公开(公告)号：US20250054988A1

公开(公告)日：2025-02-13

申请号：US18722471

申请日：2022-12-15

Applicant: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

Inventor： Francesco Liberale ,  Riccardo Rino Pieri ,  Maurizio Biso ,  Marie-Pierre Labeau ,  Patrick Moreau

IPC: H01M4/62 ,  C09D5/00 ,  C09D5/24 ,  C09D133/02 ,  H01M4/04 ,  H01M4/36 ,  H01M4/66 ,  H01M10/0525

Abstract: The present invention relates to a primer that improves adhesiveness between an electro active material and a current collector, and to an electrode comprising the same.

公开(公告)号：US20250015292A1

公开(公告)日：2025-01-09

申请号：US18711343

申请日：2022-11-17

Applicant: TOAGOSEI CO., LTD. ,  THE SCHOOL CORPORATION KANSAI UNIVERSITY

Inventor： Naohiko SAITO ,  Tomoko NAKANO ,  Daisuke OKUDA ,  Chihiro MURATA ,  Masashi ISHIKAWA

IPC: H01M4/62 ,  C09D5/24 ,  C09D7/43 ,  C09D7/62 ,  C09D7/65 ,  C09D133/02 ,  H01M4/13 ,  H01M4/38 ,  H01M10/052

Abstract: An electrode mixture layer-forming composition for a lithium-sulfur secondary battery, said composition contains a carboxyl group-containing polymer or a salt thereof serving as a binder, a sulfur-based active material, a thickening agent, and water.

公开(公告)号：US20240409756A1

公开(公告)日：2024-12-12

申请号：US18700829

申请日：2022-10-26

Applicant: TOAGOSEI CO., LTD.

Inventor： Kenichi YOSHIMORI ,  Naohiko SAITO ,  Tomoko NAKANO

IPC: C09D5/24 ,  C08F220/06 ,  C08F220/58 ,  C09D7/61 ,  C09D133/02 ,  C09D133/26 ,  H01M4/62

Abstract: The present invention provides a binder for a secondary battery electrode, capable of improving toughness of a binder coating film after immersion in an electrolytic solution, electrolytic solution resistance of a secondary battery electrode mixture layer, and cycle characteristics of a secondary battery. The binder for the secondary battery electrode, the binder containing a carboxyl group-containing polymer or a salt thereof, in which the carboxyl group-containing polymer contains 15 mass % or more and 99.9 mass % or less of a structural unit derived from an ethylenically unsaturated carboxylic acid monomer and 0.1 mass % or more and 85 mass % or less of a structural unit derived from a keto group-containing ethylenically unsaturated monomer relative to all the structural units, and at least a part of the keto group is a functional group used to form a chemical bond with a compound having reactivity with the keto group.

公开(公告)号：US12084193B2

公开(公告)日：2024-09-10

申请号：US17657534

申请日：2022-03-31

Applicant: SOUTH DAKOTA BOARD OF REGENTS

Inventor： Haiping Hong ,  Christian Widener ,  Gregory Lee Christensen

IPC: B64D31/06 ,  B64D31/04 ,  B64D31/08 ,  B64D43/00 ,  C08K3/04 ,  C08K3/38 ,  C09D5/24 ,  C09D7/61 ,  C09D133/02 ,  C09D163/00 ,  C09D175/04 ,  G05D1/00

CPC classification number: B64D31/06 ,  B64D31/04 ,  B64D31/08 ,  B64D43/00 ,  C08K3/04 ,  C08K3/38 ,  C08K2201/001 ,  C09D5/24 ,  C09D7/61 ,  C09D133/02 ,  C09D163/00 ,  C09D175/04 ,  G05D1/0661

Abstract: Disclosed herein is a conductive coating composition that includes a functionalized carbon nanomaterial and/or boron nanomaterial and a fluid component. The nanomaterial and fluid component forms hydrogen bond network in the disclosed composition. Because of the formed hydrogen bonds, the disclosed coating exhibits enhanced thermal or electrical conductivity. Also disclosed is a method to improve thermal or electrical conductivity of an existing coating composition.

