发明公开
- 专利标题： COOLING DEVICE
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申请号： US18649888申请日： 2024-04-29
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公开(公告)号： US20240365504A1公开(公告)日： 2024-10-31
- 发明人: Zesen NIE , Hongshan ZHU , Shaoming HUANG , Wenkai CUI
- 申请人： BITMAIN TECHNOLOGIES INC.
- 申请人地址： CN Beijing
- 专利权人： BITMAIN TECHNOLOGIES INC.
- 当前专利权人： BITMAIN TECHNOLOGIES INC.
- 当前专利权人地址： CN Beijing
- 优先权： CN 2321021396.9 2023.04.28
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
The present application provides a cooling device. The cooling device includes a first plate and a second plate. A first surface of the first plate is provided with a runner. The runner is configured for accommodating a fluid. The runner has a zigzag shape. The first surface of the first plate is in contact with the second plate. The cooling device of the present application has an enhanced heat dissipation performance.
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