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公开(公告)号：US20240356531A1
公开(公告)日：2024-10-24
申请号：US18639846
申请日：2024-04-18
发明人： Alexandre Augusto Shirakawa , Kwang Jae Shin , Jae Hyung Lee , Taecheol Shon , David Albert Feld , Zongliang Cao
CPC分类号： H03H9/58 , H03H9/0211 , H03H9/133 , H03H9/542 , H04B1/38
摘要： Aspects of this disclosure relate to a filter that includes a bulk acoustic wave resonator and a capacitor in parallel with the bulk acoustic wave resonator. The bulk acoustic wave resonator can include a first electrode, a second electrode, a piezoelectric layer positioned between the first electrode and the second electrode, and an acoustic reflector positioned between the first electrode and a substrate. The capacitor can include an electrode buried in a dielectric layer that is over the substrate. Related multiplexers, radio frequency modules, radio frequency systems, wireless communication devices, and methods are disclosed.
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公开(公告)号：US12119808B2
公开(公告)日：2024-10-15
申请号：US17082945
申请日：2020-10-28
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
CPC分类号： H03H9/25 , H03H9/02228 , H03H9/02992 , H03H9/105 , H03H9/1085 , H03H9/586 , H03H9/6406
摘要： Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer has layers of a LTCC circuit card, at least one layer of the tape comprising printed conductors. A plurality of conductive balls directly bonds the first plurality of contact pads formed on the plate to respective contact pads of the second plurality of contact pads formed on the interposer.
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公开(公告)号：US12063026B2
公开(公告)日：2024-08-13
申请号：US18151704
申请日：2023-01-09
发明人： Joshua James Caron , Rei Goto
CPC分类号： H03H9/02228 , H03H9/02031 , H03H9/02102 , H03H9/0561 , H03H9/132 , H03H9/205 , H03H9/58
摘要： A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a first solid acoustic mirror, a second solid acoustic mirror, a piezoelectric layer that is positioned between the first solid acoustic mirror and the second solid acoustic mirror, an interdigital transducer electrode on the piezoelectric layer, and a support substrate arranged to dissipate heat associated with the bulk acoustic wave. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave. The first solid acoustic mirror and the second solid acoustic mirror are arranged to confine acoustic energy of the bulk acoustic wave. The first solid acoustic mirror is positioned on the support substrate.
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公开(公告)号：US20240120898A1
公开(公告)日：2024-04-11
申请号：US18546074
申请日：2022-02-10
发明人： Zilan LI , Lexhi WANG
CPC分类号： H03H9/02047 , H03H9/02031 , H03H9/133 , H03H9/173 , H03H9/175 , H03H9/176 , H03H9/581
摘要： A filter (100) includes a piezoelectric layer (105); a first electrode (108), disposed at a first vertical face of the piezoelectric layer (105) and configured to receive an electric signal; and a second electrode (109), disposed at a second vertical face of the piezoelectric layer (105) and configured to output an electric signal, where the first vertical face and the second vertical face are two opposite sides of the piezoelectric layer (105).
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公开(公告)号：US20240106413A1
公开(公告)日：2024-03-28
申请号：US18527826
申请日：2023-12-04
CPC分类号： H03H9/58 , H05K1/0243 , H05K2201/1003 , H05K2201/1006 , H05K2201/10098
摘要： The deterioration in characteristics of a filter is reduced. In a high frequency module, the filter includes a first substrate, a first functional electrode provided on the first substrate and forming a part of an antenna end resonator, a second substrate separate from the first substrate, and a second functional electrode provided on the second substrate and forming a part of at least one acoustic wave resonator other than the antenna end resonator among a plurality of acoustic wave resonators. A first electronic component including the first substrate and the first functional electrode is disposed on the first main surface of the mounting substrate. An inductor is adjacent to the first electronic component in a plan view from a thickness direction of the mounting substrate. The inductor does not overlap the antenna end resonator in a side view from a direction of a winding axis of a winding portion.
