公开(公告)号：US20230171887A1

公开(公告)日：2023-06-01

申请号：US17921024

申请日：2021-04-28

申请人： Rogers Germany GmbH

发明人： Tilo Welker ,  Karsten Schmidt ,  Stefan Britting

IPC分类号： H05K1/03 ,  H05K3/38 ,  C04B37/02

CPC分类号： H05K1/0306 ,  H05K3/388 ,  C04B37/026 ,  C04B37/021 ,  H05K2201/0355 ,  C04B2237/407

摘要： A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.

公开(公告)号：US20230031736A1

公开(公告)日：2023-02-02

申请号：US17783979

申请日：2020-12-03

申请人： Rogers Germany GmbH

发明人： Stefan Britting ,  Tilo Welker ,  Karsten Schmidt

IPC分类号： B23K35/02

摘要： A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.

公开(公告)号：US10821704B2

公开(公告)日：2020-11-03

申请号：US15744363

申请日：2016-07-18

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Karsten Schmidt

IPC分类号： B32B15/20 ,  B32B9/00 ,  B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/04 ,  B32B9/06 ,  B32B29/08 ,  H01L23/373 ,  H05K1/05 ,  B32B15/04 ,  B32B15/12 ,  B32B29/00 ,  C25D11/04 ,  C25D17/12 ,  C25D11/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  C25D11/08

摘要： The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodized for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2′) or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6′).

公开(公告)号：US20230164913A1

公开(公告)日：2023-05-25

申请号：US17921221

申请日：2021-03-24

申请人： Rogers Germany GmbH

发明人： Fabian Wagle ,  Tilo Welker ,  Andreas Meyer ,  Karsten Schmidt

IPC分类号： H05K1/03 ,  C04B35/645 ,  H05K3/38 ,  C04B37/02

CPC分类号： H05K1/0306 ,  C04B35/6455 ,  H05K3/38 ,  C04B37/026 ,  C04B37/021 ,  C04B2235/6581 ,  C04B2237/407 ,  C04B2237/706 ,  H05K2201/0355 ,  C04B2237/708

摘要： The invention relates to a process for producing a metal-ceramic substrate (1), comprising:



providing a ceramic element (10) and a metal layer,
providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer,
forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).

公开(公告)号：US12035477B2

公开(公告)日：2024-07-09

申请号：US17910151

申请日：2021-03-08

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Karsten Schmidt ,  Tilo Welker

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/42

CPC分类号： H05K1/181 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09545 ,  H05K2201/10666 ,  H05K2203/049

摘要： An electronics module (100), especially a power electronics module, comprising



a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21),
an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and
a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40),
wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).

公开(公告)号：US20230137460A1

公开(公告)日：2023-05-04

申请号：US16628579

申请日：2018-07-04

申请人： Rogers Germany GmbH

发明人： Karsten Schmidt ,  Stefan Britting ,  Andreas Meyer ,  Rainer Herrmann ,  Martin Reger

IPC分类号： H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40

摘要： A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:
providing the carrier layer (1),
realizing a passage recess (2) in the carrier layer (1),
at least partially filling the passage recess (2) with a paste (3), and
performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.

公开(公告)号：US20230094926A1

公开(公告)日：2023-03-30

申请号：US17910151

申请日：2021-03-08

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Karsten Schmidt ,  Tilo Welker

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/42

摘要： An electronics module (100), especially a power electronics module, comprising a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21), an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40), wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).

公开(公告)号：US20220362891A1

公开(公告)日：2022-11-17

申请号：US17765610

申请日：2020-10-02

申请人： Rogers Germany GmbH

发明人： Karsten Schmidt ,  Andreas Meyer ,  Stefan Britting

IPC分类号： B23K35/30 ,  B23K35/34 ,  B23K35/36

摘要： A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.

公开(公告)号：US11945054B2

公开(公告)日：2024-04-02

申请号：US17765610

申请日：2020-10-02

申请人： Rogers Germany GmbH

发明人： Karsten Schmidt ,  Andreas Meyer ,  Stefan Britting

IPC分类号： B23K1/00 ,  B23K35/30 ,  B23K35/34 ,  B23K35/36 ,  B23K101/38 ,  B23K103/00 ,  B23K103/08 ,  B23K103/16 ,  B23K103/18

CPC分类号： B23K35/302 ,  B23K1/0008 ,  B23K1/0016 ,  B23K35/3006 ,  B23K35/34 ,  B23K35/36 ,  B23K2101/38 ,  B23K2103/08 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/52

摘要： A method for manufacturing a metal-ceramic substrate (1) includes



providing a ceramic layer (10), a metal layer (20) and a solder layer (30)
coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40),
arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and
bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.

公开(公告)号：US10940671B2

公开(公告)日：2021-03-09

申请号：US15744349

申请日：2016-07-18

申请人： Rogers Germany GmbH

发明人： Andreas Meyer ,  Karsten Schmidt

IPC分类号： B32B9/00 ,  B32B15/04 ,  B32B15/12 ,  B32B15/20 ,  B32B29/00 ,  B32B29/08 ,  B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/04 ,  B32B9/06 ,  C25D11/00 ,  C25D11/04 ,  C25D17/12 ,  H01L23/373 ,  H05K1/05 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  C25D11/08

摘要： A substrate (1, 10) for electrical circuits, comprising at least one metal layer (2,3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2,3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a′, 6a″, 6b′, 6b″) to the metal layer (2,3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a′, 6a″, 6b′,6b″).