- 专利标题： REMOVAL OF A REINFORCEMENT RING FROM A WAFER
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申请号： US15613666申请日： 2017-06-05
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公开(公告)号： US20170349432A1公开(公告)日： 2017-12-07
- 发明人: Adolf Koller , Bernhard Drummer
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102016110378.0 20160606
- 主分类号： B81C1/00
- IPC分类号： B81C1/00 ; B81B7/00
摘要：
A method of removing a reinforcement ring from a wafer is described. The method includes forming a ring-shaped recess in a first surface of the wafer and separating the reinforcement ring from an inner region of the wafer along the ring-shaped recess.
公开/授权文献
- US10029913B2 Removal of a reinforcement ring from a wafer 公开/授权日：2018-07-24
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