公开(公告)号：US11926523B2

公开(公告)日：2024-03-12

申请号：US17470236

申请日：2021-09-09

申请人： BEIJING VOYAGER TECHNOLOGY CO., LTD.

发明人： Youmin Wang ,  Yue Lu

IPC分类号： B81C1/00 ,  G02B26/08 ,  G02B26/10 ,  G01S7/481

CPC分类号： B81C1/00174 ,  G02B26/0833 ,  G02B26/10 ,  B81C2201/0142 ,  B81C2201/0181 ,  B81C2203/032 ,  G01S7/4817

摘要： Embodiments of the disclosure provide methods for microfabricating an omni-view peripheral scanning system. One exemplary method may include separately fabricating a reflector and a scanning MEMS mirror, and then bonding the microfabricated reflector with the scanning MEMS mirror to form the omni-view peripheral scanning system. The microfabricated reflector may include a cone-shaped bottom portion, and a via hole across the cone-shaped bottom portion. The microfabricated scanning MEMS mirror may include a MEMS actuation platform and a scanning mirror supported by the MEMS actuation platform. The scanning MEMS mirror may face the cone-shaped bottom portion of the reflector when forming the omni-view peripheral scanning system.

公开(公告)号：US20230365400A1

公开(公告)日：2023-11-16

申请号：US18360926

申请日：2023-07-28

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Guoqiang WU ,  Shangshu YANG ,  Jinghui XU ,  Zhongye WU ,  Qifang HU

IPC分类号： B81B7/00 ,  B81C3/00

CPC分类号： B81B7/0048 ,  B81C3/001 ,  B81C2203/032

摘要： The technology of this application relates to an encapsulation structure that includes a micro-electromechanical system (MEMS) device, a substrate, and an attachment material. Materials included in the substrate include at least a first-type material and a second-type material, a coefficient of thermal expansion of the first-type material is less than a coefficient of thermal expansion of a base material of the MEMS device, and a coefficient of thermal expansion of the second-type material is greater than the coefficient of thermal expansion of the base material of the MEMS device. The attachment material is located between the MEMS device and the substrate, and is configured to attach the MEMS device to the substrate. The substrate includes a plurality of different materials.

公开(公告)号：US20180237290A1

公开(公告)日：2018-08-23

申请号：US15887567

申请日：2018-02-02

申请人： Robert Bosch GmbH

发明人： Daniel Haug ,  Hans-Peter Baer ,  Mike Schwarz ,  Volkmar Senz

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2203/0127 ,  B81C1/00666 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/032

摘要： A micromechanical system including a sensitive element, the system including a first area in which the sensitive element is situated, and a second area which at least partially surrounds the first area. Furthermore, the system includes a holding element having an elastic property, which joins the first area to the second area, and a joining material, with the aid of which the second area may be joined to a substrate. A spacing area is provided between the first area and the second area. The joining material extends into the spacing area so that a possible movement of the first area caused by the elastic property of the holding element is limited.

公开(公告)号：US20180117910A1

公开(公告)日：2018-05-03

申请号：US15800904

申请日：2017-11-01

申请人： ROHM Co., LTD.

发明人： Nobufumi MATSUO

IPC分类号： B41J2/14 ,  B81C1/00 ,  B81B1/00 ,  B41J2/16

CPC分类号： B41J2/1433 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1642 ,  B41J2002/14491 ,  B81B1/004 ,  B81B2201/032 ,  B81B2201/052 ,  B81C1/00087 ,  B81C3/001 ,  B81C2203/032

摘要： There is provided a nozzle substrate including a nozzle hole penetrating in a thickness direction. The nozzle substrate includes a main substrate including a first surface and a second surface, an oxidation film formed on the second surface of the main substrate, and a water repellent film formed on a surface at an opposite side to the main substrate side of the oxidation film. The nozzle hole includes a first through hole penetrating the main substrate in a thickness direction, a second through hole penetrating the oxidation film and being connected to the first through hole, and a third through hole penetrating the water repellent film and being connected to the second through hole. An inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush.

