Radio-frequency module and communication device

    公开(公告)号:US12047106B2

    公开(公告)日:2024-07-23

    申请号:US17646941

    申请日:2022-01-04

    摘要: A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).

    RADIO FREQUENCY RECEIVING CIRCUIT AND CHIP COMPRISING THE SAME

    公开(公告)号:US20240235597A9

    公开(公告)日:2024-07-11

    申请号:US18381334

    申请日:2023-10-18

    IPC分类号: H04B1/18 H04B1/16

    CPC分类号: H04B1/18 H04B1/1607

    摘要: A radio frequency receiving circuit includes a first amplification circuit, an oscillation circuit, a frequency mixing and amplification circuit and a dividing circuit. The first amplification circuit is configured to amplify an input signal so as to generate an amplified input signal. The oscillation circuit is configured to provide a local oscillation signal. The frequency mixing and amplification circuit is configured to mix and amplify the amplified input signal according to the local oscillation signal. The dividing circuit is configured to form a dividing loop at a preset frequency for the amplified input signal according to the local oscillation signal when the dividing circuit is driven. A chip including the radio frequency receiving circuit and a main circuit is also provided. The main circuit is configured to drive the dividing circuit when the second input signal is determined to include a signal of the preset frequency.