- 专利标题： METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAMIC AND CARRIER LAYER HAVING A VIA
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申请号： US16628579申请日： 2018-07-04
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公开(公告)号： US20230137460A1公开(公告)日： 2023-05-04
- 发明人: Karsten Schmidt , Stefan Britting , Andreas Meyer , Rainer Herrmann , Martin Reger
- 申请人： Rogers Germany GmbH
- 申请人地址： DE Eschenbach
- 专利权人： Rogers Germany GmbH
- 当前专利权人： Rogers Germany GmbH
- 当前专利权人地址： DE Eschenbach
- 优先权： DE102017114891.4 20170704
- 国际申请： PCT/EP2018/068022 WO 20180704
- 主分类号： H01L23/15
- IPC分类号： H01L23/15 ; H01L23/498 ; H05K1/03 ; H05K1/09 ; H05K3/40
摘要：
A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:
providing the carrier layer (1),
realizing a passage recess (2) in the carrier layer (1),
at least partially filling the passage recess (2) with a paste (3), and
performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.
providing the carrier layer (1),
realizing a passage recess (2) in the carrier layer (1),
at least partially filling the passage recess (2) with a paste (3), and
performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.
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