-
公开(公告)号：US20220029608A1
公开(公告)日：2022-01-27
申请号：US17497889
申请日：2021-10-09
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
摘要： Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate. Portions of the piezoelectric plate form at least first and second diaphragms spanning respective cavities in the substrate. A first conductor pattern on the surface of the piezoelectric plate includes a first plurality of contact pads and at least first and second IDTs with interleaved fingers of each IDT on respective diaphragms. An interposer includes a second plurality of contacts pads. A plurality of conductive balls bond each of the contact pads of the first plurality of contact pads to respective contact pads of the second plurality of contact pads.
-
公开(公告)号：US20210044276A1
公开(公告)日：2021-02-11
申请号：US17082973
申请日：2020-10-28
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
摘要： Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a chip cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer on the diaphragm, and first contact pads. An interposer has walls on its back surface that are attached to the chip front surface and that surround the diaphragm. An interposer cover layer spans the walls creating an enclosed interposer cavity over the diaphragm. A second conductor pattern formed on the walls and cover layer includes second contact pads on the interposer back surface. Electrical connections between the second contact pads and connection points on the chip electrically connect the first contact pads to respective ones of the second contact pads.
-
公开(公告)号：US10819309B1
公开(公告)日：2020-10-27
申请号：US16841134
申请日：2020-04-06
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev , Charles Chung
摘要： Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A ring-shaped seal is form between a perimeter of the piezoelectric plate and a perimeter of the base.
-
公开(公告)号：US20220029606A1
公开(公告)日：2022-01-27
申请号：US17497887
申请日：2021-10-09
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev , Charles Chung
摘要： Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes an interdigital transducer with interleaved fingers on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the acoustic resonator chip and a perimeter of the interposer.
-
公开(公告)号：US20200321939A1
公开(公告)日：2020-10-08
申请号：US16841134
申请日：2020-04-06
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev , Charles Chung
摘要： Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A ring-shaped seal is form between a perimeter of the piezoelectric plate and a perimeter of the base.
-
公开(公告)号：US20220029609A1
公开(公告)日：2022-01-27
申请号：US17497961
申请日：2021-10-10
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
摘要： Methods of making acoustic resonator devices and filters are disclosed. A method of fabricating an acoustic resonator device includes fabricating an acoustic resonator chip including: attaching a back surface of a piezoelectric plate to a front surface of a substrate, such that portions of the piezoelectric plate form at least first and second diaphragms spanning at least first and second cavities, and forming a first conductor pattern as one or more conductor layers on the piezoelectric plate. The first conductor pattern includes at least first and second interdigitated transducers (IDTs) and a first plurality of contact pads. The method further includes fabricating an interposer having front and back surface and a second plurality of contact pads on the interposer back surface, forming conductive balls, and bonding each of the first plurality of contact pads to a respective pad of the second plurality of contact pads using the respective conductive ball.
-
公开(公告)号：US20220029607A1
公开(公告)日：2022-01-27
申请号：US17497888
申请日：2021-10-09
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev , Charles Chung
摘要： Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes interleaved fingers of an interdigital transducer on the diaphragm and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the interposer.
-
公开(公告)号：US20210044275A1
公开(公告)日：2021-02-11
申请号：US17082945
申请日：2020-10-28
申请人： Resonant Inc.
发明人： Patrick Turner , Mike Eddy , Andrew Kay , Ventsislav Yantchev
摘要： Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer has layers of a LTCC circuit card, at least one layer of the tape comprising printed conductors. A plurality of conductive balls directly bonds the first plurality of contact pads formed on the plate to respective contact pads of the second plurality of contact pads formed on the interposer.
-
公开(公告)号：US10110200B2
公开(公告)日：2018-10-23
申请号：US15141312
申请日：2016-04-28
申请人： Resonant Inc.
发明人： Sean McHugh , Neal Fenzi , Mike Eddy , Patrick Turner
摘要： Surface acoustic wave (SAW) filters and methods of fabricating SAW filters are disclosed. A filter includes a piezoelectric wafer having a thickness within one of a plurality of noncontiguous thickness ranges that define piezoelectric wafers upon which filter circuits meeting predetermined requirements can be fabricated according to a predetermined design using a predetermined fabrication process, and a filter circuit fabricated on the piezoelectric substrate according to the predetermined design using the predetermined fabrication process.
-
10.发明申请公开(公告)号：US20170126203A1
公开(公告)日：2017-05-04
申请号：US15141312
申请日：2016-04-28
申请人： Resonant Inc.
发明人： Sean McHugh , Neal Fenzi , Mike Eddy , Patrick Turner
CPC分类号： H03H9/64 , H03H3/02 , H03H3/08 , H03H9/02543 , H03H9/02574 , H03H9/02866 , H03H9/644 , H03H9/6483
摘要： Surface acoustic wave (SAW) filters and methods of fabricating SAW filters are disclosed. A filter includes a piezoelectric wafer having a thickness within one of a plurality of noncontiguous thickness ranges that define piezoelectric wafers upon which filter circuits meeting predetermined requirements can be fabricated according to a predetermined design using a predetermined fabrication process, and a filter circuit fabricated on the piezoelectric substrate according to the predetermined design using the predetermined fabrication process.
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.018 秒)
