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公开(公告)号：US20210183546A1
公开(公告)日：2021-06-17
申请号：US17119996
申请日：2020-12-11
Inventor： KAZUKI SAKAI , HIROAKI YOSHIDA
Abstract: Provided is a magnetic calorific composite material containing a magnetic calorific material and an alloy binder having a melting point in a range of 100° C. to 150° C., in which a content of the alloy binder is 7.5 to 22.5 wt %.
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公开(公告)号：US20190309397A1
公开(公告)日：2019-10-10
申请号：US16275225
申请日：2019-02-13
Inventor： KAZUKI SAKAI , TAICHI NAKAMURA , RYOU KUWABARA
Abstract: A magnetostrictive material includes a FeGaBa alloy that is represented by Expression (1), Fe(100-x-y)GaxBay (1) (in Expression (1), x and y are respectively a content rate (at. %) of Ga and a content rate (at. %) of Ba, and satisfy that y≤0.012x−0.168, y≤−0.05x+1.01, and y≥−0.04/7x+0.87/7).
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公开(公告)号：US20180326542A1
公开(公告)日：2018-11-15
申请号：US15949360
申请日：2018-04-10
Inventor： KAZUKI SAKAI , AKIO FURUSAWA , HIDETOSHI KITAURA , KIYOHIRO HINE
CPC classification number: B23K35/262 , C22C13/00 , C22C13/02 , H01L24/26 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/2912 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32225 , H01L2924/01052 , H01L2924/014 , H01L2924/3512 , H05K3/34
Abstract: A solder alloy of the disclosure includes Sb of which a content is in a range of 3 wt % to 30 wt %, Te of which a content is in a range of 0.01 wt % to 1.5 wt %, Au of which a content is in a range of 0.005 wt % to 1 wt %, at least one of Ag and Cu, wherein a content rate of at least one of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a content rate of a sum of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a balance of Sn.
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4.发明申请公开(公告)号：US20200076332A1
公开(公告)日：2020-03-05
申请号：US16460145
申请日：2019-07-02
Inventor： TAICHI NAKAMURA , KAZUKI SAKAI
Abstract: Provided herein is a magnetostriction element having a large power output and a high power density. The magnetostriction element is comprised of a magnetostrictive material that is a monocrystalline alloy represented by the following formula (1), Fe(100-α-β)GaαXβ, Formula (1) wherein α and β represent the Ga content (at %) and the X content (at %), respectively, X is at least one element selected from the group consisting of Sm, Eu, Gd, Tb, Dy, Cu, and C, and the formula satisfies 5≤α≤40, and 0≤β≤1.
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公开(公告)号：US20190296219A1
公开(公告)日：2019-09-26
申请号：US16270533
申请日：2019-02-07
Inventor： KAZUKI SAKAI , TAKEHIRO TANAKA , TAICHI NAKAMURA , RYOU KUWABARA
Abstract: A magnetostrictive material includes a FeGaC alloy that is represented by Expression (1), F(100-x-y)GaxCy (1) (in Expression (1), x and y are respectively a content rate (at. %) of Ga and a content rate (at. %) of C, and satisfy that y≤0.5x−7.75, y≤−x+20, and y≥0.5).
