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1.发明公开公开(公告)号：US20240334641A1
公开(公告)日：2024-10-03
申请号：US18619681
申请日：2024-03-28
Applicant: Siemens Aktiengesellschaft
Inventor： Matthias Eisner , Nina Müller
IPC: H05K7/20 , H01L23/367 , H01L23/467
CPC classification number: H05K7/20145 , H01L23/3672 , H01L23/467
Abstract: An electronics arrangement contains a printed circuit board (PCB), a semiconductor device and a heat sink. A first side of the semiconductor device points toward the PCB and a second side, opposite the first side, bears the heat sink, which is thermally connected to the semiconductor device. A fan is provided for producing an airflow flowing around the heat sink. An air guide device is mounted on the PCB and is configured such that, together with the PCB, it forms an air duct having an air duct inlet and an air duct outlet. The airflow flowing into the air duct flows through the air duct inlet and leaves through the air duct outlet. The air guide device has an air guide ramp that is arranged in the area of the air duct inlet such that the airflow flowing into the air duct inlet is deflected toward the heat sink.
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公开(公告)号：US12068225B2
公开(公告)日：2024-08-20
申请号：US17878949
申请日：2022-08-02
Applicant: WHIRLPOOL CORPORATION
Inventor： Nelson Rene Garcia-Polanco , John Piero Piero Doyle , Raffaele Paganini , Francesco Mastrangelo
IPC: H01L23/467 , F28F13/02 , F28F13/12 , F28D21/00
CPC classification number: H01L23/467 , F28F13/02 , F28F13/12 , F28D2021/0029
Abstract: A device is provided that includes a heat conductive structure; a heat transfer structure for extracting heat from the heat conductive structure by means of a boundary layer; a motor for rotating the heat transfer structure relative to the heat conductive structure; and a vertical fixing mechanism for allowing the heat transfer structure to rotate above the heat transfer structure without making contact with the heat transfer structure so as to define a boundary layer between the heat conductive structure and heat transfer structure, wherein the heat transfer structure extracts heat from the heat conductive structure by means of the boundary layer, and wherein the heat conductive structure includes small geometric turbulators.
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公开(公告)号：US12027446B2
公开(公告)日：2024-07-02
申请号：US17984254
申请日：2022-11-10
Inventor： Tung-Liang Shao , Lawrence Chiang Sheu , Chih-Hang Tung , Chen-Hua Yu , Yi-Li Hsiao
IPC: H01L23/473 , H01L23/467
CPC classification number: H01L23/473 , H01L23/467
Abstract: An apparatus includes a semiconductor component and a cooling structure. The cooling structure is over a back side of the semiconductor component. The cooling structure includes a housing, a liquid delivery device and a gas exhaust device. The housing includes a cooling space adjacent to the semiconductor component. The liquid delivery device is connected to an inlet of the housing and is configured to deliver a liquid coolant into the cooling space from the inlet. The gas exhaust device is connected to an outlet of the housing and is configured to lower a pressure in the housing.
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公开(公告)号：US11871513B2
公开(公告)日：2024-01-09
申请号：US17564120
申请日：2021-12-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masao Kondo , Shigeki Koya , Kenji Sasaki
IPC: H05K1/02 , H05K1/11 , H05K3/24 , H01L21/48 , H01L23/538 , H01L23/467
CPC classification number: H05K1/0298 , H01L21/4857 , H01L23/5383 , H01L23/5385 , H05K1/115 , H05K3/245 , H01L23/467 , H05K2201/09618
Abstract: A cavity elongated in one direction is formed in a protective film covering the conductive pattern of the topmost conductive layer of a multilayer wiring substrate. The cavity exposes part of the conductive pattern. A first via-conductor extends downward from the conductive pattern of the topmost conductive layer at least until that of a second conductive layer. Second via-conductors extend downward from the conductive pattern of the second or third conductive layer at least until that of a conductive layer one below. As viewed from above, the first via-conductor and the cavity partially overlap each other. At least two second via-conductors are disposed to sandwich the cavity therebetween. The difference between the smallest gap between the cavity and the second via-conductor at one side and that between the cavity and the second via-conductor at the other side is smaller than the smallest gap between the cavity and the second via-conductors.