公开(公告)号：US09919522B2

公开(公告)日：2018-03-20

申请号：US15258041

申请日：2016-09-07

申请人： SEIKO EPSON CORPORATION

发明人： Yoichi Naganuma ,  Eiju Hirai ,  Toshiaki Hamaguchi ,  Motoki Takabe

IPC分类号： B41J2/14 ,  B81C3/00 ,  B41J2/16

CPC分类号： B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/164 ,  B41J2002/14241 ,  B41J2002/14362 ,  B81B2201/052 ,  B81C3/001 ,  B81C2203/032

摘要： A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.

公开(公告)号：US20160310944A1

公开(公告)日：2016-10-27

申请号：US15133202

申请日：2016-04-19

申请人： JSR CORPORATION

发明人： Isao NISHIMURA ,  Kenji HOSHIKO ,  Masahiro KANEKO

IPC分类号： B01L3/00 ,  B32B37/14 ,  B32B38/00 ,  G03F7/031

CPC分类号： B01L3/502707 ,  B01L2200/12 ,  B01L2300/041 ,  B01L2300/0848 ,  B01L2300/0887 ,  B01L2300/12 ,  B32B37/14 ,  B32B38/0008 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2203/032 ,  G03F7/031

摘要： The present disclosure relates to a method of producing a microfluidic device, a microfluidic device, and a photosensitive resin composition, the method including the steps of: forming a resin layer on a support from a photosensitive resin composition that includes a compound having at least two radical-polymerizable groups, a photoradical generator, a compound having at least two cationically reactive groups, a photocation generator, and at least one compound selected from a protective group-containing amine, a photodegradable base, an imide structure-containing compound, an amide structure-containing compound and an urea structure-containing compound; partially UV-exposing and developing the resin layer; preparing a laminate by placing a cover material on the thus developed resin layer; and UV-exposing the thus obtained laminate.

摘要翻译： 本发明涉及一种微流体装置的制造方法，微流体装置和感光性树脂组合物，其特征在于，包括以下步骤：在由感光性树脂组合物构成的载体上形成树脂层，所述感光性树脂组合物含有具有至少两个 可自由基聚合的基团，光自由基发生剂，具有至少两个阳离子反应性基团的化合物，光阳离子发生剂和至少一种选自含保护基团的胺，可光降解碱，含酰亚胺结构的化合物，酰胺 含结构的化合物和含脲结构的化合物; 部分UV曝光和显影树脂层; 通过将覆盖材料放置在如此展开的树脂层上来制备层压板; 并将如此得到的层压体UV曝光。

公开(公告)号：US20150287556A1

公开(公告)日：2015-10-08

申请号：US14676089

申请日：2015-04-01

申请人： National Tsing Hua University

发明人： Wei-Cheng LAI ,  Weileun FANG

IPC分类号： H01H11/00 ,  H01H50/28

CPC分类号： B81B3/0056 ,  B81B2201/014 ,  B81C2203/032 ,  H01H1/0036 ,  Y10T29/49105

摘要： The present invention relates to a micro normally-closed structure, which is manufactured by a MEMS process and used as a MEMS component. The structure includes a base and a fixed contact; and a flexible arm including a first end and a movable contact, wherein the first end is electrically connecting to the base, and remaining a normally closed electrically conducting state between the movable contact and the fix end.

摘要翻译： 本发明涉及通过MEMS工艺制造并用作MEMS部件的微常闭闭结构。 该结构包括基座和固定触点; 以及包括第一端和可动触头的柔性臂，其中所述第一端电连接到所述基座，并且在所述可动触头和所述固定端之间保持常闭导电状态。

公开(公告)号：US08895362B2

公开(公告)日：2014-11-25

申请号：US13775890

申请日：2013-02-25

申请人： Corning Incorporated

发明人： James Gregory Couillard ,  Christopher Paul Daigler ,  Jiangwei Feng ,  Yawei Sun ,  Lili Tian ,  Ian David Tracy

IPC分类号： H01L23/15 ,  H01L21/82 ,  B81C3/00 ,  G02B26/08

CPC分类号： H01L21/82 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/032 ,  B81C2203/035 ,  G02B26/0833 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and apparatus provide for a structure, including: a first glass material layer; and a second material layer bonded to the first glass material layer via bonding material, where the bonding material is formed from one of glass frit material, ceramic frit material, glass ceramic frit material, and metal paste, which has been melted and cured.

