公开(公告)号：US12069810B2

公开(公告)日：2024-08-20

申请号：US17353192

申请日：2021-06-21

申请人： Western Digital Technologies, Inc.

发明人： Fakhrozi Bin Che Ani ,  Mohamad Riduwan Bin Ramli ,  Mohamad Solehin Bin Mohamed Sunar ,  Ibrahym Bin Ahmad

IPC分类号： H05K3/12 ,  H05K3/24 ,  H05K3/34 ,  H05K1/11 ,  H05K3/28

CPC分类号： H05K3/1225 ,  H05K3/1233 ,  H05K3/24 ,  H05K1/115 ,  H05K3/282 ,  H05K3/3485 ,  H05K2203/0726 ,  H05K2203/1366

摘要： A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.

公开(公告)号：US12004303B2

公开(公告)日：2024-06-04

申请号：US16761850

申请日：2018-11-09

申请人： NORDSON CORPORATION

发明人： Michel Van De Vijver ,  Stephane Etienne ,  Ronny Franken ,  Marc Knippenberg

IPC分类号： H05K3/22 ,  B05D3/02 ,  H05K3/00 ,  H05K3/28 ,  H01L21/67

CPC分类号： H05K3/0091 ,  B05D3/0272 ,  H05K3/227 ,  H05K3/28 ,  H01L21/67178 ,  H05K2203/0736 ,  H05K2203/085 ,  H05K2203/1366 ,  H05K2203/1545 ,  H05K2203/163

摘要： A system for applying a coating to a substrate. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

公开(公告)号：US20190240689A1

公开(公告)日：2019-08-08

申请号：US16178572

申请日：2018-11-01

申请人： NORDSON CORPORATION

发明人： Timothy A. Girvin ,  Camille I. Sybert ,  Alan R. Lewis ,  Gary A. Kephart

IPC分类号： B05B12/08 ,  B05B9/04 ,  B05B12/12 ,  H05K3/28 ,  H05K3/00

CPC分类号： B05B12/085 ,  B05B9/0403 ,  B05B12/12 ,  B05C11/1005 ,  G05D7/0623 ,  H05K3/0091 ,  H05K3/28 ,  H05K2203/1366

摘要： Systems and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes calibrating flow rate of a material through a coating system. A target flow rate for the material through a spray nozzle is received, a first operating pressure of the coating system based upon the target flow rate is calculated, and the material is ejected onto a least part of a surface with the material flowing through the spray nozzle at the first operating pressure of the coating system. Subsequent to a comparison between an operating flow rate and the target flow rate, the operating pressure is adjusted to a second operating pressure and at least part of the substrate is sprayed with the material flowing through the spray nozzle at the second operating pressure of the coating system.

公开(公告)号：US20180083662A1

公开(公告)日：2018-03-22

申请号：US15382241

申请日：2016-12-16

申请人： Syed Taymur Ahmad ,  Bruce Acton

发明人： Syed Taymur Ahmad ,  Bruce Acton

IPC分类号： H04B1/3888 ,  H05K3/28 ,  H05K3/10 ,  H05K5/00 ,  H05K1/03 ,  H05K1/09 ,  H01R13/648

CPC分类号： H04B1/3888 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

摘要： Methods for protecting an electronic device from contaminants by applying different insulating and conducting materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating material, such as isobutylene isoprene rubber, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with different materials. Electronic devices that are protected by such coatings are also disclosed, such as smart phones, computers, head phones, and gaming devices, all of which show improve protection from contaminants, especially liquid contaminants.

公开(公告)号：US20170273193A1

公开(公告)日：2017-09-21

申请号：US15615306

申请日：2017-06-06

申请人： Eric Sari ,  Brian Stumm ,  Roger Plough

发明人： Eric Sari ,  Brian Stumm ,  Roger Plough

IPC分类号： H05K3/28 ,  G05B19/042 ,  B65G43/00 ,  B65G37/00

CPC分类号： G05B19/0421 ,  B65G43/00 ,  H05K3/0091 ,  H05K3/28 ,  H05K3/287 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

摘要： A unit can include a power supply interface; a processor board power interface operatively coupled to the power supply interface where the processor board power interface operatively couples to and supplies power to a processor board; a serial interface that operatively couples to the processor board; a microcontroller operatively coupled to the serial interface; memory operatively coupled to the microcontroller; a motor control interface operatively coupled to the microcontroller; an optically isolated digital input interface operatively coupled to the microcontroller; a digital output interface operatively coupled to the microcontroller; and instructions stored in the memory and executable by the microcontroller to instruct the unit to receive digital input via the optically isolated digital input interface from a machine and to output motor control signals via the motor control interface to at least one motor of the machine.

