公开(公告)号：US11914777B2

公开(公告)日：2024-02-27

申请号：US16645650

申请日：2018-09-07

申请人： NEXTINPUT, INC.

发明人： Julius Minglin Tsai ,  Albert Bergemont ,  Christopher Edwards ,  Ali Foughi

IPC分类号： G06F3/01 ,  G01L5/1627 ,  H10N30/20 ,  H10N30/853 ,  B81B7/00 ,  B06B1/06

CPC分类号： G06F3/016 ,  B06B1/0644 ,  B06B1/0688 ,  B81B7/008 ,  G01L5/1627 ,  H10N30/20 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8554

摘要： Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.

公开(公告)号：US11819702B2

公开(公告)日：2023-11-21

申请号：US17192022

申请日：2021-03-04

申请人： NORTH CAROLINA STATE UNIVERSITY

发明人： Paul A. Maggard, Jr. ,  Shaun O'Donnell ,  Jacob L. Jones

IPC分类号： A61N1/378 ,  B01J23/02 ,  B01J23/14 ,  B01J23/00 ,  B01J35/00 ,  C01B3/04 ,  C01G25/00 ,  H10N30/853

CPC分类号： A61N1/378 ,  B01J23/002 ,  B01J23/02 ,  B01J23/14 ,  B01J35/004 ,  C01B3/042 ,  C01G25/006 ,  H10N30/8536 ,  C01P2002/34 ,  C01P2002/50 ,  C01P2002/72 ,  C01P2002/76 ,  C01P2002/77 ,  C01P2002/84 ,  C01P2002/85 ,  C01P2002/90 ,  C01P2006/40 ,  B01J2523/00 ,  B01J2523/25 ,  B01J2523/43 ,  B01J2523/47

摘要： Disclosed herein are perovskite materials and methods of making an use thereof.

公开(公告)号：US11818955B2

公开(公告)日：2023-11-14

申请号：US17445959

申请日：2021-08-26

申请人： City University of Hong Kong

发明人： Zhengbao Yang ,  Shiyuan Liu

IPC分类号： H10N30/00 ,  H10N30/045 ,  H10N30/078 ,  H10N30/88 ,  H10N30/853

CPC分类号： H10N30/10513 ,  H10N30/045 ,  H10N30/078 ,  H10N30/883 ,  H10N30/8536

摘要： The present disclosure provides a method for forming piezoelectric films on surfaces of arbitrary morphologies. The method includes providing a sol for forming the piezoelectric film; spraying the sol onto the surface thereby forming a liquid film containing the sol on the surface; wiping the liquid film with a flattening tool for flattening the liquid film; drying the flattened liquid film thereby forming a gel layer; and annealing the gel layer thereby forming the piezoelectric film. The piezoelectric films with high uniformity and desired thickness can be formed on curved and even wrinkled surfaces by the present method.

公开(公告)号：US20230295447A1

公开(公告)日：2023-09-21

申请号：US18020972

申请日：2021-08-24

申请人： National Research Council of Canada

发明人： Chantal PAQUET ,  Silvio Elton KRÜGER ,  Thomas LACELLE ,  Derek ARANGUREN VAN EGMOND ,  Claudie ROY

IPC分类号： C09D5/24 ,  B33Y70/10 ,  C09D5/02 ,  C09D7/20 ,  C09D7/61 ,  C09D7/40 ,  C09D139/06 ,  C09D171/02 ,  H10N30/853

CPC分类号： C09D5/24 ,  B33Y70/10 ,  C09D5/02 ,  C09D7/20 ,  C09D7/61 ,  C09D7/68 ,  C09D139/06 ,  C09D171/02 ,  H10N30/8554 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8561 ,  B33Y10/00

摘要： The present disclosure is directed towards a formulation for piezoelectric materials. The formulation may be printed including 2D or 3D printing. The formulation contains ceramic particles, a sol-gel, a high boiling point solvent and a binder.

公开(公告)号：US11742817B2

公开(公告)日：2023-08-29

申请号：US16618696

申请日：2018-06-21

申请人： Soitec

发明人： Isabelle Huyet ,  Cedric Charles-Alfred ,  Didier Landru ,  Alexis Drouin

IPC分类号： H01L21/02 ,  H03H3/10 ,  H10N30/072 ,  H10N30/853

CPC分类号： H03H3/10 ,  H10N30/072 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8548 ,  H10N30/8554

摘要： A process for transferring a thin layer consisting of a first material to a support substrate consisting of a second material having a different thermal expansion coefficient, comprises providing a donor substrate composed of an assembly of a thick layer formed of the first material and of a handle substrate having a thermal expansion coefficient similar to that of the support substrate, and the donor substrate having a main face on the side of the thick layer introducing light species into the thick layer to generate a plane of weakness therein and to define the thin layer between the plane of weakness and the main face of the donor substrate; assembling the main face of the donor substrate with a face of the support substrate; and detachment of the thin layer at the plane of weakness, the detachment comprising application of a heat treatment.

公开(公告)号：US20240357939A1

公开(公告)日：2024-10-24

申请号：US18747648

申请日：2024-06-19

申请人： Qortek, Inc.

发明人： Wei-Ting Chen ,  Safakcan Tundemir ,  Ahmet E. Gurdal ,  Gareth J. Knowles ,  Clive A. Randall

IPC分类号： H10N30/00 ,  H10N30/057 ,  H10N30/50 ,  H10N30/853 ,  H10N30/87

CPC分类号： H10N30/101 ,  H10N30/057 ,  H10N30/50 ,  H10N30/853 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8554 ,  H10N30/8561 ,  H10N30/874 ,  H10N30/877

摘要： A structurally integral multilaminar planer device is provided where the layers are bonded without use of adhesive. The device includes a perforated metal plate and a transductive ceramic layer. The perforated metal plate and transductive ceramic layer are bonded by a conductive metal ink that is subject to a thermal cycle process.

