公开(公告)号：US20220285173A1

公开(公告)日：2022-09-08

申请号：US17056282

申请日：2019-05-14

申请人： Rogers Germany GmbH

发明人： Karsten SCHMIDT ,  Andreas Meyer ,  Eckart Hoene ,  Christoph Marczok ,  Tina Thomas ,  Ruben Kahle

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00

摘要： Electronic module (1) including an encapsulation (20), a carrier substrate (10) enclosed by the encapsulation (20) and having a component side (25) which has a first metallization layer (15) and on which at least one first electronic component (30) is arranged, wherein at least one second metallization layer (35) for at least one second electronic component (31), in particular for controlling the first electronic component (30), is provided on an outer side (A) of the encapsulation (2), wherein the encapsulation (20) has at least one plated-through hole (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and the second electronic component (31).