-
公开(公告)号：US20250108463A1
公开(公告)日：2025-04-03
申请号：US18978382
申请日：2024-12-12
Inventor： KIYOHIRO HINE , YUMI TAKAO , HIROHISA HINO , SHINJI ISHITANI , AKIO FURUSAWA
Abstract: A bonding material includes a solder alloy having a median diameter D50 of 100 nm to 2000 nm, made from Sn, Bi, In, and other unavoidable components, and having a melting point of less than or equal to 100° C., metal nanoparticles that are Cu nanoparticles having a median diameter D50 of 50 nm to 500 nm, and a flux, wherein the metal nanoparticles include a protective film on a surface of the metal nanoparticles, the protective film separating at a temperature higher than a melting point of the solder alloy and lower than 100° C., and a weight ratio between the solder alloy and the metal nanoparticles is a ratio at which all Sn and In contained in the solder alloy become intermetallic compounds with the metal nanoparticles in an equilibrium state diagram.
-
公开(公告)号：US20170040184A1
公开(公告)日：2017-02-09
申请号：US15212158
申请日：2016-07-15
Inventor： HIROHISA HINO , YASUHIRO SUZUKI , MASATO MORI , NAOMICHI OHASHI
IPC: H01L21/48 , H01L25/065 , H01L23/498
CPC classification number: H01L21/4853 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2021/60007 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/15311
Abstract: A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.
Abstract translation: 一种安装结构，包括：具有第一凸起的第一部件; 具有第二凸起的第二部件; 具有主安装面和副安装面的安装部件; 连接主安装表面上的电极和第一凸起的第一焊料; 连接所述辅助安装表面上的电极和所述第二凸起的第二焊料; 以及覆盖所述第一焊料的一部分且不与所述主安装面接触的增强树脂。
-
公开(公告)号：US20200013557A1
公开(公告)日：2020-01-09
申请号：US16574511
申请日：2019-09-18
Inventor： TAKAYUKI MATSUMOTO , HONAMI NISHINO , SHIN FUJITA , TOMOYUKI TASHIRO , MASATO MORI , HIROHISA HINO
Abstract: An electrolytic capacitor includes a capacitor element, a case housing the capacitor element, and a first heat radiation layer having an insulating property. The first heat radiation layer covers at least part of the capacitor element. A thermal conductivity λC of the case in a thickness direction is greater than or equal to 1 W/m·K. A thermal emissivity ε1 of the first heat radiation layer is greater than or equal to 0.7.
-
公开(公告)号：US20190177911A1
公开(公告)日：2019-06-13
申请号：US16198236
申请日：2018-11-21
Inventor： HIROHISA HINO , TAICHI NAKAMURA , KAZUMA OIKAWA , SHIGEAKI SAKATANI
Abstract: A heat insulator is provided that has a coating structure preventing separation of silica aerogel in a composite sheet. The heat insulator includes: a composite layer having silica aerogel enclosed in a nonwoven fabric; and a coating film containing a hydrophilic resin and a lipophilic resin and coating a surface of the composite layer. The nonwoven fabric resides in the coating film. In the coating film, the heat insulator includes the lipophilic resin which is present in the hydrophilic resin in the form of a plurality of islands.
-
公开(公告)号：US20170243804A1
公开(公告)日：2017-08-24
申请号：US15409519
申请日：2017-01-18
Inventor： HONAMI NAWA , HIROHISA HINO
IPC: H01L23/373 , H01L23/42 , B05D7/00
CPC classification number: H01L23/3737 , B05D7/5483 , H01L23/295 , H01L23/367 , H01L23/42
Abstract: Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 μm to 150 μm; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.7 times longer than the total thickness of the water-based coating material of the water-based coating material layer and the thermosetting resin of the resin layer, as measured along the long axis through the center of gravity of the fillers.
-
Patent Agency Ranking
公开(公告)号：US20250121461A1
公开(公告)日：2025-04-17
申请号：US18982596
申请日：2024-12-16
Inventor： YUMI TAKAO , KIYOHIRO HINE , AKIO FURUSAWA , SHINJI ISHITANI , HIROHISA HINO
IPC: B23K35/02 , B23K35/26 , B23K35/30 , B23K35/362
Abstract: A bonding material includes: a single particle that is a particle of a first metal; a composite particle including a central core that is a particle of the first metal, and at least one coating layer covering an entire surface of the central core, the at least one coating layer including a fine particle of a second metal; and a flux including a reducing agent component, in which the first metal and the second metal have properties of forming an intermetallic compound of the first metal and the second metal, and the reducing agent component of the flux is present between the central core and the at least one coating layer.
