公开(公告)号：US20190232439A1

公开(公告)日：2019-08-01

申请号：US16380462

申请日：2019-04-10

申请人： International Business Machines Corporation

发明人： Eric J. Campbell ,  Sarah K. Czaplewski-Campbell ,  Joseph Kuczynski ,  Timothy J. Tofil

IPC分类号： B23K35/36 ,  B23K35/368 ,  B23K35/365 ,  B23K3/08 ,  B23K1/20 ,  B23K1/00 ,  H05K3/34

CPC分类号： B23K35/3615 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/203 ,  B23K3/082 ,  B23K35/3601 ,  B23K35/365 ,  B23K35/368 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2203/0425 ,  H05K2203/104

摘要： A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus.

公开(公告)号：US20180229333A1

公开(公告)日：2018-08-16

申请号：US15872954

申请日：2018-01-16

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： HIROHISA HINO ,  NAOMICHI OHASHI ,  YASUHIRO SUZUKI

IPC分类号： B23K35/02 ,  H05K3/34 ,  B23K35/26 ,  C08L63/10 ,  B23K35/362 ,  B23K101/42

CPC分类号： B23K35/025 ,  B23K35/264 ,  B23K35/362 ,  B23K2101/42 ,  C08G59/4207 ,  C08L63/00 ,  C08L63/10 ,  H05K3/225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/0133 ,  H05K2201/10977 ,  C08K5/08

摘要： Provided herein are a solder paste and a mount structure having excellent repairability while maintaining high adhesion at the operating temperature of a semiconductor component. The solder paste is configured from a solder powder and a flux. The flux contains an epoxy resin, a curing agent, a rubber modified epoxy resin, and an organic acid. The rubber modified epoxy resin is contained in a proportion of 3 weight % to 35 weight % with respect to the total weight of the flux.

公开(公告)号：US09919386B2

公开(公告)日：2018-03-20

申请号：US13207214

申请日：2011-08-10

申请人： John A. Vivari, Jr.

发明人： John A. Vivari, Jr.

IPC分类号： B32B15/04 ,  B23K1/20 ,  B23K35/363 ,  B23K35/36 ,  B23K35/02 ,  B23K35/362 ,  B23K35/368 ,  B23K35/40 ,  B32B15/01 ,  B32B15/02 ,  H05K3/34

CPC分类号： B23K35/3613 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/36 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/368 ,  B23K35/40 ,  B32B15/01 ,  B32B15/02 ,  B32B15/04 ,  H05K3/3489 ,  Y10T428/12292 ,  Y10T428/12493 ,  Y10T428/2951 ,  Y10T428/31678

摘要： A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

公开(公告)号：US20180063967A1

公开(公告)日：2018-03-01

申请号：US15249148

申请日：2016-08-26

申请人： Tyco Electronics Corporation

发明人： Miguel A. Morales ,  Leonard H. Radzilowski ,  Barry C. Mathews ,  Michael A. Oar

IPC分类号： H05K3/34 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  B23K1/00 ,  B23K20/00 ,  B23K35/26 ,  C08J7/04

CPC分类号： C08J7/047 ,  B23K1/0016 ,  B23K1/005 ,  B23K1/0056 ,  B23K1/20 ,  B23K1/203 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  B23K2101/32 ,  B23K2101/42 ,  B23K2103/172 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/341 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/09118 ,  H05K2201/10287 ,  Y02P70/613

摘要： A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less.

公开(公告)号：US09700950B2

公开(公告)日：2017-07-11

申请号：US13586132

申请日：2012-08-15

申请人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B23K1/20 ,  B23K3/08 ,  H05K3/38 ,  B23K1/00 ,  H05K3/34 ,  B23K101/40

CPC分类号： B23K1/0016 ,  B23K1/203 ,  B23K3/082 ,  B23K2101/40 ,  H05K3/3489

摘要： The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

公开(公告)号：US20170157717A1

公开(公告)日：2017-06-08

申请号：US15316608

申请日：2015-06-05

申请人： UNIVERSITY OF LEICESTER

发明人： Karl Ryder ,  Andrew Ballantyne ,  Robert Harris ,  Christopher Zaleski

IPC分类号： B23K35/362 ,  H05K3/34 ,  B23K35/36 ,  B23K1/00 ,  B23K35/02

CPC分类号： B23K35/362 ,  B23K1/0016 ,  B23K35/0227 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3605 ,  B23K35/3606 ,  B23K35/3611 ,  B23K35/3618 ,  H05K3/34 ,  H05K3/3489

摘要： There is provided the use of at least one ionic liquid as a soldering/brazing flux. There is also provided a method of soldering a metal comprising applying a solder/braze comprising a flux to a surface of the metal and heating said metal to a desired soldering/brazing temperature, wherein the soldering/brazing flux comprises one or more ionic liquids.

