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    WIRING BOARD
    2.
    发明公开
    WIRING BOARD 审中-公开

    公开(公告)号：US20240049384A1

    公开(公告)日：2024-02-08

    申请号：US18381789

    申请日：2023-10-19

    申请人： DAI NIPPON PRINTING CO., LTD.

    发明人： Hiroki FURUSHOU ,  Atsuko CHIGIRA ,  Toshio SASAO ,  Hiroshi MAWATARI

    IPC分类号： H05K1/02 ,  B32B15/04 ,  H01L23/40 ,  H05K3/38

    CPC分类号： H05K1/0298 ,  B32B15/04 ,  H01L23/40 ,  H05K3/38

    摘要： A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

    IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME
    6.
    发明申请
    IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME 审中-公开

    公开(公告)号：US20180263132A1

    公开(公告)日：2018-09-13

    申请号：US15976242

    申请日：2018-05-10

    申请人： Medtronic, Inc.

    发明人： David A. RUBEN ,  Michael S. SANDLIN

    IPC分类号： H05K5/06 ,  A61N1/375 ,  H05K3/38 ,  H05K7/06

    CPC分类号： H05K5/066 ,  A61N1/3754 ,  H05K3/32 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06 ,  H05K2203/107

    摘要： Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    WIRING BODY, WIRING BOARD, AND TOUCH SENSOR
    10.
    发明申请
    WIRING BODY, WIRING BOARD, AND TOUCH SENSOR 审中-公开

    公开(公告)号：US20170277290A1

    公开(公告)日：2017-09-28

    申请号：US15508853

    申请日：2016-01-29

    申请人： FUJIKURA LTD.

    发明人： Makoto Murakami

    IPC分类号： G06F3/041 ,  H05K1/02 ,  H05K3/20

    CPC分类号： G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/20 ,  H05K3/207 ,  H05K3/38 ,  H05K2201/09045 ,  H05K2201/09681 ,  H05K2203/0502

    摘要： A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrusion that protrudes from the main surface toward a side of the conductive portion provided on the smooth portion to correspond to the conductive portion. The protrusion comes into contact with the contact surface and includes a concave-convex surface complementary to the concave-convex shape of the contact surface. The contact surface is positioned on a side of the top surface with respect to the main surface and a unit length of the contact surface is larger than a unit length of the top surface.