae Yoon KIM , Dae Ho KIM , Chang Hyun LIM , Tae Hun LEE , Sang Kee YOON , Jong Woon KIM , Won HAN , Moon Chul LEE
IPC: H03H9/02 , H03H9/54 , H01L41/047 , H03H9/56
CPC classification number: H03H9/02015 , H01L41/047 , H03H3/02 , H03H9/02062 , H03H9/02118 , H03H9/02157 , H03H9/173 , H03H9/542 , H03H9/545 , H03H9/547 , H03H9/562 , H03H9/568 , H03H9/605 , H03H2003/021
Abstract: A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170 Å or less.
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公开(公告)号：US09698839B2
公开(公告)日：2017-07-04
申请号：US15006540
申请日：2016-01-26
Applicant: RF Micro Devices, Inc.
Inventor： Nadim Khlat
CPC classification number: H04B1/1027 , H03H9/54 , H03H9/542 , H03H9/547 , H03H9/6409 , H03H2009/02165 , H03H2210/012 , H03H2210/025 , H04B1/1036 , H04B2001/1063
Abstract: Circuitry includes an input node, an output node, acoustic filtering circuitry, an inductive element, and a capacitor. The acoustic filtering circuitry includes an acoustic filtering input node and an acoustic filtering output node. The inductive element is coupled in series with the acoustic filtering circuitry between the input node and the output node such that the inductive element is coupled between the input node and the acoustic filtering input node and the acoustic filtering output node is coupled to the output node. The capacitor is coupled in parallel with the acoustic filtering circuitry and the inductive element between the input node and the output node. Providing the inductive element in series with the acoustic filtering circuitry and the capacitor in parallel with the acoustic filtering circuitry and the inductive element provides a highly selective notch filter response between the input node and the output node with high attenuation.
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Patent Agency Ranking
公开(公告)号：US09577606B2
公开(公告)日：2017-02-21
申请号：US14466885
申请日：2014-08-22
Applicant: EPCOS AG
Inventor： Andreas Link , Bernhard Bader
CPC classification number: H03H9/706 , H01Q1/50 , H03H7/38 , H03H9/547 , H03H9/605 , H03H9/6409 , H03H9/6483 , H03H9/725
Abstract: A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter.
Abstract translation: 双工器包括天线端子，发送放大器端子和接收放大器端子。 发送放大器端子经由发送滤波器耦合到天线端子。 接收放大器端子耦合到接收滤波器，并且接收滤波器经由带阻滤波器耦合到天线端子。
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公开(公告)号：US20160352368A1
公开(公告)日：2016-12-01
申请号：US15006540
申请日：2016-01-26
Applicant: RF Micro Devices, Inc.
Inventor： Nadim Khlat
CPC classification number: H04B1/1027 , H03H9/54 , H03H9/542 , H03H9/547 , H03H9/6409 , H03H2009/02165 , H03H2210/012 , H03H2210/025 , H04B1/1036 , H04B2001/1063
Abstract: Circuitry includes an input node, an output node, acoustic filtering circuitry, an inductive element, and a capacitor. The acoustic filtering circuitry includes an acoustic filtering input node and an acoustic filtering output node. The inductive element is coupled in series with the acoustic filtering circuitry between the input node and the output node such that the inductive element is coupled between the input node and the acoustic filtering input node and the acoustic filtering output node is coupled to the output node. The capacitor is coupled in parallel with the acoustic filtering circuitry and the inductive element between the input node and the output node. Providing the inductive element in series with the acoustic filtering circuitry and the capacitor in parallel with the acoustic filtering circuitry and the inductive element provides a highly selective notch filter response between the input node and the output node with high attenuation.
