公开(公告)号：US20220362891A1

公开(公告)日：2022-11-17

申请号：US17765610

申请日：2020-10-02

申请人： Rogers Germany GmbH

发明人： Karsten Schmidt ,  Andreas Meyer ,  Stefan Britting

IPC分类号： B23K35/30 ,  B23K35/34 ,  B23K35/36

摘要： A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.

公开(公告)号：US20220285173A1

公开(公告)日：2022-09-08

申请号：US17056282

申请日：2019-05-14

申请人： Rogers Germany GmbH

发明人： Karsten SCHMIDT ,  Andreas Meyer ,  Eckart Hoene ,  Christoph Marczok ,  Tina Thomas ,  Ruben Kahle

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00

摘要： Electronic module (1) including an encapsulation (20), a carrier substrate (10) enclosed by the encapsulation (20) and having a component side (25) which has a first metallization layer (15) and on which at least one first electronic component (30) is arranged, wherein at least one second metallization layer (35) for at least one second electronic component (31), in particular for controlling the first electronic component (30), is provided on an outer side (A) of the encapsulation (2), wherein the encapsulation (20) has at least one plated-through hole (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and the second electronic component (31).

公开(公告)号：US20160304405A1

公开(公告)日：2016-10-20

申请号：US15102951

申请日：2014-11-28

申请人： ROGERS GERMANY GMBH

发明人： Andreas Meyer ,  Fabian Hierstetter

IPC分类号： C04B35/645 ,  H01L23/498 ,  H01L21/48 ,  C04B37/02 ,  H01L23/373

CPC分类号： C04B35/6455 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  C04B2237/064 ,  C04B2237/068 ,  C04B2237/08 ,  C04B2237/083 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/592 ,  C04B2237/595 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  C04B2237/84 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/022 ,  H05K3/388 ,  H05K2203/04 ,  H01L2924/00

摘要： The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer. Subsequently, the metal layers forming the metal container with the at least one ceramic layer received in the container interior are hot isostatically pressed together in a treatment chamber at a gas pressure between 500 and 2000 bar and at a process temperature between 300° C. and the melting temperature of the metal layers for producing a preferably flat connection of at least one of the metal layers and the at least one ceramic layer, and at least the projecting free edge sections, which are connected to each other, of the metal layers for forming the first and second metallization are subsequently removed.

摘要翻译： 本发明涉及一种用于制造包括第一和第二金属化的金属陶瓷衬底的方法以及结合在第一和第二金属化之间的至少一个陶瓷层。 有利的是，第一和第二金属层和至少一个陶瓷层被叠置在一起，并且使得第一和第二金属层的自由边缘部分分别突出超过至少一个陶瓷层的边缘，并且 第一和第二金属层在突出的自由边缘部分的区域中彼此变形并且彼此直接连接，以形成封闭容器内部的气密密封的金属容器，用于容纳至少一个陶瓷层 。 随后，形成具有容纳在容器内部中的至少一个陶瓷层的金属容器的金属层在500-2000巴之间的气体压力和在300℃和200℃之间的过程温度下被热等静压在处理室中 金属层的熔融温度，用于产生金属层和至少一个陶瓷层中的至少一个的优选平坦连接，以及至少彼此连接的突出的自由边缘部分，用于 随后除去形成第一和第二金属化。

公开(公告)号：US20140334103A1

公开(公告)日：2014-11-13

申请号：US14339856

申请日：2014-07-24

申请人： Rogers Germany GmbH

发明人： Jurgen Schulz-Harder ,  Andreas Meyer

IPC分类号： H05K7/20 ,  H01L23/373

CPC分类号： H05K7/20509 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/00

摘要： An electric unit having at least one cooler structure and at least one electric module with at least one electric element on a metal-ceramic substrate.

摘要翻译： 具有至少一个冷却器结构的电气单元和在金属陶瓷基板上具有至少一个电气元件的至少一个电气模块。

公开(公告)号：US12035477B2

公开(公告)日：2024-07-09

申请号：US17910151

申请日：2021-03-08

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Karsten Schmidt ,  Tilo Welker

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/42

CPC分类号： H05K1/181 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09545 ,  H05K2201/10666 ,  H05K2203/049

摘要： An electronics module (100), especially a power electronics module, comprising



a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21),
an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and
a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40),
wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).

公开(公告)号：US11848248B2

公开(公告)日：2023-12-19

申请号：US17055820

申请日：2019-05-14

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Vitalij Gil ,  László Müller ,  Rainer Herrmann ,  Stefan Britting

IPC分类号： H01L23/373 ,  H01L23/15 ,  H01L23/473

CPC分类号： H01L23/3735 ,  H01L23/15 ,  H01L23/473

摘要： A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprising



a metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), and
a distribution structure (40) made of plastic for supplying the fluid channel (30) with the fluid,


wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).

公开(公告)号：US11845700B2

公开(公告)日：2023-12-19

申请号：US16768340

申请日：2018-11-21

申请人： Rogers Germany GmbH

发明人： Maximilian Engel ,  Xinhe Tang ,  Stefan Britting

IPC分类号： C04B37/02 ,  B32B9/00

CPC分类号： C04B37/021 ,  B32B9/005 ,  C04B2237/407 ,  C04B2237/54

摘要： A method for producing a semi-finished metal product (2), in particular a semi-finished copper product, for a metal-copper substrate, in particular for a copper-ceramic substrate, including:



providing a first metal layer (11), in particular a first copper layer, and a second metal layer (12), in particular a second copper layer,
joining the first metal layer (11) and the second metal layer (12) to form the semi-finished metal product (2), wherein, chronologically before the first metal layer (11) is joined to the second metal layer (12) by means of different temperature treatments, a grain growth in the first metal layer (11) and/or the second metal layer (12) is initiated in such a way that in the produced semi-finished metal product (2), in particular in the produced metal-copper substrate, a first grain size in the first metal layer (11) differs from a second grain size in the second metal layer (12).

公开(公告)号：US20230137460A1

公开(公告)日：2023-05-04

申请号：US16628579

申请日：2018-07-04

申请人： Rogers Germany GmbH

发明人： Karsten Schmidt ,  Stefan Britting ,  Andreas Meyer ,  Rainer Herrmann ,  Martin Reger

IPC分类号： H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40

摘要： A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:
providing the carrier layer (1),
realizing a passage recess (2) in the carrier layer (1),
at least partially filling the passage recess (2) with a paste (3), and
performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.

公开(公告)号：US20230094926A1

公开(公告)日：2023-03-30

申请号：US17910151

申请日：2021-03-08

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Karsten Schmidt ,  Tilo Welker

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/42

摘要： An electronics module (100), especially a power electronics module, comprising a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21), an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40), wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).

公开(公告)号：US20220415754A1

公开(公告)日：2022-12-29

申请号：US17616047

申请日：2021-01-25

申请人： Rogers Germany GmbH

发明人： Ralf Lechner ,  Thomas Rupp

IPC分类号： H01L23/473 ,  H01L23/373 ,  H01L21/48 ,  H01S5/024

摘要： A method of manufacturing a cooling element, including: providing at least one first metal layer and at least one second metal layer, oxidizing the at least one first metal layer and/or the at least one second metal layer, structuring the at least one first metal layer and/or the at least one second metal layer to form at least one recess, joining the at least one first metal layer and the at least one second metal layer to form the cooling element, wherein, in the joined state, at least a partial section of a cooling channel in the cooling element is formed by the recess in the at least one first metal layer and/or the at least one second metal layer, and wherein, prior to the joining, an inner side of the recess is provided at least in sections free of an oxidized surface.