公开(公告)号：US09986648B2

公开(公告)日：2018-05-29

申请号：US15561338

申请日：2016-03-29

申请人： SIEMENS AKTIENGESELLSCHAFT ,  KLEB- UND GIEβHARZTECHNIK DR. LUDECK GMBH

发明人： Michael Hanisch ,  Heiko Huth ,  Wolfgang Ludeck ,  Bernd Mueller ,  Mathias Nowottnick ,  Andrey Prihodovsky ,  Dirk Seehase ,  Ulrich Wittreich ,  Dirk Wormuth

IPC分类号： H05K3/34 ,  H05K1/18 ,  B23K1/00 ,  B23K1/008 ,  B23K101/42

CPC分类号： H05K3/341 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3415 ,  H05K3/3494 ,  H05K2203/1163 ,  H05K2203/176

摘要： The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.