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公开(公告)号：US20230380120A1
公开(公告)日：2023-11-23
申请号：US18366008
申请日：2023-08-07
发明人： Kunitoshi HANAOKA
IPC分类号： H05K9/00 , H03H9/00 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/64 , H03H9/72 , H05K1/18 , H05K1/02
CPC分类号： H05K9/0022 , H03H9/0009 , H03H9/02913 , H03H9/0576 , H03H9/059 , H03H9/1085 , H03H9/6483 , H03H9/725 , H05K1/181 , H05K1/023 , H05K2201/10053 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006 , H05K2201/10371
摘要： The radio frequency module includes a mounting board, a first metal member, and a second metal member. The first metal member and the second metal member are disposed on the mounting board. The first metal member has a longitudinal direction along a first direction in plan view from a thickness direction of the mounting board. The second metal member has a longitudinal direction along a second direction in plan view from the thickness direction of the mounting board. The first or second metal member is placed between a first electronic component and a second electronic component. The first metal member has a first recessed portion. The second metal member has a through hole and a second recessed portion. The through hole passes through the second metal member in the direction intersecting with the second direction. The second recessed portion faces and is in contact with the first recessed portion.
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公开(公告)号：US20230319983A1
公开(公告)日：2023-10-05
申请号：US18307153
申请日：2023-04-26
发明人： Kunitoshi HANAOKA
CPC分类号： H05K1/0243 , H03H9/13 , H03H9/54 , H05K2201/1006
摘要： To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The first metal layer is disposed on the first main surface of the mounting substrate. The second metal layer covers at least a part of the resin layer. The first metal layer has a ground potential, and is in contact with the second metal layer. The metal member is in contact with the first metal layer and the second metal layer.
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公开(公告)号：US20210399699A1
公开(公告)日：2021-12-23
申请号：US17221845
申请日：2021-04-05
发明人： Kunitoshi HANAOKA , Kiyoshi AIKAWA
摘要： A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.
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公开(公告)号：US20230187297A1
公开(公告)日：2023-06-15
申请号：US18166534
申请日：2023-02-09
发明人： Shota HAYASHI , Nobuaki OGAWA , Yuki ASANO , Takanori UEJIMA , Hiromichi KITAJIMA , Takahiro EGUCHI , Kunitoshi HANAOKA
IPC分类号： H01L23/31 , H01L23/66 , H01L23/552 , H01L25/16 , H05K9/00 , H01L23/498
CPC分类号： H01L23/3157 , H01L23/66 , H01L23/552 , H01L25/165 , H05K9/0024 , H01L23/498
摘要： A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.
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公开(公告)号：US20230145698A1
公开(公告)日：2023-05-11
申请号：US18154225
申请日：2023-01-13
CPC分类号： H04B1/0057 , H04B1/0078 , H04B1/04 , H04B2001/0408
摘要： A radio-frequency module includes a power amplifier, a power amplifier, a low noise amplifier, a duplexer that has a passband including a communication band A included in a communication band group X and that is connected to the power amplifier and the low noise amplifier, a duplexer that has a passband including a communication band C included in a communication band group Y lower than the communication band group X and that is connected to the power amplifier, and a module substrate having the power amplifier, the power amplifier, the low noise amplifier, and the duplexers arranged thereon. In a plan view of the module substrate, a distance between the power amplifier and the low noise amplifier is longer than a distance between the power amplifier and the low noise amplifier.
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6.发明申请公开(公告)号：US20190237843A1
公开(公告)日：2019-08-01
申请号：US16375864
申请日：2019-04-05
发明人： Kunitoshi HANAOKA
IPC分类号： H01P5/18
摘要： A coupler-integrated board includes a coupler, a first capacitor, a second capacitor, a resistance element, a matching circuit, and a multilayer circuit board. The coupler includes a main line and a secondary line. The first capacitor is connected in parallel with the secondary line. The second capacitor connects another end of the secondary line to a ground. The resistance element connects the other end of the secondary line to the ground. The resistance element has an impedance lower than a normalized impedance at a predetermined frequency. The matching circuit is connected between one end of the secondary line and a coupling port. The matching circuit matches an impedance at the coupling port to the normalized impedance at the predetermined frequency. The multilayer circuit board includes laminated base material layers. The coupler is integrated with the multiplayer circuit board.
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公开(公告)号：US20240214009A1
公开(公告)日：2024-06-27
申请号：US18420811
申请日：2024-01-24
发明人： Kunitoshi HANAOKA
CPC分类号： H04B1/0078 , H04B1/04
摘要： A radio frequency circuit includes an antenna terminal, a transmission filter, multiple reception filters, a first switch, and a second switch. In the first switch, a first terminal is connectable to a second terminal or a third terminal. In the second switch, a fourth terminal is connectable to a fifth terminal. The multiple reception filters are connected to the second terminal or the third terminal of the first switch. The first terminal of the first switch is connected to the antenna terminal. The fourth terminal of the second switch is connected to the second terminal of the first switch. The fifth terminal of the second switch is connected to the transmission filter.
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公开(公告)号：US20240146261A1
公开(公告)日：2024-05-02
申请号：US18409802
申请日：2024-01-11
发明人： Kunitoshi HANAOKA
IPC分类号： H03F3/24
CPC分类号： H03F3/245 , H03F2200/06 , H03F2200/09 , H03F2200/165 , H03F2200/171 , H03F2200/451
摘要： In a first balun of a radio-frequency circuit, a first end of a first coil is connected to an amplifier, and a second end of the first coil is connected to a ground. In the first balun, a first end of a second coil is connected to a first switch, and a second end of the second coil is connected to a second switch. In a second balun, a first end of a third coil is connected to the first end of the second coil via the first switch, and a second end of the third coil is connected to the second end of the second coil via the second switch. In the second balun, a first end of a fourth coil is connected to a filter, and a second end of the fourth coil is connected to the ground.
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公开(公告)号：US20210203371A1
公开(公告)日：2021-07-01
申请号：US17124516
申请日：2020-12-17
发明人： Kunitoshi HANAOKA
IPC分类号： H04B1/40 , H01L23/31 , H01L23/498 , H01L23/66 , H01L23/00
摘要： A radio frequency module includes: a module substrate including a principal surface; a bump electrode that is disposed on the principal surface and configured as an external-connection terminal of the radio frequency module; a semiconductor IC that is disposed on the principal surface and includes a low-noise amplifier that amplifies a radio frequency reception signal; an under-fill material disposed in a gap between the semiconductor IC and the principal surface; and a surface mount device disposed on the principal surface, between the bump electrode and the semiconductor IC, wherein in a plan view of the module substrate, an outer edge of the under-fill material is located between an edge of the inductor and an edge of the semiconductor IC, the respective edges of the inductor and semiconductor IC oppose the bump electrode.
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公开(公告)号：US20210167803A1
公开(公告)日：2021-06-03
申请号：US17105657
申请日：2020-11-27
发明人： Kunitoshi HANAOKA , Yoichi SAWADA
摘要： A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission input terminal; a first transmission amplifier disposed on the first principal surface that amplifies a transmission signal input through the transmission input terminal; and a first switch disposed on the second principal surface that connects and disconnects the transmission input terminal and the first transmission amplifier.
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