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公开(公告)号:US20240298428A1
公开(公告)日:2024-09-05
申请号:US18273931
申请日:2021-12-15
发明人: Seong Eon KIM
IPC分类号: H05K7/20
CPC分类号: H05K7/20927 , H05K7/20254
摘要: The present disclosure relates to a heat sink for an electric machine and, more specifically, to a heat sink for an electric semiconductor element used in an electric module, and the present invention is characterized by; comprising a cooling plate having an inlet and an outlet; having a tank which is formed in a plate shape inside the cooling plate and forms a coolant flow path connected to the inlet and the outlet, and having multiple collision pillars continuing from the top surface to the base surface of the tank formed in the tank.