公开(公告)号：US20240276637A1

公开(公告)日：2024-08-15

申请号：US18348404

申请日：2023-07-07

Applicant: Microchip Technology Caldicot Limited

Inventor： George Taylor ,  Nina Biddle ,  Piers Tremlett

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K1/0366 ,  H05K1/115 ,  H05K1/14 ,  H05K3/284 ,  H05K2203/1131 ,  H05K2203/176

Abstract: A method by attaching a component to a first PCB, positioning a prepreg, having a via hole and a component cavity, proximate the first PCB with the component in the component cavity, putting a conductive material in the via hole of the prepreg, positioning a second PCB proximate the first PCB with the component and prepreg between the first PCB and the second PCB, and curing the conductive material to form a sintered via connecting the first PCB with the second PCB. A device with a first PCB, a component attached to the first PCB, a second PCB proximate the first PCB with the component between the first PCB and the second PCB, and a sintered metal via of conductive material connecting the first PCB with the second PCB.

公开(公告)号：US10034387B2

公开(公告)日：2018-07-24

申请号：US14962250

申请日：2015-12-08

Applicant: Entegris, Inc.

Inventor： André Brosseau ,  Svitlana Grigorenko ,  Ping Jiang ,  Michael B. Korzenski

IPC: H05K3/22 ,  C22B7/00 ,  C25C1/20 ,  C23F1/44 ,  C22B3/00

CPC classification number: H05K3/22 ,  C22B7/007 ,  C22B7/008 ,  C22B11/046 ,  C23F1/44 ,  C25C1/20 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/234 ,  Y02P20/582 ,  Y02P70/613 ,  Y02W30/54 ,  Y10T29/49815

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

公开(公告)号：US09978706B2

公开(公告)日：2018-05-22

申请号：US15069435

申请日：2016-03-14

Applicant: International Business Machines Corporation

Inventor： Eric V. Kline ,  Arvind K. Sinha

IPC: H01L21/44 ,  H01L23/00 ,  H05K1/11 ,  H05K13/04 ,  B23K1/018 ,  B23K1/00 ,  H05K3/22 ,  B23K101/42

CPC classification number: H01L24/17 ,  B23K1/0016 ,  B23K1/018 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/16227 ,  H01L2224/1713 ,  H05K1/11 ,  H05K3/225 ,  H05K13/0486 ,  H05K2201/0308 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/1115 ,  H05K2203/176

Abstract: Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

公开(公告)号：US20170207593A1

公开(公告)日：2017-07-20

申请号：US15000689

申请日：2016-01-19

Applicant: CISCO TECHNOLOGY, INC.

Inventor： ROBERT GREGORY TWISS

IPC: H01R43/26 ,  H05K3/00 ,  B23P19/02

CPC classification number: H01R43/26 ,  H05K3/368 ,  H05K2203/0182 ,  H05K2203/0195 ,  H05K2203/176 ,  Y10T29/53274

Abstract: According to one aspect, an apparatus includes an expansion element, an expandable element, and a frame. The expandable element is configured to have an expanded state and an unexpanded state, wherein the expandable element is arranged to be inserted between a mated pair of printed circuit boards (PCBs) while in the unexpanded state. The expansion element is arranged to cause the expandable element to expand to the expanded state. When the expandable element is in the expanded state, the expandable element causes the pair of PCBs to demate. The frame is arranged to facilitate an insertion of the expandable element between the mated pair of PCBs. In one embodiment, the expandable element is an inflatable element and the expansion element is an inflator element that includes an air supply.

公开(公告)号：US09699890B2

公开(公告)日：2017-07-04

申请号：US14823265

申请日：2015-08-11

Applicant: Mitsubishi Electric Corporation

Inventor： Koji Hashimoto ,  Keiichi Arita ,  Shozo Kanzaki

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10545 ,  H05K2203/176

Abstract: Second display means front parts, each including an immersion liquid surface level display for a coating liquid for moisture prevention and a lead-free display mark, are formed respectively in upper portions on a left side and a right side that are opposite sides having the one side interposed therebetween. A first display means front part including a board management document number, which defines a material for solder, is formed in a lower portion of the printed circuit board. A lead-free display mark (PBF) is not buried in or mixed with a large number of circuit information displays in the board, and a detailed management number is described in a reduced size to conserve space. Thus, the important lead-free display mark can be displayed with large character marks that also serve to manage a liquid surface.

公开(公告)号：US09629293B2

公开(公告)日：2017-04-18

申请号：US14800810

申请日：2015-07-16

Applicant: BOE Technology Group Co., Ltd. ,  Beijing BOE Optoelectronics Technology Co., Ltd.

