摘要:
A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
摘要:
An acoustic wave device includes: a support substrate; a piezoelectric substrate bonded to the support substrate; a first acoustic wave element formed on the piezoelectric substrate; a frame formed on the support substrate to surround the first acoustic wave element; and a substrate formed on the frame so that a cavity to which the first acoustic wave element is exposed is formed above the piezoelectric substrate, wherein a difference in linear expansion coefficient between the support substrate and the substrate in a first direction in a surface direction of the piezoelectric substrate is less than a difference in linear expansion coefficient between the support substrate and the piezoelectric substrate in the first direction, and the piezoelectric substrate remains in a region where the first acoustic wave element is formed and is removed in a region where the frame is formed.
摘要:
An acoustic wave device includes: a support substrate; a piezoelectric substrate bonded to the support substrate; a first acoustic wave element formed on the piezoelectric substrate; a frame formed on the support substrate to surround the first acoustic wave element; and a substrate formed on the frame so that a cavity to which the first acoustic wave element is exposed is formed above the piezoelectric substrate, wherein a difference in linear expansion coefficient between the support substrate and the substrate in a first direction in a surface direction of the piezoelectric substrate is less than a difference in linear expansion coefficient between the support substrate and the piezoelectric substrate in the first direction, and the piezoelectric substrate remains in a region where the first acoustic wave element is formed and is removed in a region where the frame is formed.
摘要:
An acoustic wave device includes an acoustic wave element including an IDT electrode provided on a substrate, and a protective film arranged to cover the acoustic wave element so as to stabilize characteristics. The protective film is a silicon nitride film composed of silicon and nitrogen as main components and when a composition ratio of the silicon to the nitrogen is represented by 1:X, X is about 1.15 or less.
摘要:
A duplexer that includes: a transmission filter and a reception filter that are connected to a common terminal; and a reactance circuit that is connected to at least one of the transmission filter and the reception filter. The reactance circuit includes an insulating substrate, lumped-constant inductors, and at least one capacitor. The lumped-constant inductors and the capacitor are formed directly on the surface of the insulating substrate.
摘要:
A SAW filter assembly module comprising a plurality of series in-line SAW filter devices and effective to provide substantial isolation of output from input of the module. Separate isolated conductive ground areas are applied to the surface of an insulative substrate upon which the SAW filter devices are placed with a portion of certain areas extending to a terminal side of the substrate and each SAW device is electrically connected to a respective conductive ground area. A separate inter-SAW ground area is provided between each set of device ground areas. A conductive input area of a first SAW filter is located most distant from the conductive output area of a subsequent SAW filter with the plurality of conductive ground areas located therebetween to increase selectivity. A conductive shield is secured to and electrically connected to a ground area between the SAW filter devices and is positioned to block radiative signals between the devices. A shunt inductor is connected between the inter-SAW ground area and in inter-SAW signal path conductive area to increase selectivity with low insertion loss. Bent wire straps, of flat or other essentially non-cylindrical cross-section may be used to make electrical connections between the electrodes of the transducers of each SAW to the appropriate respective conductive areas of the substrate. An insulative cover is positioned over the filter assembly module with portions of the conductive areas extending thereunder toward the terminal side of the substrate.
摘要:
An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.
摘要:
A surface acoustic wave resonator includes an IDT that is disposed on a quartz crystal substrate of Euler angles (−1.5°≦φ≦1.5°, 117°≦θ≦142°, ψ) and excites a surface acoustic wave resonant in an upper part of a stop-band of the IDT, and inter-electrode finger grooves that are acquired by depressing the substrate located between electrode fingers configuring the IDT. The wavelength of the surface acoustic wave, the depth of the inter-electrode finger grooves, the line occupancy ratio of the IDT, and the film thickness of the electrode fingers of the IDT are set in correspondence with one another.
摘要:
A surface acoustic wave (SAW) resonator and a SAW oscillator and an electronic apparatus including the resonator are to be provided. A SAW resonator includes: an IDT exciting a SAW using a quartz crystal substrate of Euler angles (−1.5°≦φ≦1.5°, 117°≦θ≦142°, 42.79°≦|ψ|≦49.57°); one pair of reflection units arranged so as allow the IDT to be disposed therebetween; and grooves acquired by depressing the quartz crystal substrate located between electrode fingers. When a wavelength of the SAW is λ, and a depth of the grooves is G, “0.01λ≦G” is satisfied.
摘要:
A surface acoustic wave (SAW) resonator and a SAW oscillator and an electronic apparatus including the resonator are to be provided. A SAW resonator includes: an IDT exciting a SAW using a quartz crystal substrate of Euler angles (−1.5°≦φ≦1/5°, 117°≦θ≦142°, 42.79°≦|ψ|≦49.57°; one pair of reflection units arranged so as allow the IDT to be disposed therebetween; and grooves acquired by depressing the quartz crystal substrate located between electrode fingers. When a wavelength of the SAW is λ, and a depth of the grooves is G, “0.01λ≦G” is satisfied.