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公开(公告)号:US20240312555A1
公开(公告)日:2024-09-19
申请号:US18303580
申请日:2023-04-20
发明人: Ying-Te Tu
摘要: Disclosed is a memory chip including a plurality of first power pads and a first bus. The first bus is connected to the first power pads. One of the first power pads is coupled to the first bus via a switch device. A data width of the memory chip is determined according to a conduction state of the switch device.
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2.
公开(公告)号:US12087350B2
公开(公告)日:2024-09-10
申请号:US17032191
申请日:2020-09-25
申请人: Intel Corporation
发明人: William Waller , Cheng-Yi Huang
IPC分类号: G11C11/408 , G11C5/02 , G11C5/06 , G11C11/4094
CPC分类号: G11C11/4087 , G11C5/025 , G11C5/06 , G11C11/4085 , G11C11/4094
摘要: Systems, apparatuses and methods may provide for a multi-deck non-volatile memory architecture with an improved wordline bus and bitline bus configuration. For example, wordline busses and bitline busses may be positioned so as to be located over the junctions between two tiles, e.g., between a memory tile and a termination tile and between two memory tiles. Additionally, multi-deck non-volatile memory architectures may utilize data shifting to select which one of a plurality of wordline drivers and a plurality of bitline drivers are in communication with a data circuit of each memory tile. In a configuration where wordline busses and bitline busses have been positioned so as to be located over the junctions between two tiles, such data shifting directions may be able to be implemented with a limited number of shifting direction.
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公开(公告)号:US12081323B2
公开(公告)日:2024-09-03
申请号:US18116957
申请日:2023-03-03
申请人: Intel Corporation
IPC分类号: G06F8/65 , G02B6/38 , G02B6/42 , G02B6/44 , G06F1/18 , G06F1/20 , G06F3/06 , G06F9/30 , G06F9/4401 , G06F9/54 , G06F12/109 , G06F12/14 , G06F13/16 , G06F13/40 , G06F15/16 , G06F16/901 , G08C17/02 , G11C5/02 , G11C7/10 , G11C11/56 , G11C14/00 , H03M7/30 , H03M7/40 , H04B10/25 , H04L41/14 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L49/00 , H04L49/25 , H04L49/356 , H04L49/45 , H04L67/02 , H04L67/12 , H04L67/306 , H04L69/04 , H04L69/329 , H04Q11/00 , H05K7/14 , B25J15/00 , B65G1/04 , G05D23/19 , G05D23/20 , G06F9/38 , G06F9/50 , G06F11/14 , G06F11/34 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F13/42 , G06F15/80 , G06Q10/06 , G06Q10/0631 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/00 , G11C5/06 , H04J14/00 , H04L9/06 , H04L9/14 , H04L9/32 , H04L12/28 , H04L41/02 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/70 , H04L47/765 , H04L47/78 , H04L47/80 , H04L49/15 , H04L49/55 , H04L61/00 , H04L67/00 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/51 , H04Q1/04 , H04W4/02 , H04W4/80 , H05K1/02 , H05K1/18 , H05K5/02 , H05K7/20 , H05K13/04
CPC分类号: H04L43/08 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G06F1/183 , G06F1/20 , G06F3/0613 , G06F3/0625 , G06F3/064 , G06F3/0653 , G06F3/0655 , G06F3/0664 , G06F3/0665 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/30036 , G06F9/4401 , G06F9/544 , G06F12/109 , G06F12/1408 , G06F13/1668 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F15/161 , G06F16/9014 , G08C17/02 , G11C5/02 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/3086 , H03M7/4056 , H03M7/4081 , H04B10/25891 , H04L41/145 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L49/00 , H04L49/25 , H04L49/357 , H04L49/45 , H04L67/02 , H04L67/306 , H04L69/04 , H04L69/329 , H04Q11/0003 , H05K7/1442 , B25J15/0014 , B65G1/0492 , G05D23/1921 , G05D23/2039 , G06F3/061 , G06F3/0611 , G06F3/0616 , G06F3/0619 , G06F3/0631 , G06F3/0638 , G06F3/0647 , G06F3/0658 , G06F3/0659 , G06F3/067 , G06F9/3887 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F13/161 , G06F13/1694 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C2200/00 , G11C5/06 , H03M7/30 , H03M7/3084 , H03M7/40 , H03M7/4031 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04J14/00 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/15 , H04L49/555 , H04L61/00 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/34 , H04L67/51 , H04Q1/04 , H04Q11/00 , H04Q11/0005 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y02D10/00 , Y02P90/30 , Y04S10/50 , Y04S10/52 , Y10S901/01
摘要: Embodiments are generally directed apparatuses, methods, techniques and so forth determine an access level of operation based on an indication received via one or more network links from a pod management controller, and enable or disable a firmware update capability for a firmware device based on the access level of operation, the firmware update capability to change firmware for the firmware device. Embodiments may also include determining one or more configuration settings of a plurality of configuration settings to enable for configuration based on the access level of operation, and enable configuration of the one or more configuration settings.
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公开(公告)号:US20240257897A1
公开(公告)日:2024-08-01
申请号:US18623201
申请日:2024-04-01
申请人: SK hynix Inc.
发明人: Ji-Hwan KIM , Sang-Muk OH
IPC分类号: G11C29/44 , G11C5/02 , G11C5/06 , H01L23/538 , H01L25/065
CPC分类号: G11C29/4401 , G11C5/02 , G11C5/06 , H01L23/5384 , H01L23/5385 , H01L25/0657
摘要: An integrated circuit chip includes a first through electrode and a second through electrode formed through the integrated circuit chip, a transmission circuit suitable for selecting one of signals transmitted through the first and second through electrodes, respectively, and transmitting the selected signal to a data line, in response to a selection signal, and a selection signal generation circuit suitable for generating the selection signal by toggling the selection signal, during a test operation.
