公开(公告)号：US20180015558A1

公开(公告)日：2018-01-18

申请号：US15551620

申请日：2015-02-25

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Katsunori TANAKA ,  Tsuyoshi HAMANE

IPC: B23K3/00 ,  B23K1/012 ,  H05K3/34

CPC classification number: B23K3/00 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0607 ,  B23K3/0669 ,  B23K2101/42 ,  H05K3/34 ,  H05K3/3447 ,  H05K2203/0475 ,  H05K2203/049

Abstract: A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

公开(公告)号：US09289841B2

公开(公告)日：2016-03-22

申请号：US14004204

申请日：2012-04-16

Applicant: Katsumori Taniguro

Inventor： Katsumori Taniguro

IPC: B23K31/02 ,  B23K3/06 ,  B23K1/08 ,  B23K1/20 ,  B23K35/26 ,  H05K3/28 ,  H05K3/34 ,  B23K3/08 ,  B23K1/00 ,  H01L23/00 ,  H05K3/00

CPC classification number: B23K3/0607 ,  B23K1/0016 ,  B23K1/08 ,  B23K1/20 ,  B23K1/203 ,  B23K3/0646 ,  B23K3/0669 ,  B23K3/082 ,  B23K35/262 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/741 ,  H01L24/742 ,  H01L2224/03312 ,  H01L2224/03418 ,  H01L2224/036 ,  H01L2224/0381 ,  H01L2224/03821 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/0569 ,  H01L2224/11312 ,  H01L2224/116 ,  H01L2224/11821 ,  H01L2224/13111 ,  H01L2224/1369 ,  H01L2224/741 ,  H01L2924/381 ,  H05K3/0085 ,  H05K3/282 ,  H05K3/3468 ,  H05K2203/081 ,  H05K2203/122 ,  H05K2203/1366 ,  H05K2203/1518 ,  Y10T428/31678 ,  H01L2224/1141 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2224/03

Abstract: Provided are a soldering device and method which allow for soldering at low cost with high yield and high reliability. To solve the above problems, the soldering device has: a first processing section that immerses workpiece member 10 having copper electrode 2 in organic fatty acid-containing solution, and horizontally move immersed workpiece member 10 in organic fatty acid-containing solution 31; a second processing section having ejection unit 33 to spray a jet stream of molten solder 5a to workpiece member 10 while pulling out workpiece member 10 processed in the first processing section to space section 24 that has a pressurized steam atmosphere and is provided above organic fatty acid-containing solution 31; a third processing section having ejection unit 34 to spray organic fatty acid-containing solution 31 to excess molten solder 5a on workpiece member 10 for removal while pulling down workpiece member 10 processed in the second processing section after horizontally moving in space section 24; and a fourth processing section that picks up workpiece member 10 processed in the third processing section by pulling out from organic fatty acid-containing solution 31 after horizontally moving in organic fatty acid-containing solution 31.

Abstract translation: 提供了一种以高成本和高可靠性以低成本实现焊接的焊接装置和方法。 为了解决上述问题，焊接装置具有：将具有铜电极2的工件10浸渍在含有有机脂肪酸的溶液中的水平移动浸渍的有机脂肪酸溶液31中的工件10的第一处理部; 第二处理部分具有喷射单元33，以将熔融焊料5a的喷射流喷射到工件10上，同时将在第一处理部分中加工的工件10拉出到具有加压蒸汽气氛的空间部分24并且设置在有机脂肪酸之上 含有溶液31; 具有喷射单元34的喷射单元34，用于在空间部24中水平移动之后，将在第二处理部中处理的工件10拉下的同时，将含有机脂肪酸的溶液31喷射到工件10上的多余的熔融焊料5a以进行除去; 以及第四处理部，其通过在含有有机脂肪酸的溶液31中水平移动之后从含有机脂肪酸的溶液31中拉出而拾取在第三处理部中处理的工件10。

公开(公告)号：US08740046B2

公开(公告)日：2014-06-03

申请号：US14149828

申请日：2014-01-08

Applicant: Wistron Corporation

Inventor： Hao-Chun Hsieh ,  Chia-Hsien Lee

IPC: B23K31/00 ,  B23K31/02

CPC classification number: H05K13/0465 ,  B23K1/0016 ,  B23K3/0669 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/3489 ,  H05K3/3494

Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Abstract translation: 焊接系统包括轨道，铺设装置，锅炉，遮蔽物，传输辊，位置传感器，热辐射加热装置和驱动装置。 在遮蔽物上形成至少一个孔，并且遮蔽物上的至少一个孔的形状和尺寸对应于DIP部件的形状和尺寸。 传动辊根据轨道的传输速度旋转遮蔽物。 位置传感器检测电路板相对于锅炉的位置。 所述热辐射加热装置连续地加热所述电路板的与所述DIP部件相邻的第一表面的区域，所述第一表面通过所述遮蔽物上的所述至少一个孔连续地加热，以便当所述第一表面 电路板的表面正在通过锅炉。

公开(公告)号：US20050023681A1

公开(公告)日：2005-02-03

申请号：US10925767

申请日：2004-08-25

Applicant: Hideki Uchida ,  Kazuo Kido ,  Tomoyuki Nakano ,  Takeshi Kuribayashi ,  Yoshihiko Misawa

Inventor： Hideki Uchida ,  Kazuo Kido ,  Tomoyuki Nakano ,  Takeshi Kuribayashi ,  Yoshihiko Misawa

