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公开(公告)号：US20150144388A1
公开(公告)日：2015-05-28
申请号：US14551007
申请日：2014-11-23
Inventor： AKIO FURUSAWA , KIYOHIRO HINE , MASATO MORI , TAICHI NAKAMURA
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0
Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。
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公开(公告)号：US20170334026A1
公开(公告)日：2017-11-23
申请号：US15582507
申请日：2017-04-28
Inventor： SHINNOSUKE AKIYAMA , KIYOHIRO HINE , HIDETOSHI KITAURA , AKIO FURUSAWA
CPC classification number: B23K35/262 , C22C13/00 , H05K1/182 , H05K2201/10022
Abstract: There is provided a solder alloy in which 0.5 mass % or more and 1.25 mass % or less of Sb, In satisfying the following formula (I) or (II) when [Sb] is set as a Sb content percentage (mass %) and [In] is set as an In content percentage (mass %): in a case of 0.5≦[Sb]≦1.0, 5.5≦[In]≦5.50+1.06[Sb] . . . (I), in a case of 1.0
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公开(公告)号：US20170266767A1
公开(公告)日：2017-09-21
申请号：US15500029
申请日：2016-03-10
Inventor： SHINNOSUKE AKIYAMA , KIYOHIRO HINE , AKIO FURUSAWA
IPC: B23K35/36 , C22C13/00 , B23K35/26 , B23K35/362
CPC classification number: B23K35/3613 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/362 , C22C13/00
Abstract: Provided is a flux for soldering that can suppress a crack in a flux residue even if the flux for soldering is exposed to a cooling and heating cycle at the highest temperature of 150° C. such as the inside of an engine room of automobiles for a long period of time, and a soldering paste composition including the flux for soldering. The flux for soldering includes a synthetic resin, an activator, an organic solvent, and a thixotropic agent, in which synthetic resin contains a triblock copolymer of methacrylic acid ester with acrylic acid ester configured of a linear alkyl moiety having 3 to 6 carbon atoms. In addition, a soldering paste composition including the flux for soldering is used.
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公开(公告)号：US20190099840A1
公开(公告)日：2019-04-04
申请号：US16137108
申请日：2018-09-20
Inventor： HIDETOSHI KITAURA , AKIO FURUSAWA , KIYOHIRO HINE
Abstract: A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
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公开(公告)号：US20160163668A1
公开(公告)日：2016-06-09
申请号：US14880942
申请日：2015-10-12
Inventor： KIYOHIRO HINE , AKIO FURUSAWA , MASATO MORI , TAICHI NAKAMURA , HIDETOSHI KITAURA
CPC classification number: H01L24/17 , B23K35/0244 , B23K35/262 , C22C13/00 , H01B1/02 , H01L24/14 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01083 , H01L2924/0135 , H01L2924/014
Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.
Abstract translation: 安装结构包括BGA，其包括BGA电极，包括电路板电极的电路板和布置在电路板电极上并连接到BGA电极的焊料接合部分。 焊料接合部由含有率在0.6质量％〜1.2质量％的范围的Cu构成，包括在3.0质量％〜4.0质量％范围内的含有Ag的Ag，含有比例为 在0质量％至1.0质量％的范围内，包括In和Sn。 根据Cu的含量比，In的含量比范围不同。
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Patent Agency Ranking
公开(公告)号：US20250121461A1
公开(公告)日：2025-04-17
申请号：US18982596
申请日：2024-12-16
Inventor： YUMI TAKAO , KIYOHIRO HINE , AKIO FURUSAWA , SHINJI ISHITANI , HIROHISA HINO
IPC: B23K35/02 , B23K35/26 , B23K35/30 , B23K35/362
Abstract: A bonding material includes: a single particle that is a particle of a first metal; a composite particle including a central core that is a particle of the first metal, and at least one coating layer covering an entire surface of the central core, the at least one coating layer including a fine particle of a second metal; and a flux including a reducing agent component, in which the first metal and the second metal have properties of forming an intermetallic compound of the first metal and the second metal, and the reducing agent component of the flux is present between the central core and the at least one coating layer.
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公开(公告)号：US20180326542A1
公开(公告)日：2018-11-15
申请号：US15949360
申请日：2018-04-10
Inventor： KAZUKI SAKAI , AKIO FURUSAWA , HIDETOSHI KITAURA , KIYOHIRO HINE
CPC classification number: B23K35/262 , C22C13/00 , C22C13/02 , H01L24/26 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32225 , H01L2924/01052 , H01L2924/014 , H01L2924/3512 , H05K3/34
Abstract: A solder alloy of the disclosure includes Sb of which a content is in a range of 3 wt % to 30 wt %, Te of which a content is in a range of 0.01 wt % to 1.5 wt %, Au of which a content is in a range of 0.005 wt % to 1 wt %, at least one of Ag and Cu, wherein a content rate of at least one of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a content rate of a sum of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a balance of Sn.
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公开(公告)号：US20170282305A1
公开(公告)日：2017-10-05
申请号：US15511231
申请日：2016-04-26
Inventor： KIYOHIRO HINE , AKIO FURUSAWA , HIDETOSHI KITAURA
Abstract: A solder alloy contains 0.5 mass % or more and 1.25 mass % or less of Sb, In which satisfies 5.5≦[In]≦5.50+1.06[Sb] in a case of 0.5≦[Sb]≦1.0; and 5.5≦[In]≦6.35+0.212[Sb] in a case of 1.0
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公开(公告)号：US20160039052A1
公开(公告)日：2016-02-11
申请号：US14920772
申请日：2015-10-22
Inventor： AKIO FURUSAWA , KIYOHIRO HINE , MASATO MORI , TAICHI NAKAMURA
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0
Abstract translation: 包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]和nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0 <[Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。
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公开(公告)号：US20250108463A1
公开(公告)日：2025-04-03
申请号：US18978382
申请日：2024-12-12
Inventor： KIYOHIRO HINE , YUMI TAKAO , HIROHISA HINO , SHINJI ISHITANI , AKIO FURUSAWA
Abstract: A bonding material includes a solder alloy having a median diameter D50 of 100 nm to 2000 nm, made from Sn, Bi, In, and other unavoidable components, and having a melting point of less than or equal to 100° C., metal nanoparticles that are Cu nanoparticles having a median diameter D50 of 50 nm to 500 nm, and a flux, wherein the metal nanoparticles include a protective film on a surface of the metal nanoparticles, the protective film separating at a temperature higher than a melting point of the solder alloy and lower than 100° C., and a weight ratio between the solder alloy and the metal nanoparticles is a ratio at which all Sn and In contained in the solder alloy become intermetallic compounds with the metal nanoparticles in an equilibrium state diagram.
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