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公开(公告)号：US11864348B2
公开(公告)日：2024-01-02
申请号：US17875596
申请日：2022-07-28
Applicant: Gerald Ho Kim
Inventor： Gerald Ho Kim
IPC: H05K7/20 , H05K1/02 , H01L23/367 , H01L23/427 , H01L23/467 , H01L29/06 , F28F3/04 , H05K5/03 , H05K5/04 , H01L23/13
CPC classification number: H05K7/2029 , F28F3/048 , H01L23/367 , H01L23/3675 , H01L23/3677 , H01L23/427 , H01L23/4275 , H01L23/467 , H01L29/0657 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K5/03 , H05K5/04 , H01L23/13 , H01L2924/0002 , H05K2201/066 , H05K2201/09054 , H01L2924/0002 , H01L2924/00
Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.
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公开(公告)号：US11862534B2
公开(公告)日：2024-01-02
申请号：US17498814
申请日：2021-10-12
Inventor： Zonghu Zhu
IPC: H05K7/20 , H01L23/467 , H01L23/38
CPC classification number: H01L23/467 , H01L23/38 , H05K7/20409
Abstract: An adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling which includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The present heat exchanger can adapt to hot surfaces with different curved surface radians and form a surrounded fixed structure with the hot surface to make the conduction cooling unit well-contact surfaces with different radians.
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公开(公告)号：US11817436B2
公开(公告)日：2023-11-14
申请号：US17360862
申请日：2021-06-28
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： Christopher M. Jaggers
IPC: H01L25/10 , H01L25/18 , H01L23/367 , H01L23/427 , H01L23/467 , H01L23/473
CPC classification number: H01L25/105 , H01L25/18 , H01L23/367 , H01L23/427 , H01L23/467 , H01L23/473
Abstract: An apparatus for a common cooling solution for multiple packages of a common height, including: a first die package; a second die package having a same height as the first die package; and a cooling element thermally coupled to the first die package and the second die package by a planar surface of the cooling element.
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公开(公告)号：US11670564B2
公开(公告)日：2023-06-06
申请号：US17341018
申请日：2021-06-07
Applicant: Fractal Heatsink Technologies, LLC
Inventor： Alexander Poltorak
IPC: F28F13/12 , H01L23/367 , H05K7/20 , H01L23/467 , G05B15/02 , H01L23/473 , H01L23/373
CPC classification number: H01L23/367 , F28F13/12 , G05B15/02 , H01L23/467 , H01L23/473 , H05K7/20136 , H05K7/20154 , H05K7/20172 , H05K7/20209 , H05K7/20272 , H05K7/20281 , H05K7/20418 , F28F2210/02 , F28F2215/10 , H01L23/3736
Abstract: A heat sink comprising a heat exchange device having a large-scale morphology over a scale range and a small-scale texture over a scale range, wherein at least one of the large-scale morphology and the small scale texture has a fractal-like self-similarity over a scale range. The large-scale morphology and small-scale texture may be defined and implemented independently, or be provided with a transitional range. The large-scale morphology may be algorithmically optimized according to a set of geometrically constraints. The small-scale texture may be optimized according to aerodynamic parameters and constraints. The heat sink may be dynamically varying, and/or operated in conjunction with a dynamically varying heat transfer medium supply.
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公开(公告)号：US20190230815A1
公开(公告)日：2019-07-25
申请号：US16262143
申请日：2019-01-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Weifeng Hu , Vadim Tsoi , Lei Li
IPC: H05K7/20 , H01L23/467 , H01L23/367
CPC classification number: H05K7/20209 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H04W88/08 , H05K7/20154 , H05K7/20163 , H05K7/20563 , H01L2924/00
Abstract: A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.
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公开(公告)号：US20190208671A1
公开(公告)日：2019-07-04
申请号：US16304007
申请日：2016-06-01
Applicant: Mitsubishi Electric Corporation
Inventor： Hidetoshi KITANAKA , Hiroki KAWAMOTO
IPC: H05K7/20 , H02M7/00 , H02M3/335 , H02M7/5387
CPC classification number: H05K7/20909 , H01L23/467 , H02M3/33569 , H02M7/003 , H02M7/04 , H02M7/48 , H02M7/53871 , H05K7/20154 , H05K7/20172 , H05K7/20209 , H05K7/20863 , H05K7/20918 , H05K7/20945
Abstract: An inside of a housing of a power conversion device is partitioned by partitioning walls, and the power conversion device is configured from: an open part, into which external air flows; a first airtight part that is adjacent to the open part and into which no external air flows; and a second airtight part that is adjacent to the first airtight part and into which external air does not flow. At least two ventilation holes are formed in a partition wall between the first airtight part and the second airtight part. A circulation fan is provided to at least one of the at least two ventilation holes. The outer surface of the first airtight part is provided with a heatsink that dissipates heat transferred from an electronic component placed in the first airtight part, the heatsink being exposed to the open part.
