公开(公告)号：US20220095449A1

公开(公告)日：2022-03-24

申请号：US17124893

申请日：2020-12-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung BYUN ,  Jung Soo KIM ,  Sang Hyun SIM ,  Chang Min HA ,  Tae Hong MIN ,  Jin Won LEE

IPC: H05K1/02

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

公开(公告)号：US20240090121A1

公开(公告)日：2024-03-14

申请号：US18517393

申请日：2023-11-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jung BYUN ,  Jung Soo KIM ,  Sang Hyun SIM ,  Chang Min HA ,  Tae Hong MIN ,  Jin Won LEE

IPC: H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/024 ,  H05K1/0256 ,  H05K1/0298 ,  H05K2201/0141

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

公开(公告)号：US20220174812A1

公开(公告)日：2022-06-02

申请号：US17199131

申请日：2021-03-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Soo KIM ,  Dae Jung BYUN ,  Sang Hyun SIM ,  Chang Min HA

IPC: H05K1/02

Abstract: A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.

公开(公告)号：US20220095458A1

公开(公告)日：2022-03-24

申请号：US17124814

申请日：2020-12-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Soo KIM ,  Dae Jung BYUN ,  Chang Min HA ,  Sang Hyun SIM

IPC: H05K1/11 ,  H05K1/02

Abstract: A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region.