公开(公告)号：US20240158660A1

公开(公告)日：2024-05-16

申请号：US18284359

申请日：2022-03-23

Applicant: TOSOH CORPORATION

Inventor： Yusuke NEZU ,  Shinya IMATOMI ,  Shimou CHINSON ,  Hiroyuki ITO

IPC: C09D125/08 ,  C09D133/02

CPC classification number: C09D125/08 ,  C09D133/02

Abstract: It is possible to provide a surface treatment agent containing a cell-adhesive polymer, by a surface treatment agent obtained by dissolving a water-insoluble polymer compound including constituents of (A) a monomer having a functional group exhibiting acidity and (B) a monomer having a HLB value (a Griffin's method) in a range of 0 to 5.0, in which a ratio of (A) is 10 to 50 mol %, and a solvent is an alcoholic solvent.

公开(公告)号：US20240150593A1

公开(公告)日：2024-05-09

申请号：US18549005

申请日：2022-03-04

Applicant: PPG Industries Ohio, Inc.

Inventor： Corey James DeDomenic ,  Kristi Maree Allen ,  Elizabeth Stephenie Brown-Tseng ,  Peter Lawrence Votruba-Drzal ,  Silvia Bezer ,  Michael Gerard Olah ,  Steven Edward Bowles ,  Mary Lyn Chong Lim ,  Mark William McMillen

IPC: C09D7/61 ,  C09D5/08 ,  C09D5/44 ,  C09D133/02

CPC classification number: C09D7/61 ,  C09D5/08 ,  C09D5/4407 ,  C09D133/02

Abstract: Disclosed is a sealing composition for treating a metal substrate comprising: a polyolefin component; and a colloidal layered silicate. Also disclosed is a system for treating a metal substrate comprising: a cleaner composition; and/or a pretreatment composition for treating at least a portion of the substrate, the pretreatment composition comprising a Group IVB metal; and a sealing composition for treating at least a portion of the substrate treated with the cleaner composition and/or the pretreated composition, the sealing composition comprising a polyolefin component. Also disclosed is a method of treating a substrate comprising contacting at least a portion of a surface of the substrate with any of the compositions disclosed herein or any of the systems disclosed herein. Also disclosed is a method of treating a substrate comprising passing electric current between a cathode and the substrate, serving as an anode, said cathode and anode being immersed in a sealing composition comprising a polyolefin component. Also disclosed is a substrate comprising a surface treated with any of the compositions disclosed herein, any of the systems disclosed herein, or any of the methods disclosed herein.

公开(公告)号：US20240117203A1

公开(公告)日：2024-04-11

申请号：US18545261

申请日：2023-12-19

Applicant: Henkel AG & Co. KGaA

Inventor： Dipak Tathe ,  Jayesh P. Shah

IPC: C09D5/24 ,  C09D7/20 ,  C09D7/61 ,  C09D101/28 ,  C09D133/02 ,  C09D139/06 ,  G01N17/02

CPC classification number: C09D5/24 ,  C09D7/20 ,  C09D7/61 ,  C09D101/28 ,  C09D133/02 ,  C09D139/06 ,  G01N17/02 ,  C08K3/04

Abstract: The present invention relates to a water absorbing, electrically conductive composition comprising a) a water soluble and/or water swellable and/or water absorbing resin; b) an electrically conductive filler; and c) a solvent. The water absorbing, electrically conductive composition according to according to the present invention can be used as a sensor for erosion and/or corrosion monitoring.