Inventor： Zengqiang Zheng ,  Yixiu Liu

IPC: B32B38/10 ,  H05K13/04 ,  B32B43/00 ,  G02F1/13 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K13/0491 ,  B32B43/006 ,  G02F1/13 ,  H05K1/189 ,  H05K3/323 ,  H05K2203/1105 ,  H05K2203/176 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1978

Abstract: Embodiments of the invention disclose a chip removing device for facilitating the removal of a chip and reducing an influence on the flexible printed circuit board caused by heat, thereby optimizing the manufacturing process of the LCD panel. The chip removing device comprises: a handle; a heat supply unit mounted at one end of the handle, a detachable chip heating head provided on one side of the heat supply unit away from the handle; and a temperature controller in signal communication with the heat supply unit for controlling a temperature output by the heat supply unit.

公开(公告)号：US09545044B2

公开(公告)日：2017-01-10

申请号：US14566314

申请日：2014-12-10

Applicant: FUJITSU LIMITED

Inventor： Katsumi Takada ,  Kiyokazu Moriizumi ,  Masayuki Itoh

IPC: H05K13/00 ,  H05K13/04 ,  H05K1/02 ,  H05K3/34 ,  H01L23/36 ,  H01L23/00 ,  H01L23/34 ,  H01L23/373 ,  H05K3/22

CPC classification number: H05K1/0212 ,  H01L23/345 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/32238 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/81444 ,  H01L2224/83444 ,  H01L2924/0001 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/22 ,  H05K3/3494 ,  H05K2201/09263 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract translation: 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

公开(公告)号：US20170006701A1

公开(公告)日：2017-01-05

申请号：US15125573

申请日：2014-03-11

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： Vincenzo CASASANTA, III

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/12 ,  C08J5/04 ,  B32B5/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/36 ,  C08J5/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0366 ,  B32B3/266 ,  B32B5/02 ,  B32B5/08 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B9/02 ,  B32B9/04 ,  B32B25/02 ,  B32B25/042 ,  B32B25/08 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/28 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/04 ,  B32B2260/046 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/0278 ,  B32B2264/105 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2307/7163 ,  B32B2307/75 ,  B32B2457/08 ,  C08J5/005 ,  C08J5/041 ,  C08J2367/04 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/0353 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/097 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0271 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  C08L67/04

Abstract: Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

Abstract translation: 可生物降解的印刷电路板或PCB可以由包括至少一种可生物降解的聚合物的基材片制成。 另外，PCB上使用的电迹线也可以包括结合有导电材料的可生物降解的聚合物。 PCB可能被堆肥以降解PCBs

公开(公告)号：US09338935B2

公开(公告)日：2016-05-10

申请号：US14562679

申请日：2014-12-06

Applicant: International Business Machines Corporation

Inventor： Yvan Bessette ,  Eric Bouchard ,  Nicolas Boyer ,  Camille Dube ,  Eric Dube ,  Sarah Turgeon

IPC: B23P19/00 ,  H05K13/04 ,  B23K1/018 ,  H05K3/22 ,  H05K3/34

CPC classification number: H05K13/0486 ,  B23K1/018 ,  H05K3/225 ,  H05K3/3494 ,  H05K2203/043 ,  H05K2203/082 ,  H05K2203/1121 ,  H05K2203/1509 ,  H05K2203/1581 ,  H05K2203/176 ,  Y10T29/49117 ,  Y10T29/49815 ,  Y10T29/49822 ,  Y10T29/53274

Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.

Abstract translation: 描述了用于从基板去除电子部件的系统和方法。 在一个实施例中，系统包括用于加热基板的加热装置，其中诸如微芯片的电子部件通过一个或多个焊接连接附接到基板。 导热选择器头与电子部件物理接触地放置，以向电子部件施加张力，并通过电子部件和导热选择器头之间的导热接口将热量从电子部件吸走。 这理想地在焊料连接上产生均匀的温度梯度。 这将允许电子部件以及大部分或全部焊料从衬底移除。

公开(公告)号：US09314861B2

公开(公告)日：2016-04-19

申请号：US14286015

申请日：2014-05-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Xiaowei Huang ,  Ke Pu ,  WeiFeng Zhang ,  Shou De Zhen

IPC: B23K37/04 ,  B23K1/00 ,  B23K3/08 ,  H05K3/22 ,  H05K3/30

CPC classification number: B23K1/0016 ,  B23K3/08 ,  B23K37/04 ,  H05K3/225 ,  H05K3/308 ,  H05K2201/09572 ,  H05K2203/0195 ,  H05K2203/1581 ,  H05K2203/176

Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

Abstract translation: 提供了一种用于锁定针焊接型组件的温度触发喷射器系统。 提供了一种用于锁销焊接型部件的温度触发喷射器系统，所述部件的锁定销固定在电路板的通孔中，并且在焊接之后焊料填充在通孔中，所述系统包括：位于 在电路板的与所述部件相对的一侧，并且具有与电路板的通孔对准的顶针和驱动顶针的气缸; 温度传感器，用于感测被加热的所述焊料的温度; 控制器，用于基于由温度传感器感测的温度在焊料熔化温度范围内驱动喷射器的顶针，以将所述部件的锁定销从所述电路板中排出。