公开(公告)号：US12048247B1

公开(公告)日：2024-07-23

申请号：US17146340

申请日：2021-01-11

申请人： QorTek, Inc. ,  Clive A. Randall

发明人： Wei-Ting Chen ,  Safakcan Tuncdemir ,  Ahmet E. Gurdal ,  Gareth J. Knowles ,  Clive A. Randall

IPC分类号： H10N30/00 ,  H10N30/057 ,  H10N30/50 ,  H10N30/853 ,  H10N30/87

CPC分类号： H10N30/1071 ,  H10N30/057 ,  H10N30/50 ,  H10N30/853 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/8554 ,  H10N30/8561 ,  H10N30/874 ,  H10N30/877

摘要： A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.

公开(公告)号：US20240199216A1

公开(公告)日：2024-06-20

申请号：US18288465

申请日：2022-04-26

申请人： TUSAS- TURK HAVACILIK VE UZAY SANAYII ANONIM SIRKETI

发明人： Burhan SAHIN ,  Murat GUNEL

IPC分类号： B64D27/24 ,  B64C27/473 ,  B64D27/357 ,  B64D41/00 ,  H02N2/18 ,  H10N30/853

CPC分类号： B64D27/24 ,  B64C27/473 ,  B64D27/357 ,  H02N2/181 ,  H10N30/8536 ,  H10N30/8554 ,  B64D2041/002

摘要： The present invention relates to a body (2) provided at air vehicles: at least one rotor (3) extending longitudinally out of the body (2) and rotating around an axis along which it extends: at least one blade (4) connected to the rotor (3), which, upon triggering of the rotor (3), rotates around the axis along which the rotor (3) extends, thus creating an aerodynamic lifting force required for the body (2) to take-off: a blade tip (5) which is located on the blade (4), at the end of a direction along which the blade (4) extends: and at least one plate (6) made of a piezo-electric material, which is located on the blade (4) and enables energy conversion.

公开(公告)号：US11944999B2

公开(公告)日：2024-04-02

申请号：US16977122

申请日：2019-02-21

申请人： TDK CORPORATION

发明人： Yoshiki Ohta ,  Hideya Sakamoto ,  Kazushi Tachimoto ,  Yoshikazu Shimura ,  Tetsuyuki Taniguchi ,  Akihiro Takeda

IPC分类号： H01L41/047 ,  B06B1/06 ,  H10N30/20 ,  H10N30/50 ,  H10N30/87 ,  H10N30/853

CPC分类号： B06B1/0603 ,  H10N30/2047 ,  H10N30/50 ,  H10N30/871 ,  H10N30/8536 ,  H10N30/8548 ,  H10N30/8554

摘要： A vibration device includes a bimorph type piezoelectric element having a first main surface and a second main surface facing each other and a vibration member bonded to the second main surface of the piezoelectric element. The piezoelectric element has a first active region disposed closer to the first main surface between the first and second main surfaces and a second active region disposed closer to the second main surface than the first active region between the first and second main surfaces. When a force generated in the first active region is F1, a force generated in the second active region is F2, and a force by which the vibration member restrains the second active region is Fr, F2−F1≥Fr is satisfied.

公开(公告)号：US11837975B2

公开(公告)日：2023-12-05

申请号：US16775542

申请日：2020-01-29

申请人： CANON KABUSHIKI KAISHA ,  FUJI CHEMICAL CO., LTD.

发明人： Makoto Kubota ,  Kanako Oshima ,  Hisato Yabuta ,  Takanori Matsuda ,  Miki Ueda ,  Fumio Uchida ,  Hiroki Imai ,  Kenji Maeda ,  Chiemi Shimizu

IPC分类号： H02N2/10 ,  B41J2/14 ,  C04B35/495 ,  C04B35/626 ,  C04B35/634 ,  C04B35/64 ,  H04N23/52 ,  H10N30/50 ,  H10N30/053 ,  H10N30/87 ,  H10N30/20 ,  H10N30/853

CPC分类号： H02N2/103 ,  B41J2/14233 ,  C04B35/495 ,  C04B35/62695 ,  C04B35/63416 ,  C04B35/64 ,  H04N23/52 ,  H10N30/053 ,  H10N30/2047 ,  H10N30/50 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/871 ,  C04B2235/3234 ,  C04B2235/3255 ,  C04B2235/3263 ,  C04B2235/6021 ,  C04B2235/6567 ,  C04B2235/768

摘要： A piezoelectric material includes: an oxide containing Na, Ba, Nb, Ti, and Mn, in which the oxide has a perovskite-type structure, a total amount of metal elements other than Na, Ba, Nb, Ti, and Mn contained in the piezoelectric material is 0.5 mol % or less with respect to a total amount of Na, Ba, Nb, Ti, and Mn, a molar ratio x of Ti to a total molar amount of Nb and Ti is 0.05≤x≤0.12, a molar ratio y of Na to Nb is 0.93≤y≤0.98, a molar ratio z of Ba to Ti is 1.09≤z≤1.60, a molar ratio m of Mn to the total molar amount of Nb and Ti is 0.0006≤m≤0.0030, and 1.07≤y×z≤1.50 is satisfied.