Radio frequency module and communication device

    公开(公告)号:US11349506B2

    公开(公告)日:2022-05-31

    申请号:US17120305

    申请日:2020-12-14

    发明人: Takanori Uejima

    摘要: A radio frequency module includes: a transmission power amplifier that includes a plurality of amplifying elements that are cascaded; a reception low noise amplifier; and a module board on which the transmission power amplifier and the reception low noise amplifier are mounted. The plurality of amplifying elements include: an amplifying element disposed most downstream; and an amplifying element disposed upstream of the amplifying element, and in a plan view of the module board, a conductive member is physically disposed between the amplifying element and the reception low noise amplifier.

    Radio-frequency module, transmission power amplifier, and communication apparatus

    公开(公告)号:US11309925B2

    公开(公告)日:2022-04-19

    申请号:US17224154

    申请日:2021-04-07

    IPC分类号: H04B1/04 H04B1/44

    摘要: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.

    Radio frequency module and communication device

    公开(公告)号:US11201637B2

    公开(公告)日:2021-12-14

    申请号:US17114518

    申请日:2020-12-08

    发明人: Takanori Uejima

    IPC分类号: H04B1/04 H04B1/40 H04B1/525

    摘要: A radio frequency module includes a module board, a transmission power amplifier, a first inductance element connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element connected to an input terminal of the reception low-noise amplifier. The first inductance element is mounted on a first principal surface of the module board, and the second inductance element is mounted on a second principal surface of the module board.

    High-frequency switch module
    9.
    发明授权

    公开(公告)号:US10425119B2

    公开(公告)日:2019-09-24

    申请号:US15668046

    申请日:2017-08-03

    发明人: Takanori Uejima

    摘要: A high-frequency switch module (10) includes a switch element (20) and LC parallel resonant circuits (31 and 32). The switch element (20) includes selection target terminals (P14 and P21) used to transmit communication signals using different frequencies. The LC parallel resonant circuits (31 and 32) are connected between a connection conductor (901) connected to the selection target terminal (P14) and a connection conductor (902) connected to the selection target terminal (P21). The LC parallel resonant circuits (31 and 32) are connected in series between the connection conductors (901 and 902). The LC parallel resonant circuits (31 and 32) have different attenuation pole frequencies.