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1.发明申请公开(公告)号：US20180243869A1
公开(公告)日：2018-08-30
申请号：US15888187
申请日：2018-02-05
Inventor： SEIJI MIZUOKA , TAKAHIRO ENDO , YASUHIRO SUZUKI , YOICHI MAKINO
Abstract: When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.
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公开(公告)号：US20180224140A1
公开(公告)日：2018-08-09
申请号：US15748652
申请日：2016-09-16
Inventor： KOUJI IIO , KENICHI ISHIGURO , TOSHIHIKO HASHIMOTO , YASUHIRO SUZUKI
Abstract: A heat exchanging ventilation device includes supply air blower (8); exhaust air blower (9); a supply air blowing passage through which air to be delivered to indoor from outdoor by supply air blower (8) passes; a exhaust air blowing passage through which air to be delivered to the outdoor from the indoor by the exhaust air blower passes; heat exchange element (11) disposed at a position where both the supply air blowing passage and the exhaust air blowing passage pass and exchanging heat between air delivered by supply air blower (8) and air delivered by exhaust air blower (9); supply air damper (12) provided on supply air inlet (2) side of the supply air blowing passage; exhaust air damper (13) provided on exhaust air outlet (3) side of the exhaust air blowing passage; and circulation damper (14) provided at boundary portion (25) which separates the supply air blowing passage and the exhaust air blowing passage from each other.
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公开(公告)号：US20170040184A1
公开(公告)日：2017-02-09
申请号：US15212158
申请日：2016-07-15
Inventor： HIROHISA HINO , YASUHIRO SUZUKI , MASATO MORI , NAOMICHI OHASHI
IPC: H01L21/48 , H01L25/065 , H01L23/498
CPC classification number: H01L21/4853 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2021/60007 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/15311
Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.
Abstract translation: 一种安装结构，包括：具有第一凸起的第一部件; 具有第二凸起的第二部件; 具有主安装面和副安装面的安装部件; 连接主安装表面上的电极和第一凸起的第一焊料; 连接所述辅助安装表面上的电极和所述第二凸起的第二焊料; 以及覆盖所述第一焊料的一部分且不与所述主安装面接触的增强树脂。
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公开(公告)号：US20210309829A1
公开(公告)日：2021-10-07
申请号：US17274225
申请日：2019-10-16
Inventor： NAOMICHI OHASHI , KOSO MATSUNO , YASUHIRO SUZUKI
Abstract: A curable resin composition contains a thermosetting resin, a curing agent, and one or more selected from the group consisting of organic acids, amines, and amine salts, and a percentage of a total amount of the one or more selected from the group with respect to a total mass of the curable resin composition is 0.3% by mass or more and 2.2% by mass or less.
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公开(公告)号：US20180229333A1
公开(公告)日：2018-08-16
申请号：US15872954
申请日：2018-01-16
Inventor： HIROHISA HINO , NAOMICHI OHASHI , YASUHIRO SUZUKI
IPC: B23K35/02 , H05K3/34 , B23K35/26 , C08L63/10 , B23K35/362 , B23K101/42
CPC classification number: B23K35/025 , B23K35/264 , B23K35/362 , B23K2101/42 , C08G59/4207 , C08L63/00 , C08L63/10 , H05K3/225 , H05K3/3442 , H05K3/3463 , H05K3/3484 , H05K3/3489 , H05K2201/0133 , H05K2201/10977 , C08K5/08
Abstract: Provided herein are a solder paste and a mount structure having excellent repairability while maintaining high adhesion at the operating temperature of a semiconductor component. The solder paste is configured from a solder powder and a flux. The flux contains an epoxy resin, a curing agent, a rubber modified epoxy resin, and an organic acid. The rubber modified epoxy resin is contained in a proportion of 3 weight % to 35 weight % with respect to the total weight of the flux.
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Patent Agency Ranking
公开(公告)号：US20200306893A1
公开(公告)日：2020-10-01
申请号：US16792654
申请日：2020-02-17
Inventor： YASUHIRO SUZUKI , HIROHISA HINO , SHIGERU YAMATSU
Abstract: Provided herein is a solder paste that can be used for solder connection requiring a high melting point, while, at the same time, ensuring excellent applicability, high adhesion, and excellent solder joint reliability. A mount structure mounting an electronic component with such a solder paste is also provided. The solder paste is a solder paste that includes a solder powder and a flux. The flux contains an epoxy resin, a phenolic resin, a benzooxazine compound, and an activating agent. The phenolic resin contains at least one type of phenolic resin having a phenolic hydroxyl group and an allyl group within the molecule.