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公开(公告)号：US20240039501A1
公开(公告)日：2024-02-01
申请号：US18257274
申请日：2022-09-07
发明人： Xiaodong WANG , Chenggong HE , Chengjie ZUO , Jun HE
CPC分类号： H03H7/0161 , H03H7/0115 , H03H9/581
摘要： Provided are a band-pass filter circuit and a multiplexer. The band-pass filter circuit includes an electromagnetic LC filter circuit and acoustic resonance units. At least one of the acoustic resonance units each includes at least one first acoustic resonator and at least one second acoustic resonator. The first acoustic resonator is connected in series between the band-pass filter circuit and the electromagnetic LC filter circuit. Each of the at least one second acoustic resonator is connected to a terminal of the at least one first acoustic resonator, where the first terminal of the band-pass filter circuit serves as an input terminal or output terminal of the band-pass filter circuit. One or more of the acoustic resonance units are connected on an input side of the electromagnetic LC filter circuit; and the remaining of the acoustic resonance units are connected on an output side of the electromagnetic LC filter circuit.
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公开(公告)号：US11753898B2
公开(公告)日：2023-09-12
申请号：US17823943
申请日：2022-08-31
发明人： Randall S. Shafer
IPC分类号： E21B33/134 , E21B29/00 , E21B33/12 , H03H9/54 , H03H9/58 , H03H9/60 , H03H9/64 , H03H9/70 , H03H9/72 , E21B36/00
CPC分类号： E21B33/134 , E21B29/00 , E21B33/1204 , E21B36/00 , E21B36/008 , H03H9/542 , H03H9/582 , H03H9/605 , H03H9/6483 , H03H9/706 , H03H9/725
摘要： A method of plugging a hydrocarbon well includes deploying a downhole tool to remove at least a portion of a casing at a section of well to be plugged. Then a plugging material is put downhole onto a blocking device to fill an area to be plugged. An exothermic fluid is added, wherein activation of the exothermic material liquefies the plugging material. Allowing the plugging material and the exothermic fluid to solidify form a cast-in-place plug that fills the section of well to be plugged.
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公开(公告)号：US20230188115A1
公开(公告)日：2023-06-15
申请号：US18059520
申请日：2022-11-29
发明人： Koichi Hatano
摘要： A ladder type acoustic wave filter is disclosed. The acoustic wave filter can include a plurality of parallel arm resonators and a plurality of series arm resonators, in which an electromechanical coupling coefficient of a parallel arm resonator closest to an input node of the acoustic wave filter among the plurality of parallel arm resonators can be smaller than an electromechanical coupling coefficient of a series arm resonator closest to the input node among the plurality of series arm resonators.
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公开(公告)号：US20230141873A1
公开(公告)日：2023-05-11
申请号：US18096614
申请日：2023-01-13
发明人： Takashi YAMANE , Yuta ISHII
摘要： An acoustic wave device includes a support substrate, a piezoelectric layer on the support substrate, functional electrodes on the piezoelectric layer, and first and second electrode films positioned on the piezoelectric layer to face each other and having different potentials from each other. A thickness of the piezoelectric layer in at least a portion of a first region overlapping the first electrode film in plan view is different from a thickness of the piezoelectric layer in at least a portion of a second region not overlapping the first electrode film in plan view.
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公开(公告)号：US20220029608A1
公开(公告)日：2022-01-27
申请号：US17497889
申请日：2021-10-09
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
摘要： Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate. Portions of the piezoelectric plate form at least first and second diaphragms spanning respective cavities in the substrate. A first conductor pattern on the surface of the piezoelectric plate includes a first plurality of contact pads and at least first and second IDTs with interleaved fingers of each IDT on respective diaphragms. An interposer includes a second plurality of contacts pads. A plurality of conductive balls bond each of the contact pads of the first plurality of contact pads to respective contact pads of the second plurality of contact pads.
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