公开(公告)号：US20170135227A1

公开(公告)日：2017-05-11

申请号：US15318829

申请日：2015-06-19

申请人： Alpha Metals, Inc.

发明人： Hosur Venkatagiriyappa Ramakrishna ,  Morgana De Avila Ribas ,  Ranjit Pandher ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Bawa Singh

IPC分类号： H05K3/34 ,  H05K1/09 ,  H05K1/11 ,  B23K35/362 ,  B23K1/00 ,  B23K35/02 ,  B23K35/36 ,  H01L23/00 ,  H05K1/18

CPC分类号： H05K3/3489 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/26 ,  B23K35/3613 ,  B23K35/362 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83011 ,  H01L2224/83024 ,  H01L2224/83815 ,  H01L2224/8392 ,  H01L2924/0665 ,  H05K1/09 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3431 ,  H01L2924/014

摘要： A method of forming a solder joint, the method comprising: (i) providing a solder flux; (ii) providing solder particles; (iii) providing two or more work pieces to be joined; and (iv) heating the solder flux and the solder particles in the vicinity of the two or more work pieces to be joined to form: (i) a solder joint between the two or more work pieces to be joined, and (ii) a solder flux residue. The solder flux residue substantially covers the exposed surfaces of the solder joint.

公开(公告)号：US09587293B2

公开(公告)日：2017-03-07

申请号：US12205121

申请日：2008-09-05

申请人： Stanley R. Rothschild

发明人： Stanley R. Rothschild

IPC分类号： C22C13/00 ,  B23K35/26 ,  C22C13/02 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3468 ,  H05K3/3489

摘要： A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.

摘要翻译： 无铅焊料合金包括也包含少量钴的锡 - 铜合金，已经发现它们为焊料合金提供光泽和反射的外观。 还公开了使用这种合金的焊接方法以及包括这种合金的焊接接头。

公开(公告)号：US20160330882A1

公开(公告)日：2016-11-10

申请号：US15102941

申请日：2013-12-23

申请人： Fuji Machine Mfg. Co., Ltd.

发明人： Yoshinori NAGATA

IPC分类号： H05K13/04 ,  H05K13/08 ,  H05K3/34

CPC分类号： H05K13/0469 ,  B05C11/101 ,  B05C11/11 ,  B67D1/0871 ,  H05K3/3489 ,  H05K13/0404 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/082 ,  H05K2203/0139 ,  H05K2203/163

摘要： An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting head moves to a position above the storage section and lowers the film thickness gage to cause the film thickness gage to come into contact with the flux film. In the film thickness gage, the measurement sections form measurement marks corresponding to the film thickness in the flux film. The electronic component mounting machine images the measurement marks using a mark camera, and determines the film thickness of the flux film which is actually formed based on imaging data.

摘要翻译： 电子部件安装机设置有膜厚计。 薄膜厚度计设有测量部分。 安装头移动到存储部分上方的位置，并降低膜厚度以使膜厚度与焊剂膜接触。 在薄膜厚度计中，测量部分形成对应于通量膜中的膜厚度的测量标记。 电子部件安装机使用标记相机对测量标记进行成像，并且基于成像数据确定实际形成的通量膜的膜厚度。

公开(公告)号：US20160311067A1

公开(公告)日：2016-10-27

申请号：US15105169

申请日：2014-12-12

申请人： HERAEUS DEUTSCHLAND GMBH & CO.KG

发明人： Jens NACHREINER ,  Joachim WIESE ,  Sebastian FRITZSCHE

IPC分类号： B23K35/36 ,  H05K3/34 ,  H05K1/09 ,  H05K1/18 ,  B23K35/26 ,  B23K35/02

CPC分类号： B23K35/3618 ,  B23K35/025 ,  B23K35/262 ,  H05K1/092 ,  H05K1/181 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/10621

摘要： A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

摘要翻译： 用于安装电子部件和基板的焊膏包含草酸，己二酸和胺组分的混合物。 可以通过使用焊膏将电子部件安装在基板上。 此外，模块可以使用焊膏。