公开(公告)号：US20240040697A1

公开(公告)日：2024-02-01

申请号：US18103729

申请日：2023-01-31

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jin Young Choi

IPC分类号： H05K1/11

CPC分类号： H05K1/113 ,  H05K2201/09563 ,  H05K2201/0355

摘要： A printed circuit board includes an insulating layer having first and second surfaces opposite to each other with respect to a first direction; a via hole penetrating a region between the first and second surfaces; a first conductor layer including a first contact portion in contact with the first surface and a first non-contact portion protruding from the first contact portion and disposed on the via hole with respect to a second direction perpendicular to the first direction; and a metal layer filling the via hole.