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    Resin multilayer substrate
    4.
    发明授权
    Resin multilayer substrate 有权

    公开(公告)号：US12052818B2

    公开(公告)日：2024-07-30

    申请号：US17898548

    申请日：2022-08-30

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Atsushi Kasuya ,  Tomohiko Naruoka ,  Noriaki Okuda ,  Kosuke Nishio ,  Nobuo Ikemoto

    IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K3/00

    CPC分类号： H05K1/036 ,  H05K1/0201 ,  H05K1/0215 ,  H05K3/0064 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0323 ,  H05K2201/068

    摘要： A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.

    Substrate
    5.
    发明授权
    Substrate 有权

    公开(公告)号：US12041716B2

    公开(公告)日：2024-07-16

    申请号：US17757880

    申请日：2020-12-18

    申请人： LG INNOTEK CO., LTD.

    发明人： Nam Heon Kim

    IPC分类号： H05K1/02 ,  H05K1/03

    CPC分类号： H05K1/028 ,  H05K1/0313 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/09009

    摘要： A substrate according to an embodiment includes an insulating layer having a grain formed therein extending in a first direction; and a circuit pattern disposed on the insulating layer; wherein the insulating layer includes an upper surface and a plurality of outer side surfaces; wherein the plurality of outer side surfaces includes: a first outer side surface extending in the same first direction as the first direction having the grain formed in the insulating layer; and a second outer side surface extending in a second direction different from the first direction and excluding the first outer side surface, wherein the first outer side surface has a first surface roughness; and wherein the second outer side surface has a second surface roughness different from the first surface roughness.

    PRINTED CIRCUIT BOARD
    7.
    发明公开
    PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240090121A1

    公开(公告)日：2024-03-14

    申请号：US18517393

    申请日：2023-11-22

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Dae Jung BYUN ,  Jung Soo KIM ,  Sang Hyun SIM ,  Chang Min HA ,  Tae Hong MIN ,  Jin Won LEE

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0218 ,  H05K1/024 ,  H05K1/0256 ,  H05K1/0298 ,  H05K2201/0141

    摘要： A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.