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公开(公告)号：US20240040706A1
公开(公告)日：2024-02-01
申请号：US18319870
申请日：2023-05-18
申请人： Jabil Inc.
CPC分类号： H05K3/225 , H05K3/305 , H05K3/32 , H05K1/111 , H05K2203/068 , H05K2203/176 , H05K1/181
摘要： A rework patch for an electronic circuit includes a flexible patch body and at least two patch traces. The electronic circuit includes a substrate, at least two board traces formed on the substrate, and at least one defect portion within at least one of the board traces. The patch body is attached to the substrate to partially cover each of the board traces and to cover the defect portion. The patch traces are formed on the patch body. A pattern of the patch traces corresponds to a pattern of a portion of the board traces covered by the patch body.
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公开(公告)号：US20240015886A1
公开(公告)日：2024-01-11
申请号：US18472382
申请日：2023-09-22
CPC分类号： H05K3/225 , H05K1/141 , H05K1/0292 , H05K2203/173
摘要： A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.
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公开(公告)号：US11647591B2
公开(公告)日：2023-05-09
申请号：US17343857
申请日：2021-06-10
CPC分类号： H05K3/225 , B23K1/0016 , B23K1/203 , B23K3/0653 , H01R12/58 , H05K3/3447 , B23K2101/42 , H05K2203/044 , H05K2203/143 , H05K2203/16 , H05K2203/173
摘要： Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.
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公开(公告)号：US20180185945A1
公开(公告)日：2018-07-05
申请号：US15924523
申请日：2018-03-19
发明人： Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
CPC分类号： B23K1/018 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K31/02 , B23K31/12 , B23K35/02 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/36 , B23K2101/42 , G05B2219/37215 , G05B2219/45235 , H05K3/225 , H05K3/34 , H05K3/3484 , H05K2201/083 , H05K2203/0445 , H05K2203/104 , H05K2203/163
摘要： A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
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公开(公告)号：US20180185944A1
公开(公告)日：2018-07-05
申请号：US15924484
申请日：2018-03-19
发明人： Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
CPC分类号： B23K1/018 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K31/02 , B23K31/12 , B23K35/02 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/36 , B23K2101/42 , G05B2219/37215 , G05B2219/45235 , H05K3/225 , H05K3/34 , H05K3/3484 , H05K2201/083 , H05K2203/0445 , H05K2203/104 , H05K2203/163
摘要： A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
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公开(公告)号：US09986648B2
公开(公告)日：2018-05-29
申请号：US15561338
申请日：2016-03-29
发明人： Michael Hanisch , Heiko Huth , Wolfgang Ludeck , Bernd Mueller , Mathias Nowottnick , Andrey Prihodovsky , Dirk Seehase , Ulrich Wittreich , Dirk Wormuth
IPC分类号： H05K3/34 , H05K1/18 , B23K1/00 , B23K1/008 , B23K101/42
CPC分类号： H05K3/341 , B23K1/0006 , B23K1/0016 , B23K1/008 , B23K2101/42 , H05K1/181 , H05K3/225 , H05K3/3415 , H05K3/3494 , H05K2203/1163 , H05K2203/176
摘要： The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
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公开(公告)号：US20180110131A1
公开(公告)日：2018-04-19
申请号：US15561338
申请日：2016-03-29
发明人： Michael Hanisch , Heiko Huth , Wolfgang Ludeck , Bernd Mueller , Mathias Nowottnick , Andrey Prihodovsky , Dirk Seehase , Ulrich Wittreich , Dirk Wormuth
CPC分类号： H05K3/341 , B23K1/0006 , B23K1/0016 , B23K1/008 , B23K2101/42 , H05K1/181 , H05K3/225 , H05K3/3415 , H05K3/3494 , H05K2203/1163 , H05K2203/176
摘要： The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
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公开(公告)号：US09883582B2
公开(公告)日：2018-01-30
申请号：US14947437
申请日：2015-11-20
发明人： Tran Lin
IPC分类号： H05K1/02 , H01L23/15 , H01L23/367 , H01L23/50 , H01L23/498 , H05K1/18 , H05K1/11 , G01R31/02 , G01R31/04 , H05K3/22
CPC分类号： H05K1/0268 , G01R31/026 , G01R31/046 , H01L23/15 , H01L23/3675 , H01L23/49827 , H01L23/50 , H05K1/0206 , H05K1/0215 , H05K1/111 , H05K1/181 , H05K3/225 , H05K3/3421 , H05K2201/094 , H05K2201/10628 , H05K2201/10689 , H05K2203/16 , H05K2203/162 , Y02P70/613
摘要： A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.
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公开(公告)号：US20170348785A1
公开(公告)日：2017-12-07
申请号：US15662893
申请日：2017-07-28
发明人： Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
CPC分类号： B23K1/018 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K31/02 , B23K31/12 , B23K35/02 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/3006 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/36 , B23K2101/42 , G05B2219/37215 , G05B2219/45235 , H05K3/225 , H05K3/34 , H05K3/3484 , H05K2201/083 , H05K2203/0445 , H05K2203/104 , H05K2203/163
摘要： A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
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公开(公告)号：US20170332490A1
公开(公告)日：2017-11-16
申请号：US15435320
申请日：2017-02-17
发明人： Yung-Tai SU , Ching-Fang CHENG , Ti-Chiang CHIU
CPC分类号： H05K1/111 , H05K1/09 , H05K1/115 , H05K3/225 , H05K3/301 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K2201/0364 , H05K2201/10734 , H05K2203/167
摘要： A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
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