公开(公告)号：US11867716B2

公开(公告)日：2024-01-09

申请号：US18162874

申请日：2023-02-01

申请人： SEIKO EPSON CORPORATION

发明人： Fumiya Ito

IPC分类号： G01P15/135 ,  G01P15/08 ,  G01P15/125 ,  B81B7/00

CPC分类号： G01P15/135 ,  B81B7/0016 ,  G01P15/0802 ,  G01P15/125 ,  B81B2201/0235 ,  G01P2015/0831 ,  G01P2015/0871

摘要： A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.

公开(公告)号：US20180252739A1

公开(公告)日：2018-09-06

申请号：US15904500

申请日：2018-02-26

申请人： Atlantic Inertial Systems Limited

发明人： Alan MALVERN

IPC分类号： G01P1/00

CPC分类号： G01P1/003 ,  B81B7/0016 ,  B81B7/0058 ,  G01P2015/0882

摘要： A MEMS sensor package includes a MEMS sensor fixed to a vibration damping mount. The mount includes a silicon substrate defining an outer frame; a moveable support to which the MEMS sensor is fixed; and a vibration damping structure connected between the outer frame and the moveable support to damp movement of the support. The MEMS sensor and vibration damping mount are enclosed by a casing that is backfilled with gas.

公开(公告)号：US20180086625A1

公开(公告)日：2018-03-29

申请号：US15698604

申请日：2017-09-07

申请人： The Government of the United States of America, as Represented by the Secretary of the Navy ,  The Charles Stark Draper Laboratory, Inc.

发明人： Francis J. KUB ,  Karl D. HOBART ,  Eugene A. IMHOFF ,  Rachael L. MYERS-WARD ,  Eugene COOK ,  Jonathan BERNSTEIN ,  Marc WEINBERG

IPC分类号： B81B3/00 ,  B81C1/00 ,  G01C19/5656 ,  G01C19/5621 ,  G01C19/56

CPC分类号： B81B3/0072 ,  B81B7/0016 ,  B81B7/0019 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C1/00666 ,  B81C2201/0132 ,  B81C2203/036 ,  G01C19/56 ,  G01C19/5621 ,  G01C19/5656 ,  G01C19/5783

摘要： Electromechanical device structures are provided, as well as methods for forming them. The device structures incorporate at least a first and second substrate separated by an interface material layer, where the first substrate comprises an anchor material structure and at least one suspended material structure, optionally a spring material structure, and optionally an electrostatic sense electrode. The device structures may be formed by methods that include providing an interface material layer on one or both of the first and second substrates, bonding the interface materials to the opposing first or second substrate or to the other interface material layer, followed by forming the suspended material structure by etching.

公开(公告)号：US20180003503A1

公开(公告)日：2018-01-04

申请号：US15638007

申请日：2017-06-29

申请人： Infineon Technologies AG

发明人： Marco Haubold

IPC分类号： G01C19/5726 ,  G01P15/125 ,  G01P1/00 ,  B81B7/02 ,  H05K5/03 ,  B81B3/00 ,  G01P15/08

CPC分类号： G01C19/5726 ,  B81B3/0018 ,  B81B7/0016 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0264 ,  G01C19/5783 ,  G01D11/10 ,  G01L19/146 ,  G01P1/003 ,  G01P15/125 ,  G01P2015/0882 ,  H05K5/03

摘要： A device comprises a substrate, a spring structure, and a first sensor. The first sensor is resiliently coupled with the substrate via the spring structure. The spring structure is configured to provide damping of the first sensor with respect to the substrate. The device also comprises a second sensor configured to sense a deflection of the spring structure.

公开(公告)号：US20170349432A1

公开(公告)日：2017-12-07

申请号：US15613666

申请日：2017-06-05

申请人： Infineon Technologies AG

发明人： Adolf Koller ,  Bernhard Drummer

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00825 ,  B81B7/0016

摘要： A method of removing a reinforcement ring from a wafer is described. The method includes forming a ring-shaped recess in a first surface of the wafer and separating the reinforcement ring from an inner region of the wafer along the ring-shaped recess.

