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公开(公告)号：US20240364371A1
公开(公告)日：2024-10-31
申请号：US18765727
申请日：2024-07-08
发明人： Lui Lam
CPC分类号： H04B1/0458 , H03F3/189 , H03G3/3042 , H03F1/36
摘要： Apparatus and methods for power detection with enhanced dynamic range are provided. In certain embodiments, a front end system includes a power amplifier that amplifies a radio frequency (RF) input signal to generate an RF output signal, a directional coupler that generates a sensed RF signal based on sensing the RF output signal from the power amplifier, and a power detector that processes the sensed RF signal to generate a detection signal indicating an output power of the power amplifier. Additionally, the power detector includes two or more detection paths providing different amounts of gain to the sensed RF signal from the directional coupler.
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公开(公告)号：US20240356540A1
公开(公告)日：2024-10-24
申请号：US18626649
申请日：2024-04-04
发明人： Mackenzie Brian Cook , Lui Ray Lam
IPC分类号： H03K17/10 , H03F3/24 , H03K17/082
CPC分类号： H03K17/102 , H03F3/245 , H03K17/0822 , H03F2200/451
摘要： Aspects and embodiments disclosed herein include a supply circuit for a radio frequency system comprising a first coupling diode coupled between an input node of a first voltage supply and a first input node of a voltage clamp of the supply circuit, an output of the first coupling diode being coupled to the first input node of the voltage clamp, and a second coupling diode coupled between an input node of a second voltage supply and the first input node of the voltage clamp, an output of the second coupling diode being coupled to the input node of the voltage clamp.
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公开(公告)号：US20240356515A1
公开(公告)日：2024-10-24
申请号：US18655853
申请日：2024-05-06
发明人： Rei Goto
CPC分类号： H03H9/02015 , H03H9/02102 , H03H9/0211 , H03H9/02228 , H03H9/205 , H03H9/589
摘要： A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a support substrate, a solid acoustic mirror on the support substrate, a piezoelectric layer on the solid acoustic mirror, and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave.
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公开(公告)号：US20240351955A1
公开(公告)日：2024-10-24
申请号：US18586312
申请日：2024-02-23
发明人： Michael David Hill
IPC分类号： C04B35/626 , C01B13/14 , C01G23/00 , C01G33/00 , C04B35/462 , C04B35/468 , C04B35/499 , H01B3/12
CPC分类号： C04B35/62675 , C01B13/145 , C01G23/003 , C01G33/006 , C04B35/462 , C04B35/4686 , C04B35/499 , C04B35/6262 , H01B3/12 , C01P2002/76 , C01P2006/10 , C01P2006/40 , C04B2235/3215 , C04B2235/3224 , C04B2235/3229 , C04B2235/3251 , C04B2235/72 , C04B2235/76 , C04B2235/77
摘要： Disclosed are methods of forming a dielectric material. One method comprises modifying a tungsten bronze crystal structure by substituting one or more lattice sites with one or more elements selected to increase a quality factor (Q) of the dielectric material.
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公开(公告)号：US12126307B2
公开(公告)日：2024-10-22
申请号：US17445179
申请日：2021-08-16
发明人： Florinel G. Balteanu , Serge Francois Drogi , Robert John Thompson , Shayan Farahvash , David Richard Pehlke , Stephan Henzler
CPC分类号： H03F1/0238 , H03F3/245 , H04B1/40 , H03F2200/105 , H03F2200/165 , H03F2200/451
摘要： Power amplifier modules with controllable envelope tracking noise filters are provided herein. In certain embodiments, an envelope tracking system includes a power amplifier module and an envelope tracker that provides the power amplifier module with a power amplifier supply voltage that changes based on an envelope of a radio frequency (RF) signal amplified by the power amplifier module. The power amplifier module includes a controllable filter that filters the power amplifier supply voltage to provide flexibility in filtering envelope tracking noise.
