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公开(公告)号:US20180347447A1
公开(公告)日:2018-12-06
申请号:US15779860
申请日:2017-01-31
申请人: Mitsuba Corporation
CPC分类号: F01P7/04
摘要: Provided is a cooling fan controller connected to a host controller via a first signal line and a second signal line and configured to control rotation of a cooling fan on the basis of a rotation command output from the controller via the first signal line, the cooling fan controller including: an abnormality detector configured to detect an abnormality of a monitoring target in a mechanism configured to control the cooling fan; and an output part configured to output a first signal according to rotation of the cooling fan to the second signal line when the abnormality is not detected by the abnormality detector and configured to output a second signal different from the first signal to the second signal line when the abnormality is detected by the abnormality detector.
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公开(公告)号:US11984773B2
公开(公告)日:2024-05-14
申请号:US17270864
申请日:2019-03-08
申请人: MITSUBA Corporation
IPC分类号: H02K11/33 , F04D25/06 , F04D25/08 , F04D29/58 , H01L23/28 , H05K1/02 , H05K1/05 , H05K3/28 , H05K7/20 , H01L23/467
CPC分类号: H02K11/33 , F04D25/06 , F04D25/08 , F04D29/5813 , H01L23/28 , H05K1/0204 , H05K1/05 , H05K3/284 , H05K7/2039 , H01L23/467 , H02K2211/03 , H05K2201/066 , H05K2201/10159
摘要: A driver for motors according to the present invention is provided with: an aluminum substrate (10) which forms one surface of a housing; an insulating layer (11) which is formed on a surface of the aluminum substrate (10); a plurality of electronic elements (13) which are bonded onto a surface of the insulating layer (11), said surface being on a side opposite to the aluminum substrate (10); and a resin member (14) that covers the surface onto which the electronic elements (13) are bonded. This driver for motors is characterized in that the resin member (14) is obtained by integrating a mold resin part (20) which covers the electronic elements (13) from the upper surface side, a connector (21) which is electrically connected to the electronic elements (13), and a fitting part (22) which is used for fitting to a motor.
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公开(公告)号:US10117341B2
公开(公告)日:2018-10-30
申请号:US15518293
申请日:2015-10-07
申请人: Mitsuba Corporation
发明人: Takahiko Ogane , Fumiaki Koshio , Wataru Kusumoto , Masamichi Ishii , Yoshihisa Yamada , Iwao Tsurubuchi
IPC分类号: H05K5/00 , H01L25/07 , H02G3/10 , B29C70/72 , B29C70/84 , B29C70/88 , B29D99/00 , H01R13/50 , H01R27/02 , H01R43/18 , H05K5/02 , H05K5/06 , B29L31/34
摘要: A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).
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公开(公告)号:US11452228B2
公开(公告)日:2022-09-20
申请号:US17277292
申请日:2020-02-13
申请人: MITSUBA Corporation
摘要: A driver is provided. A driver (1) includes an aluminum substrate (10) to which electronic components (13) are joined, and a resin member (20) that covers the electronic components (13). The resin member (20) has a first resin portion (21) that covers the electronic components (13) and a second resin portion (22) that covers the first resin portion (21). The hardness of the first resin portion (21) is lower than the hardness of the second resin portion (22).
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公开(公告)号:US20180076695A1
公开(公告)日:2018-03-15
申请号:US15560199
申请日:2016-05-27
申请人: Mitsuba Corporation
CPC分类号: H02K11/33 , H02K5/225 , H02K9/22 , H02K11/02 , H02K11/30 , H02K29/08 , H02P6/28 , H02P29/00 , H05K3/32
摘要: A control apparatus includes a terminal that includes a plurality of electrically conductive plate materials, a base member on which the terminal is provided, and an electronic component that includes a plurality of electronic elements which are electrically connected to the terminal, wherein a window part from which part of the terminal is exposed is formed on the base member so as to penetrate in a thickness direction of the base member, and an extension electronic component arrangement part is provided on the base member, and wherein the electronic component is electrically connected to the terminal that is exposed from the window part, and an electronic component is electrically connectable selectively between a plurality of bus bars by the extension electronic component arrangement part.
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公开(公告)号:US20170325341A1
公开(公告)日:2017-11-09
申请号:US15518293
申请日:2015-10-07
申请人: Mitsuba Corporation
发明人: Takahiko Ogane , Fumiaki Koshio , Wataru Kusumoto , Masamichi Ishii , Yoshihisa Yamada , Iwao Tsurubuchi
IPC分类号: H05K5/00 , H01R43/18 , H01R27/02 , B29C70/72 , H05K5/02 , B29D99/00 , B29C70/88 , B29C70/84 , H01R13/50 , B29L31/34
CPC分类号: H05K5/0017 , B29C70/72 , B29C70/84 , B29C70/882 , B29D99/006 , B29K2995/0069 , B29L2031/3481 , H01L25/07 , H01R13/50 , H01R27/02 , H01R43/18 , H02G3/105 , H05K5/0034 , H05K5/0217 , H05K5/065
摘要: A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).
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