公开(公告)号：US12069430B2

公开(公告)日：2024-08-20

申请号：US17412238

申请日：2021-08-25

申请人： INVENSENSE, INC.

发明人： Stefano Valle ,  Igor Mucha ,  Alessandro Magnani

IPC分类号： H04R19/04 ,  B81B7/00 ,  H04R19/00

CPC分类号： H04R19/04 ,  B81B7/008 ,  H04R19/005 ,  B81B2201/0257 ,  H04R2201/003

摘要： Disclosed embodiments provide flexible performance, high dynamic range, microelectromechanical (MEMS) multipath digital microphones, which allow seamless, low latency transitions between audio signal paths without audible artifacts over interruptions in the audio output signal. Disclosed embodiments facilitate performance and power saving mode transitions maintaining high dynamic range capability.

公开(公告)号：US12030772B2

公开(公告)日：2024-07-09

申请号：US16841044

申请日：2020-04-06

申请人： ASML Netherlands B.V.

发明人： Yongxin Wang ,  Rui-Ling Lai ,  Qian Zhang

IPC分类号： B81B7/00 ,  B81B3/00

CPC分类号： B81B3/004 ,  B81B3/0083 ,  B81B7/008 ,  B81B2201/047

摘要： The present disclosure describes an image forming element having a semiconductor chip with micro-electro-mechanical-system (MEMS) devices and voltage generators, each voltage generator being configured to generate a voltage used by one or more of the MEMS devices. A floating ground may be used to add a voltage to the voltage generated by the voltage generators. The semiconductor chip may include electrical connections, where each voltage generator is configured to provide the voltage to the one or more MEMS devices through the electrical connections. The MEMS devices may define a boundary in the semiconductor chip within which the MEMS devices, the voltage generators, and the electrical connections are located. Each MEMS device may generate an electrostatic field to manipulate an electron beamlet of a multi-beam charged particle microscope. The MEMS devices may be organized into groups based on a distance to a reference location (e.g., optical axis) in the semiconductor chip.

公开(公告)号：US12024421B2

公开(公告)日：2024-07-02

申请号：US18348268

申请日：2023-07-06

申请人： Canon Solutions America, Inc.

发明人： Jeffrey David Kane

IPC分类号： B81B7/00 ,  B41J11/00 ,  B81B7/04

CPC分类号： B81B7/008 ,  B41J11/0095 ,  B81B7/04

摘要： Some embodiments of a device comprise an image-forming medium and one or more sensors that are attached to the image-forming medium. Also, in some embodiments, the image-forming medium is paper or a medium that has paper-like characteristics, at least some of the one or more sensors are microelectromechanical systems (MEMS), or the one or more sensors are configured to be powered by wireless power transfer. And some embodiments of the device further comprise a system-on-a-chip that is in communication with the one or more sensors, a transceiver that is in communication with the system-on-a-chip, or a radio-frequency identification (RFID) tag.

公开(公告)号：US12012327B2

公开(公告)日：2024-06-18

申请号：US17189745

申请日：2021-03-02

申请人： Honeywell International Inc.

发明人： Daniel Endean ,  Andrew Brown ,  Mark Weber

IPC分类号： B81B7/00

CPC分类号： B81B7/0016 ,  B81B7/008 ,  B81B2201/0242 ,  B81B2207/03

摘要： A method for tuning one or more sensor devices is provided, wherein each sensor device comprises one or more proof masses configured to move in response to an external stimulus of interest, and the one or more proof masses are also susceptible to move in response to one or more stimuli other than the external stimulus of interest. Each sensor device also comprises one or more pick-off mechanisms respectively associated with each of the one or more proof masses. The one or more pick-off mechanisms is proportionally responsive to a motion of the sensor device. The method for tuning includes adjusting gain of one or more of the pick-off mechanisms to reduce an output of each sensor device when the one or more proof masses move in response to the one or more stimuli other than the external stimulus of interest.

