公开(公告)号：US20230405701A1

公开(公告)日：2023-12-21

申请号：US18037353

申请日：2021-11-15

申请人： ERSA GmbH

发明人： Timon Ahlgrimm ,  Klaus Rosenberger

IPC分类号： B23K3/047 ,  B23K1/00 ,  B23K3/03 ,  B23K3/08

CPC分类号： B23K3/0478 ,  B23K1/0016 ,  B23K3/033 ,  B23K3/08

摘要： A network and a method for operating a network is provided. The network includes one or more soldering systems provided in the network, and the soldering systems each include at least one soldering apparatus for soldering electronic components, a user interface for outputting target-soldering-information to a user; and a way for determining actual soldering information. The network includes at least one input device for inputting and/or specifying work information, and



a control unit which is designed to identify soldering systems provided in the network; create soldering tasks with target-soldering-information from the work information depending on the identified soldering systems and assign the tasks to the relevant soldering system; and process the actual soldering information of the relevant soldering system with the associated target-soldering-information of the relevant soldering system.

公开(公告)号：US20240250488A1

公开(公告)日：2024-07-25

申请号：US18419916

申请日：2024-01-23

申请人： ERSA GmbH

发明人： Timon Ahlgrimm

IPC分类号： H01R43/02 ,  H05K13/08

CPC分类号： H01R43/0242 ,  H05K13/0817

摘要： A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (Px,y,z), and/or a first device acceleration (ax,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (Px,y,z), and/or a second device acceleration (ax,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (Px,y,z), and/or the device acceleration (ax,y,z).