公开(公告)号：US09834432B2

公开(公告)日：2017-12-05

申请号：US14260539

申请日：2014-04-24

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

发明人： Yannick Deimerly ,  Guillaume Jourdan ,  Patrice Rey

IPC分类号： B81B7/00 ,  G01P15/08 ,  G01C19/5726

CPC分类号： B81B7/0016 ,  B81B7/008 ,  B81B2201/025 ,  G01C19/5726 ,  G01P2015/0882 ,  Y10T29/49082

摘要： Inertial sensor comprising a fixed part and at least one mass suspended from the fixed part and means of damping the displacement of the part suspended from the fixed part, said damping means being electromechanical damping means comprising at least one DC power supply source, one electrical resistor and one variable capacitor in series, said variable capacitor being formed partly by the suspended part and partly by the fixed part such that displacement of the suspended part causes a variation of the capacitance of the variable capacitor.

公开(公告)号：US20170227389A1

公开(公告)日：2017-08-10

申请号：US15495268

申请日：2017-04-24

申请人： Hitachi Automotive Systems, Ltd.

发明人： Ryosuke DOI ,  Hiroshi NAKANO ,  Keiji HANZAWA

IPC分类号： G01F1/692 ,  B81C1/00 ,  B81B7/00

CPC分类号： G01F1/692 ,  B81B7/0016 ,  B81C1/00825 ,  G01F1/684 ,  G01F1/6842 ,  G01F1/6845 ,  G01P5/12 ,  H01L21/565 ,  H01L28/20 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10158 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

公开(公告)号：US20170225943A1

公开(公告)日：2017-08-10

申请号：US15317646

申请日：2015-05-29

申请人： Robert Bosch GmbH

发明人： David Bendes

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0016 ,  B81B2203/0118 ,  B81B2203/053 ,  B81B2207/015 ,  B81C1/00682 ,  B81C2201/0171

摘要： A micromechanical structure is described, including: at least one elastically deformable first area, which includes a defined piezoelectrically doped second area, at least in sections; at least one fourth area, into which the electrical charges generated in the second area may be conducted; and at least one third area connected electrically to the second and fourth area, in which an electrical current flowing through is convertible into thermal energy.

公开(公告)号：US09625284B2

公开(公告)日：2017-04-18

申请号：US14846047

申请日：2015-09-04

申请人： Honeywell International Inc.

发明人： Todd Loren Braman ,  Scott James Goepfert ,  Terrance Troske

IPC分类号： G01D11/24 ,  G01D11/10 ,  F16M13/02

CPC分类号： G01D11/10 ,  B81B7/0016 ,  F16M13/02 ,  G01D11/245

摘要： A shock mount assembly for a sensor protector apparatus is provided. The shock mount assembly comprises a support structure having a geometric configuration, with the support structure including at least one side wall having an outer edge section that defines a periphery of the support structure, and at least one mounting surface substantially perpendicular to the side wall. The mounting surface is configured for coupling at least one electronic device to the support structure. A shock absorber is mounted to at least a portion of the outer edge section, with the shock absorber substantially surrounding the periphery of the support structure. The shock mount assembly is configured for a non-isolated system, and is configured to protect the electronic device during vibration or shock events.

公开(公告)号：US20170023606A1

公开(公告)日：2017-01-26

申请号：US14807665

申请日：2015-07-23

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： MICHAEL NAUMANN

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  B81B7/0016 ,  B81B2201/0235

摘要： A microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, where the proof mass is configured to move relative to the substrate; a flexible travel stop structure formed within the proof mass, where the flexible travel stop structure includes a contact lever connected to the proof mass via flexible elements; and a bumper formed on the surface of the substrate, where the contact lever is aligned to make contact with the bumper when the proof mass moves toward the substrate.

摘要翻译： 提供了一种微机电系统（MEMS）装置，其包括基板; 定位在基板表面上方的空间中的证明物质，其中证明物质被构造成相对于基底移动; 形成在所述检验质量块内的柔性行走止动结构，其中所述柔性行走止动结构包括通过柔性元件连接到所述检验质量块的接触杆; 以及形成在所述基板的表面上的保险杠，其中所述接触杆对准以在所述证明块朝向所述基板移动时与所述保险杠接触。