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公开(公告)号：US20240357778A1
公开(公告)日：2024-10-24
申请号：US18642833
申请日：2024-04-23
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Qunbo ZHENG , Linfeng ZHONG , Junhao XIA , Tengshen ZHANG , Jinfa ZHANG , Yuanyuan SONG
Abstract: Provided is a power element assembly structure, including a main board, a first heat sink, a second heat sink, an insulating support, a power element, an insulating thermally conductive layer, and a fixture; where a first end of the insulating support is connected to the main board, a second end of the insulating support is connected to a bottom surface of the first heat sink, and there is a distance between the first heat sink and the main board, a top surface of the first heat sink is connected to the second heat sink; and the insulating thermally conductive layer is attached to a lateral surface of the first heat sink, the power element is attached to the insulating thermally conductive layer, and is fixed to the first heat sink by the fixture, and the power element is plugged on the main board.
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公开(公告)号：US20240349466A1
公开(公告)日：2024-10-17
申请号：US18701043
申请日：2022-11-16
Applicant: LG INNOTEK CO., LTD.
Inventor： Jae Hoo JUNG , Ji Hyeon BAIK , Yong Bin LEE
Abstract: A converter comprises: a housing; an electronic component disposed in the housing; and heat dissipation fins protruding from the outer surface of the housing, wherein the heat dissipation fins comprise: a plurality of first heat dissipation fins disposed to be spaced apart from each other; and a plurality of second heat dissipation fins disposed to be spaced apart from each other and disposed between the plurality of first heat dissipation fins that are adjacent to each other, and wherein on the basis of a first direction, the lengths of the first heat dissipation fins are longer than the lengths of the second heat dissipation fins.
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3.发明公开
公开(公告)号：US20240314979A1
公开(公告)日：2024-09-19
申请号：US18182482
申请日：2023-03-13
Applicant: Delphi Technologies IP Limited
Inventor： Alexandre M. S. Reis , Bryan Alan Rohl , Thomas Alan Degenkolb
IPC: H05K7/20 , H01L23/367
CPC classification number: H05K7/20445 , H01L23/3675 , H05K7/209 , H01L25/115
Abstract: A power semiconductor package includes: a first power semiconductor; a cold plate including a floor and a first pedestal extending from the floor, wherein the first pedestal is configured to support the first power semiconductor; a thermal interface material configured to transfer heat from the first power semiconductor to the first pedestal of the cold plate; and a spacer including: a first frame configured to receive at least a portion of the first pedestal, and a second frame configured to receive the thermal interface material; wherein the spacer is configured to provide a uniform thickness of the thermal interface material between the first pedestal of the cold plate and the first power semiconductor.
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公开(公告)号：US20240291403A1
公开(公告)日：2024-08-29
申请号：US18660748
申请日：2024-05-10
Applicant: DCBEL INC.
Inventor： Peter IBRAHIM , Hani VAHEDI , Marc-André FORGET
CPC classification number: H02M7/797 , H02M7/003 , H02M7/483 , H02M7/4837 , H05K7/209 , H05K7/20909
Abstract: A power conversion apparatus with modified cooling properties has been disclosed. The apparatus comprises an AC port, at least one DC port, a chassis, at least one power conversion module mounted in the chassis connectable to off-board conductors and the AC and the at least one DC ports, a module heat sink attached to each one of the at least one power conversion module for cooling the module, wherein the off-board inductors are mounted in the chassis together and separate from modules with one or more of an inductor heat sink and cooling fluid circulator for cooling the inductors.
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公开(公告)号：US20240282527A1
公开(公告)日：2024-08-22
申请号：US18443294
申请日：2024-02-16
Applicant: Robert Bosch GmbH
Inventor： Johannes Ruthardt
Abstract: A capacitor including a surface electrode and a further surface electrode. A first capacitor structure is arranged between a first region of the surface electrode and a further first region of the further surface electrode. The first capacitor structure is electrically connected to the first region of the surface electrode and to the further first region of the further surface electrode. The first region of the surface electrode is arranged on a base side of the capacitor. The further first region of the further surface electrode is arranged on an upper side of the capacitor facing away from the base side. A second capacitor structure is arranged between a second region of the surface electrode and a further second region of the further surface electrode. The second capacitor structure is electrically connected to the second region of the surface electrode and the further second region of the further surface electrode.
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公开(公告)号：US20240268086A1
公开(公告)日：2024-08-08
申请号：US18563051
申请日：2021-07-15
Applicant: HITACHI ASTEMO, LTD.
Inventor： Fusanori NISHIKIMI , Takashi HIRAO , Keigo SARUWATARI
CPC classification number: H05K7/209 , H02M7/003 , H02M1/08 , H05K1/181 , H05K2201/10166
Abstract: A power conversion device includes: a semiconductor module in which a semiconductor element is sealed; a circuit board on which a drive circuit that drives the semiconductor element via a control terminal of the semiconductor element derived from the semiconductor module is mounted; a first cooling member that is disposed between the semiconductor module and the circuit board and cools the semiconductor module; and a relay terminal that connects the control terminal and the drive circuit. The relay terminal is fixed to a relay member disposed between the semiconductor module and the circuit board.
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7.发明公开
公开(公告)号：US20240253613A1
公开(公告)日：2024-08-01
申请号：US18632719
申请日：2024-04-11
Applicant: ROHM CO., LTD.
Inventor： Hideki SAWADA
CPC classification number: B60W20/10 , H01L23/36 , H01L23/4006 , H01L23/46 , H01L23/473 , H01L25/16 , H01L25/162 , H05K7/1432 , H05K7/209 , H05K7/20927 , H01L2924/13055 , H01L2924/13091
Abstract: An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.
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公开(公告)号：US20240237313A1
公开(公告)日：2024-07-11
申请号：US18405259
申请日：2024-01-05
Applicant: Carrier Corporation
Inventor： Arindom Joardar , Tobias Sienel
IPC: H05K7/20
CPC classification number: H05K7/20936 , H05K7/20318 , H05K7/20327 , H05K7/209 , H05K7/20945
Abstract: A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid. Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.
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公开(公告)号：US12033787B2
公开(公告)日：2024-07-09
申请号：US17393965
申请日：2021-08-04
Applicant: Medtronic, Inc.
Inventor： Robert J. Monson , Andrew T. Fried
CPC classification number: H01F27/2876 , A61N1/3758 , A61N1/378 , A61N1/3787 , H02J7/02 , H02J50/10 , H05K7/20336 , H05K7/209 , H05K7/20936
Abstract: Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.
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公开(公告)号：US12017336B2
公开(公告)日：2024-06-25
申请号：US17051231
申请日：2020-06-22
Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION
Inventor： Steven L C B Hartig, Jr.
CPC classification number: B25F5/008 , H05K1/0209 , H05K7/209
Abstract: Power tool (10) with high emissivity heat sinks (66). One embodiment provides a power tool (10) including a power source, a motor (46), and a power switching network (58) coupled between the power source and the motor (46). The power switching network (58) includes a plurality of switches (62). A heat sink (66) is in a heat-transfer relationship with the plurality of switches (62). The heat sink (66) includes a high emissivity material having an emissivity of greater than or equal to 0.1 and/or a high emissivity finish to increase the emissivity of the heat sink.