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公开(公告)号：US20240348281A1
公开(公告)日：2024-10-17
申请号：US18754595
申请日：2024-06-26
发明人： David Richard Pehlke , Anand Raghavan , Poul Olesen , Werner Schelmbauer , Thorsten Tracht , Wolfgang Thomann , Amir Israel Rubin , Assi Jakoby , Ofer Benjamin
IPC分类号： H04B1/525 , H04B1/04 , H04B1/10 , H04B1/12 , H04B7/0413
CPC分类号： H04B1/525 , H04B1/0475 , H04B1/1027 , H04B1/123 , H04B7/0413
摘要： RF communication systems with interference cancellation for coexistence are provided herein. In certain embodiments, a method of interference cancellation includes filtering a radio frequency (RF) transmit signal to generate a first RF feedback signal using a first filter of a front end system, filtering the RF transmit signal to generate a second RF feedback signal using a second filter of the front end system, processing the first RF feedback signal to generate a first digital interference cancellation signal using a first feedback receiver, processing the second RF feedback signal to generate a second digital interference cancellation signal using a second feedback receiver, and compensating an RF receive signal for interference based on the first digital interference cancellation signal and the second digital interference cancellation signal using a receiver.
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公开(公告)号：US20240348280A1
公开(公告)日：2024-10-17
申请号：US18627524
申请日：2024-04-05
发明人： Akshara Kankar , Nan Wu , Yiliu Wang
摘要： Aspects of the disclosure provide a front-end module for a wireless device comprising a front-end module for a wireless device. The front end module includes at least one transmit path configured to receive a first transmit signal, at least one receive path configured to receive a first receive signal, at least one transmit/receive path, coupled to the at least one receive path and the at least one transmit path, an antenna switching module coupled between the at least one transmit/receive path and an antenna port, and a first transmit filter located in the at least one receive path and configured to reduce harmonic content from the first transmit signal.
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公开(公告)号：US20240347475A1
公开(公告)日：2024-10-17
申请号：US18621909
申请日：2024-03-29
IPC分类号： H01L23/552 , H01L23/00 , H01L23/492
CPC分类号： H01L23/552 , H01L23/492 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265
摘要： An integrated device package is disclosed. The integrated device package can include a surface mount technology component that is flip-chip mounted to a carrier. The surface mount technology component can be a gallium arsenide die or a bulk acoustic wave filter. The carrier can be a printed circuit board. The integrated device package can include a metal clip that has a first portion at least partially disposed over the surface mount technology component and a second portion coupled to the carrier. The first portion and the surface mount technology component are spaced apart by a gap. The integrated device package can include an electronic component that is mounted to the first portion of the metal clip.
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公开(公告)号：US12113493B2
公开(公告)日：2024-10-08
申请号：US18053296
申请日：2022-11-07
发明人： Hanseung Lee
CPC分类号： H03F3/245 , H03F1/56 , H03F3/195 , H04B1/50 , H03F2200/294 , H03F2200/318 , H03F2200/387 , H03F2200/423 , H03F2200/451
摘要： A power amplifier module can be formed that includes metamaterial matching circuits. This power amplifier module can be included as part of a front-end module of a wireless device. The front-end module can replace a passive duplexer with an active duplexer that uses the power amplifier module in combination with a low noise amplifier circuit that can include a metamaterial matching circuit. The combination of PA and LNA circuits that utilize metamaterials can provide the functionality of a duplexer without including a stand-alone or passive duplexer. Thus, in certain cases, the front-end module can provide duplexer functionality without including a separate duplexer. Advantageously, in certain cases, the size of the front-end module can be reduced by eliminating the passive duplexer. Further, the loss introduced into the signal path by the passive duplexer is eliminated improving the performance of the communication system that includes the active duplexer.
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公开(公告)号：US12113487B2
公开(公告)日：2024-10-08
申请号：US17930561
申请日：2022-09-08
发明人： Wendy Ng , James Jason LoCascio
CPC分类号： H03F1/305 , H02M1/143 , H02M3/157 , H02M3/158 , H03F3/20 , H03F3/24 , H04B1/04 , H04B1/40 , H03F2200/451
摘要： A power management integrated circuit (PMIC) can improve the ramp up speed of a boost converter with the inclusion of a controllable switch that may modify the connection of an output capacitor to reduce the ramp time as the output voltage is ramping to a desired boost setpoint. The switch may be controlled using jump start logic to switch a first plate or terminal of the output capacitor from a ground connection to a voltage supply connection. Once a threshold voltage is reached, the first plate of the capacitor may be switched from the supply voltage to ground. In certain cases, by switching the connection of the output capacitor between ground and a supply voltage based on one or more threshold voltages or a boost setpoint, the time to ramp from an initial voltage to a desired boost setpoint may be reduced.
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