-
公开(公告)号：US20180229333A1
公开(公告)日：2018-08-16
申请号：US15872954
申请日：2018-01-16
Inventor： HIROHISA HINO , NAOMICHI OHASHI , YASUHIRO SUZUKI
IPC: B23K35/02 , H05K3/34 , B23K35/26 , C08L63/10 , B23K35/362 , B23K101/42
CPC classification number: B23K35/025 , B23K35/264 , B23K35/362 , B23K2101/42 , C08G59/4207 , C08L63/00 , C08L63/10 , H05K3/225 , H05K3/3442 , H05K3/3463 , H05K3/3484 , H05K3/3489 , H05K2201/0133 , H05K2201/10977 , C08K5/08
Abstract: Provided herein are a solder paste and a mount structure having excellent repairability while maintaining high adhesion at the operating temperature of a semiconductor component. The solder paste is configured from a solder powder and a flux. The flux contains an epoxy resin, a curing agent, a rubber modified epoxy resin, and an organic acid. The rubber modified epoxy resin is contained in a proportion of 3 weight % to 35 weight % with respect to the total weight of the flux.
-
公开(公告)号：US20170338166A1
公开(公告)日：2017-11-23
申请号：US15429930
申请日：2017-02-10
Inventor： HONAMI NAWA , HIROHISA HINO
CPC classification number: H01L23/3737 , C08K3/14 , C08K3/34 , C08K9/04 , C08K2003/222 , C08K2003/2227 , C08K2003/282 , C08K2201/001 , C08K2201/005 , C08K2201/006 , C09D5/028 , C09D5/32 , C09D7/61 , C09D7/62 , C09D7/69 , H01L23/42 , H05K7/20263
Abstract: Provided herein is a structure having desirable heat dissipation, particularly a structure having high far-infrared emissivity. An electronic component including such a structure, and an electronic device including the electronic component are also provided. The structure includes a water-based coating material containing inorganic fillers that include a first filler and a second filler. The first filler is an oxide containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon, and has a specific surface area of 7 m2/g to 50 m2/g, and a hydrophobic group on a filler surface. The second filler has a head conductivity of 30 W/m·K or more.
-
公开(公告)号：US20150180099A1
公开(公告)日：2015-06-25
申请号：US14569045
申请日：2014-12-12
Inventor： HIROHISA HINO , ARATA KISHI , HONAMI NAWA
IPC: H01M10/6554 , H01M10/6551 , F21V29/15 , F28F21/06
CPC classification number: F21V29/15 , H01M4/8642 , H01M10/613 , H01M10/653 , H01M10/655 , H01M10/6551 , H01M10/66
Abstract: A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity A of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more.
Abstract translation: 冷却结构可以有效地减少热量，从而抑制制热电子设备的温度升高，而不使用散热器或水冷套，并且可以实现其小型化或减轻重量。 冷却结构包括：通过在发热体的表面上涂布第一浆料而形成的导热层; 以及通过在导热层的表面上涂布第二糊剂形成的散热层。 导热层包括第一树脂和第一填料，导热层的导热系数A为1.0W /（m·K）以上。 散热层包括第二树脂和第二填料，以及红外发射率 的散热层为0.7以上。
-
公开(公告)号：US20200306893A1
公开(公告)日：2020-10-01
申请号：US16792654
申请日：2020-02-17
Inventor： YASUHIRO SUZUKI , HIROHISA HINO , SHIGERU YAMATSU
Abstract: Provided herein is a solder paste that can be used for solder connection requiring a high melting point, while, at the same time, ensuring excellent applicability, high adhesion, and excellent solder joint reliability. A mount structure mounting an electronic component with such a solder paste is also provided. The solder paste is a solder paste that includes a solder powder and a flux. The flux contains an epoxy resin, a phenolic resin, a benzooxazine compound, and an activating agent. The phenolic resin contains at least one type of phenolic resin having a phenolic hydroxyl group and an allyl group within the molecule.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.016 seconds)