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公开(公告)号:US12052862B2
公开(公告)日:2024-07-30
申请号:US17549237
申请日:2021-12-13
发明人: Byeung Chul Kim , Shyam Surthi
IPC分类号: H01L27/11556 , G11C5/02 , H01L23/538 , H10B41/27 , H10B43/27
CPC分类号: H10B41/27 , G11C5/025 , H01L23/5386 , H10B43/27
摘要: A microelectronic device comprises a stack structure, a staircase structure, an etch stop material, and insulative material. The stack structure comprises conductive structures, and air gaps vertically alternating with the conductive structures. The staircase structure is within the stack structure and has steps comprising edges of at least some of the conductive structures of the stack structure. The etch stop material continuously extends over the conductive structures and at least partially defines horizontal boundaries of the air gaps. The insulative material overlies the etch stop material. Additional microelectronic devices, memory devices, electronic systems, and methods are also disclosed.
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公开(公告)号:US12040041B2
公开(公告)日:2024-07-16
申请号:US17448754
申请日:2021-09-24
发明人: Kurt D. Beigel , Scott E. Sills
IPC分类号: G11C5/02 , H01L21/308 , H01L21/822 , H01L21/8238 , H01L27/02 , H01L27/06 , H01L27/092 , H01L29/66 , H01L29/786 , H03K19/0948 , H10B63/00 , G11C5/14 , G11C7/06 , G11C7/12 , G11C8/08 , G11C8/10 , G11C29/44
CPC分类号: G11C5/025 , H01L21/308 , H01L21/8221 , H01L21/823828 , H01L21/823857 , H01L21/823878 , H01L21/823885 , H01L27/0207 , H01L27/0688 , H01L27/092 , H01L29/66742 , H01L29/78642 , H03K19/0948 , H10B63/00 , G11C5/14 , G11C7/06 , G11C7/12 , G11C8/08 , G11C8/10 , G11C29/4401
摘要: A semiconductor device comprises a stack structure comprising decks each comprising a memory element level comprising memory elements, and a control logic level in electrical communication with the memory element level and comprising control logic devices. At least one of the control logic devices of the control logic level of one or more of the decks comprises at least one device exhibiting a gate electrode shared by neighboring vertical transistors thereof. A control logic assembly, a control logic device, an electronic system, a method of forming a control logic device, and a method of operating a semiconductor device are also described.
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公开(公告)号:US12039333B2
公开(公告)日:2024-07-16
申请号:US18061370
申请日:2022-12-02
申请人: SK hynix Inc.
发明人: Dong Uk Lee , Seung Gyu Jeong , Dong Ha Jung
IPC分类号: G06F9/30 , G06F9/48 , G06F12/02 , G06F12/0882 , G06F13/16 , G11C5/02 , G11C11/4093 , G11C29/42 , G11C29/44
CPC分类号: G06F9/30047 , G06F9/4818 , G06F12/0246 , G06F12/0882 , G06F13/1663 , G11C5/025 , G11C11/4093 , G11C29/42 , G11C29/44
摘要: A data processing system includes a compute blade generating a write command to store data and a read command to read the data, and a memory blade. The compute blade has a memory that stores information about performance characteristics of each of a plurality of memories, and determines priority information through which eviction of a cache line is carried out based on the stored information.
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公开(公告)号:US20240221799A1
公开(公告)日:2024-07-04
申请号:US18609522
申请日:2024-03-19
申请人: KIOXIA CORPORATION
CPC分类号: G11C7/1063 , G11C5/025 , G11C7/222
摘要: In one embodiment, a semiconductor storage device includes a plurality of memory chips, at least one of the memory chips including a first controller configured to be shifted to a wait state of generating a peak current, before generating the peak current in accordance with a command. The device further includes a control chip including a second controller configured to search a state of the first controller and control, based on a result of searching the state of the first controller, whether or not to issue a cancel instruction for the wait state to the first controller that has been shifted to the wait state.
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9.
公开(公告)号:US12026399B2
公开(公告)日:2024-07-02
申请号:US17201767
申请日:2021-03-15
申请人: SK hynix Inc.
发明人: Soo Bin Lim
CPC分类号: G06F3/0659 , G06F3/0604 , G06F3/0673 , G06F11/1068 , G11C5/025 , G11C5/06 , G11C29/52 , H01L24/06 , H01L25/0655 , H01L2224/06181 , H01L2924/1434
摘要: A semiconductor apparatus includes a substrate, a first die, and a second die. The substrate includes first and second byte pads of a first channel and first and second byte pad of a second channel. First byte pads of the first die are respectively coupled to the first byte pads of the first channel, and second byte pads of the first die are respectively coupled to the second byte pads of the first channel. The second die, as disposed, is rotated by 180° with respect to the first die. First byte pads of the second die are respectively coupled to the second byte pads of the second channel, and second byte pads of the second die are respectively coupled to the first byte pads of the second channel.
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公开(公告)号:US20240185911A1
公开(公告)日:2024-06-06
申请号:US18443979
申请日:2024-02-16
发明人: Yi-Tzu Chen , Ching-Wei Wu , Hau-Tai Shieh , Hung-Jen Liao
IPC分类号: G11C11/408 , G11C5/02 , G11C5/06 , G11C11/4093
CPC分类号: G11C11/4085 , G11C5/025 , G11C5/06 , G11C11/4093
摘要: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.
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