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公开(公告)号：US09633873B2
公开(公告)日：2017-04-25
申请号：US14326071
申请日：2014-07-08
发明人： Motoi Yamauchi , Osamu Kawachi
IPC分类号： H05K7/00 , H01L21/56 , H03H9/10 , H01L23/00 , H05K1/02 , H05K1/14 , H05K3/28 , H05K3/30 , H05K3/34 , H03H9/00 , H03H9/02
CPC分类号： H01L21/561 , H01L23/04 , H01L24/95 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12042 , H01L2924/15174 , H01L2924/15787 , H01L2924/181 , H03H9/02913 , H03H9/1007 , H03H9/1085 , H03H2009/0019 , H05K1/0209 , H05K1/0216 , H05K1/0243 , H05K1/141 , H05K3/284 , H05K3/303 , H05K3/3436 , H05K2201/0305 , H05K2201/049 , H05K2201/068 , H05K2201/10068 , H05K2201/10371 , H05K2201/10537 , H05K2201/1056 , H05K2201/10674 , H05K2203/1316 , H01L2924/00
摘要： An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.
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公开(公告)号：US11942438B2
公开(公告)日：2024-03-26
申请号：US17176804
申请日：2021-02-16
发明人： Motoi Yamauchi , Masato Ito
CPC分类号： H01L23/562 , H01L23/02 , H01L23/31 , H03H9/0571 , H03H9/0576 , H10N30/88 , H01L23/498 , H01L23/49805 , H01L23/49838
摘要： An electronic component includes a first substrate having a substantially quadrangular planar shape and having a first surface and a second surface, the first surface and the second surface being opposite to each other, an element disposed on the first surface, four first terminals located adjacent to four corners on the second surface, respectively, and a second terminal located between the first terminals at respective ends of each of two sides opposite to each other of the second surface, an area of the second terminal being smaller than an area of each of the first terminals at the respective ends of each of the two sides, a width of the second terminal in an extension direction of each of the two sides being equal to or less than a width of each of the first terminals at the respective ends of each of the two sides in the extension direction.
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公开(公告)号：US11082027B2
公开(公告)日：2021-08-03
申请号：US15885276
申请日：2018-01-31
发明人： Motoi Yamauchi
IPC分类号： H03H9/02 , H03H9/05 , H03H9/13 , H03H9/145 , H01L41/187
摘要： An acoustic wave device includes: a first substrate made of a piezoelectric material; an acoustic wave element located on the first substrate; a bump located on the first substrate; a second substrate located on the first substrate through the bump, the second substrate facing the first substrate across an air gap; and a support layer that is located in at least a part of a periphery of the first substrate, is in contact with a side surface of the first substrate, and has a less linear thermal expansion coefficient than the first substrate.
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公开(公告)号：US09214445B2
公开(公告)日：2015-12-15
申请号：US14231163
申请日：2014-03-31
CPC分类号： H01L24/81 , H01L23/15 , H01L24/13 , H01L24/16 , H01L24/83 , H01L24/97 , H01L2224/13111 , H01L2224/16238 , H01L2224/7598 , H01L2224/81007 , H01L2224/81191 , H01L2224/81203 , H01L2224/81206 , H01L2224/81207 , H01L2224/81815 , H01L2224/83007 , H01L2224/83191 , H01L2224/83203 , H01L2224/83815 , H01L2224/97 , H01L2924/351 , H03H9/059 , H05K1/0271 , H05K1/0306 , H05K3/3431 , H05K2201/09781 , H05K2201/2009 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/01047
摘要： An electronic component includes: a substrate formed of ceramic and including one or more pads on an upper surface thereof; a component flip-chip mounted on the upper surface of the substrate with one or more bumps bonded to the one or more pads; and an additional film located on a lower surface of the substrate and overlapping with at least a part of a smaller one of the pad and the bump in each of one or more pad/bump pairs, the one or more pad/bump pairs being composed of the one or more pads and the one or more bumps bonded to each other.
摘要翻译： 电子部件包括：由陶瓷形成的基板，在其上表面上包括一个或多个焊盘; 安装在所述基板的上表面上的部件倒装芯片，其中一个或多个凸起焊接到所述一个或多个焊盘; 以及位于所述基板的下表面上并且与一个或多个垫/凸块对中的每一个中的所述焊盘和所述凸块中的较小一个的至少一部分重叠的附加膜，所述一个或多个焊盘/凸块对被组成 的一个或多个焊盘和一个或多个凸块彼此粘接。
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公开(公告)号：US11751480B2
公开(公告)日：2023-09-05
申请号：US17018903
申请日：2020-09-11
CPC分类号： H10N30/883 , H03H9/1071 , H10N30/00
摘要： An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.
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公开(公告)号：US11706991B2
公开(公告)日：2023-07-18
申请号：US17018903
申请日：2020-09-11
CPC分类号： H10N30/883 , H03H9/1071 , H10N30/00
摘要： An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.
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公开(公告)号：US10580750B2
公开(公告)日：2020-03-03
申请号：US16103443
申请日：2018-08-14
发明人： Motoi Yamauchi , Yuki Endo
IPC分类号： H01L25/065 , H01L23/66 , H03H9/05 , H01L23/00 , H03H9/08
摘要： An electronic component includes: four device chips having rectangular planar shapes and arranged on a substrate so that a corner of four corners constituting a rectangle of one device chip is adjacent to the corners of remaining three device chips; first pads located on surfaces of the four device chips and closest to the corner; one or more first bumps bonding the first pads to the substrate in the four device chips; second pads located on surfaces of the four device chips, the second pad being one of pads other than the first pad; and one or more second bumps bonding the second pads to the substrate in the four device chips, a sum of bonded areas between the one or more second bumps and the second pad being less than a sum of bonded areas between the first pad and the one or more first bumps.
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