公开(公告)号：US20240365507A1

公开(公告)日：2024-10-31

申请号：US18647465

申请日：2024-04-26

申请人： Auras Technology Co., Ltd.

发明人： Chia-Hung LI ,  Chun-Chi LAI ,  Chien-YU CHEN

IPC分类号： H05K7/20

CPC分类号： H05K7/20272 ,  H05K7/20254

摘要： A fluid heat dissipation device includes a first cold plate, a first adapter and a fluid delivery pipeline. The first cold plate is used to cool a first heat source, the first adapter is connected to the first cold plate, and the fluid delivery pipeline is connected to the first adapter and fluidly communicated with the first cold plate to improve the production efficiency and quality of the fluid heat dissipation device.

公开(公告)号：US20240365504A1

公开(公告)日：2024-10-31

申请号：US18649888

申请日：2024-04-29

申请人： BITMAIN TECHNOLOGIES INC.

发明人： Zesen NIE ,  Hongshan ZHU ,  Shaoming HUANG ,  Wenkai CUI

IPC分类号： H05K7/20

CPC分类号： H05K7/20254

摘要： The present application provides a cooling device. The cooling device includes a first plate and a second plate. A first surface of the first plate is provided with a runner. The runner is configured for accommodating a fluid. The runner has a zigzag shape. The first surface of the first plate is in contact with the second plate. The cooling device of the present application has an enhanced heat dissipation performance.

公开(公告)号：US20240361090A1

公开(公告)日：2024-10-31

申请号：US18766514

申请日：2024-07-08

申请人： CoolIT Systems, Inc.

发明人： Mike Holden ,  Seyed Kamaleddin Mostafavi Yazdi ,  Randy Kubik

IPC分类号： F28F27/00 ,  G01M3/16 ,  H05K7/20

CPC分类号： F28F27/00 ,  G01M3/16 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20509 ,  F28F2265/16

摘要： In some respects, concepts disclosed herein generally concern systems, methods and components to detect a presence of a liquid externally of a desired primary flow path through a segment of a fluid circuit, e.g., throughout a cooling loop. Some disclosed concepts pertain to systems, methods, and components to direct seepage or leakage of a liquid coolant toward a lead-detection sensor. As but one example, some disclosed liquid-cooled heat exchangers incorporate a leak-detection sensor, which, in turn, can couple with a computing environment that monitors for detected leaks, and, responsive to an indication of a detected leak, invokes a task to control or to mitigate the detected leak.

公开(公告)号：US12104618B2

公开(公告)日：2024-10-01

申请号：US17977200

申请日：2022-10-31

申请人： HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

发明人： John P. Franz ,  Steven J. Dean ,  Ernesto J. Ferrer

IPC分类号： F04D29/042 ,  F04D29/64 ,  H05K7/20

CPC分类号： F04D29/648 ,  F04D29/042 ,  F04D29/642 ,  H05K7/20254 ,  H05K7/20272

摘要： An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.

公开(公告)号：US20240324152A1

公开(公告)日：2024-09-26

申请号：US18578862

申请日：2022-07-15

申请人： YASA LIMITED

发明人： Simon David Hart ,  Tim Woolmer ,  Michael David Pantrey ,  Rajesh Kudikala ,  Daniel Rendell ,  Paul Donald Spendley ,  Timothy James Leopold Farmer ,  Adam Robert Neal ,  Antony John Webster

IPC分类号： H05K7/20 ,  H02M7/00

CPC分类号： H05K7/20927 ,  H02M7/003 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/209

摘要： We describe a power converter cooling arrangement in which a base has a top plate of a thermally conductive material, and a bottom plate and side walls define a chamber. An inlet and outlet are in fluid communication with the chamber, and the chamber is flooded with a cooling fluid that flows between the inlet and outlet. A PCB of a power converter is mounted to, and thermally coupled with, the top plate, where the PCB receives a plurality of power modules (that are used in the power conversion). The base comprises a plurality of fluid channels for flowing cooling fluid therethrough. Each of the fluid channels is arranged to coincide with a location of one or more components mounted to the PCB.

公开(公告)号：US20240298428A1

公开(公告)日：2024-09-05

申请号：US18273931

申请日：2021-12-15

申请人： LS ELECTRIC CO., LTD.

发明人： Seong Eon KIM

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  H05K7/20254

摘要： The present disclosure relates to a heat sink for an electric machine and, more specifically, to a heat sink for an electric semiconductor element used in an electric module, and the present invention is characterized by; comprising a cooling plate having an inlet and an outlet; having a tank which is formed in a plate shape inside the cooling plate and forms a coolant flow path connected to the inlet and the outlet, and having multiple collision pillars continuing from the top surface to the base surface of the tank formed in the tank.

公开(公告)号：US20240298422A1

公开(公告)日：2024-09-05

申请号：US18177499

申请日：2023-03-02

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Nathan Lee Dunfee ,  Christopher M. Marroquin ,  Brandon R. Christenson ,  Arthur J. Higby

IPC分类号： H05K7/20

CPC分类号： H05K7/20254

摘要： A computer hardware assemblage includes a planar, a cooling rail, and a tool. The planar includes a board with a side and an electronic component connected to the board. The cooling rail is connected to the planar and includes a side that faces the side of the board, another side that is opposite to the other side, and a cooling feature that is thermally connected to the electronic component. The tool is connected to the cooling rail such that a side of the tool faces the other side of the cooling rail, and the tool is in direct contact with the planar.

公开(公告)号：US12058838B2

公开(公告)日：2024-08-06

申请号：US18143973

申请日：2023-05-05

申请人： Auto Motive Power Inc.

发明人： Michael Hibbard ,  Areg Parlakyan ,  Gary Randall

IPC分类号： H05K7/20 ,  B60L53/22

CPC分类号： H05K7/20254 ,  B60L53/22 ,  H05K7/20927 ,  B60L2210/10

摘要： An energy management unit (EMU) is disclosed. The EMU including: a cold plate sandwiched between a first printed circuit board (PCB) and a second PCB, the cold plate comprising one or more magnetics; wherein the cold plate is configured to cool both the first PCB and the second PCB.

公开(公告)号：US12058837B2

公开(公告)日：2024-08-06

申请号：US17484800

申请日：2021-09-24

申请人： BAIDU USA LLC

发明人： Tianyi Gao

IPC分类号： H05K7/20

CPC分类号： H05K7/20254 ,  H05K7/20272 ,  H05K7/20781

摘要： In one embodiment, an electronic device cooling package includes an enclosure to house an electronics package, the enclosure including at least one panel with an integrated conducting plate exposed to both an inner surface of the at least one panel and an outer surface of the at least one panel. The electronic device cooling package further includes a mounting mechanism attached to the enclosure to detachably couple a cooling device to the outer surface of the at least one panel of the enclosure. Different electronics packaged within the cooling package includes different co-design of the cooling package and cooling devices.

公开(公告)号：US20240260238A1

公开(公告)日：2024-08-01

申请号：US18623945

申请日：2024-04-01

申请人： Nvidia Corporation

发明人： Ali Heydari

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  H05K7/20254 ,  H05K7/20781

摘要： Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.