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Patent Agency Ranking
公开(公告)号：US20180331013A1
公开(公告)日：2018-11-15
申请号：US15950039
申请日：2018-04-10
Inventor： KIYOHIRO HINE , AKIO FURUSAWA , HIDETOSHI KITAURA , KAZUKI SAKAI
IPC: H01L23/373 , H01L23/498 , H01L23/15 , H01L23/14 , H01L33/62 , H01L33/64 , H01L21/48 , B23K35/30 , B32B9/00 , B32B15/20 , C22C5/02
CPC classification number: H01L23/3735 , B23K35/3013 , B23K2101/36 , B23K2103/12 , B23K2103/52 , B32B9/005 , B32B15/20 , B32B2457/00 , C22C5/02 , H01L21/4857 , H01L21/4882 , H01L23/142 , H01L23/15 , H01L23/49811 , H01L23/49822 , H01L23/49866 , H01L33/62 , H01L33/641 , H01L33/647
Abstract: A mount structure having a joining capable of withstanding development of cracks generated by thermal stress due to repeated temperature changes in a mount structure having the joining of a large area is formed by joining a ceramic substrate electrode of a ceramic substrate and a metal substrate electrode of a metal substrate by a laminate, in which the laminate is formed by stacking a first interface layer, a first solder joining portion, a second interface layer, a first buffer material electrode, a buffer material, a second buffer material electrode, a third interface layer, a second solder joining portion and a fourth interface layer in this order from the ceramic substrate electrode toward the metal substrate electrode, a thickness of the laminate is 30 μm or more and 100 μm or less, a difference between a thickness of the first solder joining portion and a thickness of the second solder joining portion is within 25%, and differences in elastic moduli and in linear expansion coefficients between the first solder joining portion and the buffer material are respectively within 62%.
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公开(公告)号：US20180257179A1
公开(公告)日：2018-09-13
申请号：US15897622
申请日：2018-02-15
Inventor： HIDETOSHI KITAURA , AKIO FURUSAWA , KIYOHIRO HINE , KAZUKI SAKAI
CPC classification number: B23K35/262 , B23K35/0227 , B23K2101/40 , C22C13/02 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05 , H01L2224/05073 , H01L2224/05124 , H01L2224/05166 , H01L2224/05171 , H01L2224/05647 , H01L2224/05655 , H01L2224/29111 , H01L2224/32225 , H01L2224/32501 , H01L2224/83101 , H01L2224/83447 , H01L2224/83455 , H01L2224/83948 , H01L2924/10253 , H01L2924/01052 , H01L2924/01051 , H01L2924/01079
Abstract: Provided is a solder alloy including an Sb content of 3 wt % or more and 15 wt % or less, a Te content of 0.01 wt % or more and 1.5 wt % or less, an Au content of 0.005 wt % or more and 1 wt % or less, and a remainder that is Sn.
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公开(公告)号：US20210287831A1
公开(公告)日：2021-09-16
申请号：US17185835
申请日：2021-02-25
Inventor： KAZUKI SAKAI , HIROAKI YOSHIDA
IPC: H01F1/01
Abstract: Provided is a magnetic calorific composite material including a magnetic calorific material and an alloy-coated carbon material including an alloy coat having a melting point of 150° C. or lower, in which a content of the alloy-coated carbon material is 7.5 wt % to 22.5 wt %.
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公开(公告)号：US20210285696A1
公开(公告)日：2021-09-16
申请号：US17185851
申请日：2021-02-25
Inventor： HIROAKI YOSHIDA , KAZUKI SAKAI
IPC: F25B21/00
Abstract: Provided is a magnetic cooling device including: in a hollow container, an inert gas; a material filling part containing a refrigerant and magnetic material particles having a magnetocaloric effect; gas storages containing the refrigerant at both ends of the material filling part; and material partitions between the material filling part and the gas storages, in which a volume proportion of the inert gas in the hollow container is 1 vol % or more and 12 vol % or less.
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公开(公告)号：US20200274056A1
公开(公告)日：2020-08-27
申请号：US16775239
申请日：2020-01-28
Inventor： MASAYA SHIROTANI , TAICHI NAKAMURA , KAZUKI SAKAI
Abstract: A magnetostrictive element that can exhibit a sufficiently large magnetostriction amount in a longitudinal direction is formed of a single crystal alloy magnetostrictive material. The magnetostrictive element has a shape of a plate-shaped rectangular parallelepiped, a main plane of the plate-shaped rectangular parallelepiped includes a plurality of magnetic domains that are regions where atomic magnetic moments are arranged in the same direction and whose width is 10 μm to 200 μm, and a total area rate of a magnetic domain where an angle difference between a lateral direction of the main plane and a direction of the magnetic moments of the magnetic domain is 10° or less to the main plane is 60% to 100%.
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