IPC: B23K1/00 ,  B23K3/06 ,  B23K101/40 ,  H05K3/34 ,  H05K13/04 ,  H01L23/48

CPC classification number: B23K3/0669 ,  B23K2101/40 ,  H01L2924/0002 ,  H05K3/3484 ,  H05K13/0469 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

公开(公告)号：US20050017052A1

公开(公告)日：2005-01-27

申请号：US10925625

申请日：2004-08-25

Applicant: Hideki Uchida ,  Kazuo Kido ,  Tomoyuki Nakano ,  Takeshi Kuribayashi ,  Yoshihiko Misawa

Inventor： Hideki Uchida ,  Kazuo Kido ,  Tomoyuki Nakano ,  Takeshi Kuribayashi ,  Yoshihiko Misawa

IPC: B23K1/00 ,  B23K3/06 ,  B23K101/40 ,  H05K3/34 ,  H05K13/04 ,  G03G15/10

CPC classification number: B23K3/0669 ,  B23K2101/40 ,  H01L2924/0002 ,  H05K3/3484 ,  H05K13/0469 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

公开(公告)号：US06637639B2

公开(公告)日：2003-10-28

申请号：US10012317

申请日：2001-12-12

Applicant: Akira Miyoshi ,  Masahiro Ikeji ,  Nobuo Satou ,  Shigeru Sakaue ,  Tadashi Taniguchi

Inventor： Akira Miyoshi ,  Masahiro Ikeji ,  Nobuo Satou ,  Shigeru Sakaue ,  Tadashi Taniguchi

IPC: B23K108

CPC classification number: B23K1/203 ,  B23K3/0646 ,  B23K3/0669 ,  H01R43/048 ,  H01R43/28

Abstract: A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The applicator (60) and the solder depositing units (7, 8) are attachable to and removable from a placement section (13a) and are interchangeable with each other. Each of the solder depositing units (7, 8) includes a flux bath (15) for storing a flux liquid therein, a solder bath (16) for storing solder in a molten state therein, and a flux liquid holding tube having a holding hole for holding the flux liquid therein and capable of releasably receiving the core. The core is moved downwardly into a solder portion raised by the surface tension of the solder stored in the solder bath 16, whereby the solder is deposited on the core.

公开(公告)号：US20020092898A1

公开(公告)日：2002-07-18

申请号：US10004255

申请日：2001-11-02

Inventor： Dieter Proksch ,  Norbert Nykrake ,  Dietmar Tempel ,  Harald Hundt

IPC: B23K031/02 ,  B23K035/12

CPC classification number: H01R4/023 ,  B23K3/0669 ,  B23K3/08 ,  H01F27/292 ,  H01F41/10 ,  H01R4/14

Abstract: A process for connecting a winding wire of a coil with a terminal pin of a casing for surface mounting is introduced, whereby one end section of the winding wire is wound around the terminal pin. The area of the terminal pin wound with the end section of the winding wire is soft-soldered, and the soft-solder is then blown off of the partial area of the area wound, which forms the soldering application surface for surface mounting. The inventive process can be used in the manufacture of inductive SMD components, the terminal pins of which possess excellent coplanarity, particularly if terminal pins bent in a wing-shape are used.

Abstract translation: 引入线圈的绕组线与用于表面安装的壳体的端子针连接的过程，由此绕组线的一个端部缠绕在端子销上。 与绕组线的端部缠绕的端子针的区域软焊，然后将软焊料从形成用于表面安装的焊接应用表面的区域的部分区域吹出。 本发明的工艺可以用于制造感性SMD元件，其端子引脚具有优异的共面性，特别是如果使用弯曲成翼形的端子引脚。

公开(公告)号：US5520967A

公开(公告)日：1996-05-28

申请号：US24991

申请日：1993-03-02

Applicant: Peter M. Banks ,  William M. Morgan

Inventor： Peter M. Banks ,  William M. Morgan

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34 ,  B06B1/20

CPC classification number: B23K3/0669 ,  B23K1/08 ,  H05K3/3468 ,  B23K2201/42 ,  H05K1/0393 ,  H05K2201/10689 ,  H05K2203/0285 ,  H05K2203/044 ,  H05K2203/0776 ,  H05K2203/1518 ,  H05K2203/1554 ,  H05K3/281 ,  H05K3/3494

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The board is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

Abstract translation: 通过将板浸入熔融焊料3的槽1中将焊料施加到电路板7，熔融焊料在顶部具有一层油5。 通过沿着与电路板基本上共面的路径旋转，将板浸入浴中。 这通过将板支撑在载体9上而实现，该载体9又附接到电动机轴11。

公开(公告)号：US3393659A

公开(公告)日：1968-07-23

申请号：US52543366

申请日：1966-02-07

Applicant: VARO INC ELECTROKINETICS DIV

Inventor： HOLT JR WILLIAM J ,  DEXTER JOHN L

IPC: B23K3/06 ,  H01R43/02 ,  H05K13/00

CPC classification number: B23K3/0669 ,  H01R43/0235 ,  H05K13/00

公开(公告)号：US3059604A

公开(公告)日：1962-10-23

申请号：US76621458

申请日：1958-10-09

Applicant: BELL & HOWELL CO

Inventor： BRANDYS ROMAN A

IPC: B23K3/06

CPC classification number: B23K3/0669