Abstract translation: 电路包括输入节点，输出节点，声学滤波电路，电感元件和电容器。 声学滤波电路包括声学滤波输入节点和声学滤波输出节点。 感应元件与输入节点和输出节点之间的声学滤波电路串联耦合，使得感应元件耦合在输入节点和声学滤波输入节点之间，声学滤波输出节点耦合到输出节点。 电容器与输入节点和输出节点之间的声学滤波电路和电感元件并联耦合。 提供与声学滤波电路和电容器串联的电感元件与声学滤波电路和电感元件并联提供输入节点和具有高衰减的输出节点之间的高选择性陷波滤波器响应。
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公开(公告)号：US09484887B2
公开(公告)日：2016-11-01
申请号：US13726668
申请日：2012-12-26
Applicant: Telefonaktiebolaget L M Ericsson (publ)
Inventor： Chunyun Jian , Somsack Sychaleun
CPC classification number: H03H9/6409 , H01L2224/48091 , H01L2224/49113 , H03H3/02 , H03H3/08 , H03H9/0514 , H03H9/0542 , H03H9/059 , H03H9/08 , H03H9/542 , H03H9/547 , H03H9/605 , H03H9/6423 , H03H9/6426 , H03H9/6483 , H03H2009/0019 , Y10T29/42 , H01L2924/00014
Abstract: A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.
Abstract translation: 公开了一种声波阻带滤波器的方法和系统。 根据一个方面，声波波段抑制滤波器包括基板和多个声波波段滤波器块。 衬底包括形成在衬底上的接合焊盘。 多个声波波段滤波器块中的每一个固定在单独的管芯上。 每个单独的模具在面向基板的模具的一侧上具有焊球。 焊球被定位成将形成在衬底上的焊盘电连接到每个裸片上的位置。
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9.发明申请Method, System, and Apparatus for Resonator Circuits and Modulating Resonators 有权用于谐振器电路和调制谐振器的方法，系统和装置公开(公告)号：US20160020750A1
公开(公告)日：2016-01-21
申请号：US14720613
申请日：2015-05-22
Applicant: Peregrine Semiconductor Corporation
Inventor： Mark L. Burgener , James S. Cable
CPC classification number: H03H9/54 , H03H7/40 , H03H7/48 , H03H9/542 , H03H9/547 , H03H9/64 , H03H9/6403 , H03H9/6409 , H03H9/6483 , H03H9/6489 , H03H9/706 , H03H9/725 , H03H2009/02204 , H03H2210/015 , H03H2210/025 , H03H2210/036 , H03H2210/04 , H03H2240/00 , H03H2250/00 , H03J2200/10
Abstract: Embodiments of resonator circuits and modulating resonators and are described generally herein. One or more acoustic wave resonators may be coupled in series or parallel to generate tunable filters. One or more acoustic wave resonances may be modulated by one or more capacitors or tunable capacitors. One or more acoustic wave modules may also be switchable in a filter. Other embodiments may be described and claimed.
Abstract translation: 谐振器电路和调制谐振器的实施例并在本文中一般地描述。 一个或多个声波谐振器可以串联或并联耦合以产生可调谐滤波器。 一个或多个声波谐振可以由一个或多个电容器或可调谐电容器调制。 一个或多个声波模块也可以在滤波器中切换。 可以描述和要求保护其他实施例。
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10.发明授权Method, system, and apparatus for resonator circuits and modulating resonators 有权用于谐振器电路和调制谐振器的方法，系统和装置公开(公告)号：US09041484B2
公开(公告)日：2015-05-26
申请号：US13316243
申请日：2011-12-09
Applicant: Mark L. Burgener , James S. Cable
Inventor： Mark L. Burgener , James S. Cable
CPC classification number: H03H9/54 , H03H7/40 , H03H7/48 , H03H9/542 , H03H9/547 , H03H9/64 , H03H9/6403 , H03H9/6409 , H03H9/6483 , H03H9/6489 , H03H9/706 , H03H9/725 , H03H2009/02204 , H03H2210/015 , H03H2210/025 , H03H2210/036 , H03H2210/04 , H03H2240/00 , H03H2250/00 , H03J2200/10
Abstract: Embodiments of resonator circuits and modulating resonators and are described generally herein. One or more acoustic wave resonators may be coupled in series or parallel to generate tunable filters. One or more acoustic wave resonances may be modulated by one or more capacitors or tunable capacitors. One or more acoustic wave modules may also be switchable in a filter. Other embodiments may be described and claimed.
Abstract translation: 谐振器电路和调制谐振器的实施例并在本文中一般地描述。 一个或多个声波谐振器可以串联或并联耦合以产生可调谐滤波器。 一个或多个声波谐振可以由一个或多个电容器或可调谐电容器调制。 一个或多个声波模块也可以在滤波器中切换。 可以描述和要求保护其他实施例。
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