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公开(公告)号：US20190232438A1
公开(公告)日：2019-08-01
申请号：US16223952
申请日：2018-12-18
Inventor： HIROHISA HINO , NAOMICHI OHASHI , YASUHIRO SUZUKI , KOSO MATSUNO
CPC classification number: B23K35/362 , B23K35/025 , B23K35/262 , B23K2101/40 , B23K2101/42 , C22C13/02 , H01L24/16 , H01L24/81 , H01L2224/16227 , H01L2224/16501 , H01L2224/81815 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01083 , H01L2924/014 , H01L2924/0665 , H01L2924/069 , H05K1/181 , H05K3/3436 , H05K3/3457 , H05K3/3494 , H05K2201/10636 , H05K2201/10734
Abstract: Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured product of excellent properties, for example, high insulation against humidity. Amount structure including an electronic component mounted with the solder paste is also provided. The solder paste contains a solder powder and a flux. The flux contains an epoxy resin, a reactive diluent, a curing agent, an organic acid, and a rubber modified epoxy resin. The reactive diluent contains a compound having two or more epoxy groups, and has a viscosity of 150 mPa·s or more and 700 mPa·s or less. The reactive diluent has a total chlorine content of 0.5 weight % or less, and is contained in a proportion of 5 weight % or more and 45 weight % or less with respect to a total weight of the flux.
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公开(公告)号：US20180214819A1
公开(公告)日：2018-08-02
申请号：US15866763
申请日：2018-01-10
Inventor： SEIJI MIZUOKA , TAKAHIRO ENDO , YASUHIRO SUZUKI
CPC classification number: B01D53/32 , B01D53/002 , B01D53/30 , B01D2258/0216 , B01D2259/818 , B23K3/08 , H05K3/3494
Abstract: A flux recovery device recovers a vaporized flux being generated at a time of soldering an electronic circuit board on which electronic components are placed. The flux recovery device includes a first pipe, a dust collector, and a current controller. The first pipe causes gas including the vaporized flux to pass to the flux recovery device. The dust collector solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge. The current controller performs a constant current control of the plasma discharge.
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公开(公告)号：US20180131009A1
公开(公告)日：2018-05-10
申请号：US15573566
申请日：2016-06-20
Inventor： YUKI SUEHIRO , SEIICHI AOKI , YASUHIRO SUZUKI , KATSUHISA WADASAKI
CPC classification number: H01M6/10 , H01M2/08 , H01M10/0431 , H01M10/052 , H01M10/0587
Abstract: In a winding-type battery, the first electrode and the second electrode are wound via the separator to form an electrode group having first and second end surfaces. The first electrode includes a first current collector sheet, and a first active material layer formed on a surface of the first current collector sheet. A first current collecting lead is connected to the first electrode. The second electrode includes a second current collector sheet, and a second active material layer formed on a surface of the second current collector sheet. A second current collecting lead is connected to the second electrode. At an end of the first electrode that is disposed on the first end surface and/or an end of the first electrode that is disposed on the second end surface, at least a winding termination portion located on the outermost periphery of the electrode group has a notch.
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公开(公告)号：US20170120396A1
公开(公告)日：2017-05-04
申请号：US15265336
申请日：2016-09-14
Inventor： NAOMICHI OHASHI , YUKI YOSHIOKA , YASUHIRO SUZUKI , HIROHISA HINO , MASATO MORI , KAZUHIRO NISHIKAWA
IPC: B23K35/362 , B23K35/02 , B23K35/26 , H01L21/56 , H05K1/18 , H05K3/34 , H01L23/00 , H01L23/31 , B23K1/00 , B23K35/36
CPC classification number: B23K35/362 , B23K1/0016 , B23K35/025 , B23K35/264 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618 , H01L21/563 , H01L23/3142 , H01L24/17 , H01L24/81 , H01L2224/16227 , H01L2224/81411 , H01L2224/81413 , H01L2224/81815 , H01L2924/0665 , H01L2924/20102 , H05K1/181 , H05K3/3436 , H05K3/3457 , H05K3/3489 , H05K3/3494 , H05K2201/10734 , H05K2203/048 , Y02P70/613
Abstract: A solder paste having improved self alignment for soldering is provided. The solder paste includes a solder powder; a composite epoxy resin containing a first epoxy resin that is solid at 25° C., and a second epoxy resin that is liquid at 25° C.; and a curing agent, wherein the first epoxy resin has a softening point that is at least 10° C. lower than the melting point of the solder powder, and is contained in a range of 10 weight parts to 75 weight parts with respect to the total 100 weight parts of the composite epoxy resin.
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