公开(公告)号：US20230298959A1

公开(公告)日：2023-09-21

申请号：US18324314

申请日：2023-05-26

申请人： Murata Manufacturing Co., Ltd.

发明人： Hiroyuki KANI ,  Yoshihiro YOSHIMURA ,  Takahiro YAMASHITA ,  Ryo WAKABAYASHI ,  Takashi HIROSE ,  Kiyoshi AIKAWA

IPC分类号： H01L23/367 ,  H04B1/036 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H04B1/04

CPC分类号： H01L23/367 ,  H04B1/036 ,  H01L23/552 ,  H01L23/66 ,  H01L24/09 ,  H01L24/16 ,  H01L23/49827 ,  H01L23/49816 ,  H04B1/04 ,  H04B2001/0408 ,  H01L2223/6611 ,  H01L2223/6661 ,  H01L2224/16227 ,  H01L2224/09515 ,  H01L2924/1421 ,  H01L2924/3025 ,  H01L2223/6616

摘要： A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.

公开(公告)号：US20230344460A1

公开(公告)日：2023-10-26

申请号：US18342743

申请日：2023-06-28

申请人： Murata Manufacturing Co., Ltd.

发明人： Masanari MIURA ,  Kiyoshi AIKAWA ,  Hiroyuki NAGAMORI ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Takahiro YAMASHITA ,  Ryo WAKABAYASHI ,  Yoshihiro YOSHIMURA ,  Takashi HIROSE

IPC分类号： H04B1/40 ,  H05K1/18 ,  H05K9/00 ,  H01L25/16 ,  H01L23/552

CPC分类号： H04B1/40 ,  H05K1/181 ,  H05K9/0022 ,  H01L25/16 ,  H01L23/552 ,  H05K2201/1006 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10371

摘要： A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.