公开(公告)号：US20240140784A1

公开(公告)日：2024-05-02

申请号：US18548266

申请日：2022-07-06

申请人： Robert Bosch GmbH

发明人： Timo Giesselmann ,  Gerhard Lammel

IPC分类号： B81B7/00 ,  G01C19/5776

CPC分类号： B81B7/008 ,  G01C19/5776

摘要： An electromechanical system. The electromechanical system includes: a microelectromechanical (MEMS) apparatus which has a component which can oscillate; a signal processing apparatus which is designed to receive and process a signal output by the MEMS apparatus; a voltage provision apparatus which is designed to provide at least one supply voltage for the signal processing apparatus, wherein the voltage provision apparatus includes at least one switching regulator. The voltage provision apparatus can be operated in a synchronous operating state and in an asynchronous operating state.

公开(公告)号：US20240083744A1

公开(公告)日：2024-03-14

申请号：US18517221

申请日：2023-11-22

申请人： Infineon Technologies AG

发明人： Dietmar Straeussnigg ,  Niccoló De Milleri ,  Andreas Wiesbauer

IPC分类号： B81B7/00 ,  B81B7/02 ,  H04R3/06

CPC分类号： B81B7/008 ,  B81B7/02 ,  H04R3/06 ,  B81B2201/0257 ,  H04R2201/003 ,  H04R2410/03

摘要： A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.

公开(公告)号：US11914777B2

公开(公告)日：2024-02-27

申请号：US16645650

申请日：2018-09-07

申请人： NEXTINPUT, INC.

发明人： Julius Minglin Tsai ,  Albert Bergemont ,  Christopher Edwards ,  Ali Foughi

IPC分类号： G06F3/01 ,  G01L5/1627 ,  H10N30/20 ,  H10N30/853 ,  B81B7/00 ,  B06B1/06

CPC分类号： G06F3/016 ,  B06B1/0644 ,  B06B1/0688 ,  B81B7/008 ,  G01L5/1627 ,  H10N30/20 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8554

摘要： Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.

公开(公告)号：US11891298B2

公开(公告)日：2024-02-06

申请号：US17839131

申请日：2022-06-13

申请人： STMICROELECTRONICS S.r.l.

发明人： Fabio Quaglia ,  Marco Ferrera ,  Marco Del Sarto

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L29/66

CPC分类号： B81B7/007 ,  B81B7/008 ,  B81C1/0023 ,  B81C2203/035 ,  H01L29/66

摘要： A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.

公开(公告)号：US11743666B2

公开(公告)日：2023-08-29

申请号：US17138487

申请日：2020-12-30

申请人： Knowles Electronics, LLC

发明人： Vezio Malandruccolo ,  Mark Niederberger ,  Luca Bettini ,  Weiwen Dai

IPC分类号： H04R29/00 ,  H04R3/00 ,  H04R1/04 ,  B81B7/00 ,  H04R19/04

CPC分类号： H04R29/004 ,  B81B7/008 ,  H04R1/04 ,  H04R3/00 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2207/03 ,  H04R2201/003

摘要： The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

公开(公告)号：US11673796B2

公开(公告)日：2023-06-13

申请号：US17196329

申请日：2021-03-09

申请人： PALO ALTO RESEARCH CENTER INCORPORATED

发明人： Jengping Lu

IPC分类号： B81B7/00 ,  H01L29/40 ,  H01L29/786 ,  H01L31/0376 ,  H01L31/108

CPC分类号： B81B7/008 ,  H01L29/402 ,  H01L29/78669 ,  H01L29/78696 ,  H01L31/03762 ,  H01L31/108 ,  B81B2201/03 ,  B81B2207/03

摘要： A device includes a first stage having a first optical switch, a first transistor connected to the first optical switch, and a second transistor connected to the first optical switch and the first transistor. The device also includes a second stage having a second optical switch, a third transistor connected to the second transistor and the second optical switch, and a fourth transistor connected to the second transistor, the second optical switch, and the third transistor.