公开(公告)号：US11884837B2

公开(公告)日：2024-01-30

申请号：US16769713

申请日：2018-12-07

Applicant: BASF Coatings GmbH

Inventor： Kevin Michael Turley ,  Paragkumar Thanki ,  Gajanan Joshi ,  Prasad am Ramanna ,  Donald H Campbell ,  Bharathi Rajan

IPC: B05D1/36 ,  B32B15/092 ,  B32B27/38 ,  C09D133/02 ,  C09D163/00 ,  C09D167/00 ,  C09D133/06

CPC classification number: C09D167/00 ,  C09D133/068

Abstract: Described herein is a 2K solvent borne coating system. The coating system includes an epoxy component (A), including: i) an epoxy resin; ii)—a solvent; iii)—at least one compound of formula (I):

[(ER)x(R′O)y(HO)z(R″)t(SiO(4-x-y-z-t)]m  (I)

and/or oligomer or polymer compounds of the compound of formula (I), and iv)—optionally, at least one non-catalytic additive; and an acid resin component (B), including: an carboxylic acid resin;



a solvent; optionally, at least one catalyst; and optionally, at least one additive. Also described herein are a 2K coating composition, a method to coat an automotive substrate with the composition, and a scratch and mar resistant coated surface of the 2K coating composition.

公开(公告)号：US20230331973A1

公开(公告)日：2023-10-19

申请号：US18135655

申请日：2023-04-17

Applicant: Resonac Packaging Corporation

Inventor： Keitaro KAWAKITA

IPC: C08L33/02 ,  C08K3/04 ,  C08K5/17 ,  C08K5/20 ,  C08K3/36 ,  C09D133/02 ,  C09J7/38 ,  C09J7/29 ,  B32B7/12 ,  H01M50/271

CPC classification number: C08L33/02 ,  C08K3/04 ,  C08K5/17 ,  C08K5/20 ,  C08K3/36 ,  C09D133/02 ,  C09J7/381 ,  C09J7/29 ,  B32B7/12 ,  H01M50/271 ,  C08K2003/3045

Abstract: A battery packaging material includes a substrate layer, a heat-fusible resin layer, a barrier layer arranged between the substrate layer and the heat-fusible resin layer, and a substrate protective layer as an outermost layer arranged on an outer side of the substrate layer. The substrate protective layer contains a binder resin, soft resin fine particles having a glass transition temperature Tg of less than 30° C., hard resin fine particles having a glass transition temperature Tg of 30° C. or higher, and inorganic fine particles, as solid fine particles, and a total content rate of the solid fine particles in the substrate protective layer is 30 mass % to 50 mass %.

公开(公告)号：US11781063B2

公开(公告)日：2023-10-10

申请号：US17726702

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo Sook Jang ,  Yuho Won ,  Sungwoo Hwang ,  Ji Yeong Kim ,  Eun Joo Jang

IPC: H01L51/52 ,  C09K11/08 ,  C08L57/10 ,  G02F1/13357 ,  C09D133/00 ,  C08F220/06 ,  C09D133/02 ,  H10K50/115 ,  H10K59/38 ,  B82Y20/00 ,  B82Y40/00 ,  G02F1/1335

CPC classification number: C09K11/0883 ,  C08F220/06 ,  C08L57/10 ,  C09D133/00 ,  C09D133/02 ,  G02F1/133617 ,  H10K50/115 ,  H10K59/38 ,  B82Y20/00 ,  B82Y40/00 ,  C08L2203/20 ,  G02F1/133614 ,  G02F2202/022 ,  G02F2202/102 ,  G02F2202/36 ,  G02F2203/20 ,  C08F220/06 ,  C08F220/20 ,  C08F220/1807

Abstract: A cadmium free quantum dot including a semiconductor nanocrystal core and a semiconductor nanocrystal shell disposed on the core, wherein the quantum dot does not include cadmium and includes indium and zinc, the quantum dot has a maximum photoluminescence peak in a red light wavelength region, a full width at half maximum (FWHM) of the maximum photoluminescence peak is less than or equal to about 40 nanometers (nm), an ultraviolet-visible (UV-Vis) absorption spectrum of the quantum dot includes a valley between about 450 nm to a center wavelength of a first absorption peak, and a valley depth (VD) defined by the following equation is greater than or equal to about 0.2, a quantum dot polymer composite including the same, and a display device including the quantum dot-polymer composite:

(Absfirst−Absvalley)/Absfirst=VD.