摘要翻译： 方法和装置提供一种结构，包括：第一玻璃材料层; 以及通过接合材料接合到第一玻璃材料层的第二材料层，其中粘合材料由熔化和固化的玻璃料材料，陶瓷玻璃料，玻璃陶瓷玻璃料材料和金属浆料之一形成。

公开(公告)号：US08890075B2

公开(公告)日：2014-11-18

申请号：US13261198

申请日：2010-09-14

申请人： Frédéric Julien Gamel ,  Wolfgang Kurt Brode ,  Horst Mannebach ,  Frank Herold ,  Indira Käpplinger

发明人： Frédéric Julien Gamel ,  Wolfgang Kurt Brode ,  Horst Mannebach ,  Frank Herold ,  Indira Käpplinger

IPC分类号： G01J5/02 ,  B01L3/00 ,  B81C1/00 ,  G01N21/03 ,  G01N21/05 ,  G01N21/35

CPC分类号： B01L3/502707 ,  B01L2200/0636 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0663 ,  B01L2300/0887 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2203/032 ,  G01N21/03 ,  G01N21/0317 ,  G01N21/05 ,  G01N21/35 ,  G01N21/3577 ,  G01N2021/0346 ,  G01N2021/056

摘要： A measuring cell (1) for the infrared analysis of fluids, in particular a measuring cell (1) having a permissible operating pressure of more than 20 bar and preferably more than 50 bar, has a flow channel (10) for the fluid formed between first and second elements (2, 4). Each element is transparent to infrared radiation at least in some sections. The infrared radiation can be radiated into the flow channel (10) by the first element (2) and can exit the flow channel (10) by the second element (4). The two elements (2, 4) are connected to each other in a fluid-tight and mechanically high-strength manner by a connecting layer (6) arranged between them and made of a glass-containing material, in particular a sintered glass-ceramic material. A measuring system (8) has that measuring cell (1). A method produces that measuring cell (1).

摘要翻译： 用于流体的红外分析的测量池（1），特别是具有大于20巴，优选大于50巴的允许的操作压力的测量池（1）具有流动通道（10），用于在 第一和第二元素（2,4）。 至少在某些部分，每个元素对红外辐射是透明的。 红外辐射可以被第一元件（2）辐射到流动通道（10）中并且可以由第二元件（4）离开流动通道（10）。 两个元件（2,4）以流体密封和机械高强度的方式通过布置在它们之间的连接层（6）彼此连接，并由含玻璃材料制成，特别是烧结玻璃陶瓷 材料。 测量系统（8）具有测量单元（1）。 一种方法产生测量池（1）。

公开(公告)号：US08853839B2

公开(公告)日：2014-10-07

申请号：US13645094

申请日：2012-10-04

申请人： Analog Devices, Inc.

发明人： Jia Gao ,  Jicheng Yang ,  Shafi Saiyed ,  Siu Lung Ng ,  Xiaojie Xue

IPC分类号： H01L23/495

CPC分类号： H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/032 ,  B81C2203/035 ,  H01L23/047 ,  H01L23/49861 ,  H01L29/66007 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

摘要： A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

摘要翻译： 公开了一种用于包括空气释放机构的集成装置的壳体。 这在各种实施例中通过在封装衬底中形成通气孔并且在封装衬底上布置封装盖来实现。 通气孔允许空气从空腔包装内释放，从而确保包装盖保持稳定地固定到包装基板上，尽管加工过程中温度升高。 当将包装件安装到安装基板上时，通气孔可以被密封。