公开(公告)号：US09648720B2

公开(公告)日：2017-05-09

申请号：US13947525

申请日：2013-07-22

申请人： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

发明人： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

IPC分类号： H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/81024 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/83024 ,  H01L2224/83205 ,  H01L2224/83395 ,  H01L2224/83815 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85395 ,  H01L2224/85447 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/00 ,  H05K3/282 ,  H05K3/285 ,  H05K3/288 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2203/092 ,  H05K2203/107 ,  H05K2203/1338 ,  H05K2203/1366 ,  H05K2203/1372 ,  H05K2203/1383 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.

公开(公告)号：US20150294793A1

公开(公告)日：2015-10-15

申请号：US14646637

申请日：2013-11-21

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Dipankar Ghosh ,  Christopher S. Lyons ,  Robin E. Gorrell ,  Stephen P. Maki

IPC分类号： H01G4/33 ,  H01G4/20

CPC分类号： H01G4/33 ,  H01G4/20 ,  H01G4/206 ,  H01L28/56 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/162 ,  H05K3/022 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1366

摘要： A multilayer dielectric film including a first dielectric layer made from a material having a first breakdown field strength and a second dielectric layer disposed on the first dielectric layer made from a material having a different breakdown filed strength. A multilayer film including a first electrically conductive layer, the first dielectric layer disposed on the first electrically conductive layer, the second dielectric layer disposed on the first dielectric layer, and a second electrically conductive layer disposed on the second dielectric layer is also disclosed. The first electrically conductive layer can have at least one of an average surface roughness of at least ten nanometers, a thickness of at least ten micrometers, or an average visible light transmission of up to ten percent. The first dielectric layer may be a polymer and typically has a lower dielectric constant than the second dielectric layer, which may be ceramic.

摘要翻译： 一种多层电介质膜，包括由具有第一击穿场强的材料制成的第一电介质层和设置在具有不同击穿场强的材料制成的第一电介质层上的第二电介质层。 还公开了一种多层膜，其包括第一导电层，设置在第一导电层上的第一介电层，设置在第一介电层上的第二介电层和设置在第二介电层上的第二导电层。 第一导电层可以具有至少10纳米的平均表面粗糙度，至少10微米的厚度或高达10％的平均可见光透射率中的至少一个。 第一介电层可以是聚合物，并且通常具有比可以是陶瓷的第二介电层更低的介电常数。

公开(公告)号：US20150282304A1

公开(公告)日：2015-10-01

申请号：US14226593

申请日：2014-03-26

申请人： Apple Inc.

发明人： Colin M. Ely ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf ,  Stephen Brian Lynch

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K1/0281 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0305 ,  H05K2201/055 ,  H05K2201/057 ,  H05K2201/09109 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10128 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1194 ,  H05K2203/1327 ,  H05K2203/1366

摘要： An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

摘要翻译： 电子设备可以设置有印刷电路。 电气部件可以使用由印刷电路中的金属迹线形成的信号路径互连。 印刷电路可以包括具有弯曲构型的柔性印刷电路。 柔性印刷电路可以设置有整体弯曲保持结构。 弯曲保持结构可以由聚合物层，焊料层，由金属或聚合物形成的加强件形成，金属或聚合物通过粘合剂附接到柔性印刷电路层，保形塑料涂层覆盖弯曲处的暴露的金属迹线，金属加强件 具有螺孔，形状记忆合金，柔性印刷电路电介质基底层的一部分，屈服值下降的伸长率或这些结构的组合。 弯曲保持结构在弯曲的柔性印刷电路中保持弯曲。

公开(公告)号：US20140212678A1

公开(公告)日：2014-07-31

申请号：US14004204

申请日：2012-04-16

申请人： Katsumori Taniguro

发明人： Katsumori Taniguro

IPC分类号： B23K3/06 ,  B23K1/20 ,  B23K3/08

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/08 ,  B23K1/20 ,  B23K1/203 ,  B23K3/0646 ,  B23K3/0669 ,  B23K3/082 ,  B23K35/262 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/741 ,  H01L24/742 ,  H01L2224/03312 ,  H01L2224/03418 ,  H01L2224/036 ,  H01L2224/0381 ,  H01L2224/03821 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/0569 ,  H01L2224/11312 ,  H01L2224/116 ,  H01L2224/11821 ,  H01L2224/13111 ,  H01L2224/1369 ,  H01L2224/741 ,  H01L2924/381 ,  H05K3/0085 ,  H05K3/282 ,  H05K3/3468 ,  H05K2203/081 ,  H05K2203/122 ,  H05K2203/1366 ,  H05K2203/1518 ,  Y10T428/31678 ,  H01L2224/1141 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2224/03

摘要： Provided are a soldering device and method which allow for oldering at low cost with high yield and high reliability. To solve the above problems, the soldering device has: a first processing section that immerses workpiece member 10 having copper electrode 2 in organic fatty acid-containing solution, and horizontally move immersed workpiece member 10 in organic fatty acid-containing solution 31; a second processing section having ejection unit 33 to spray a jet stream of molten solder 5a to workpiece member 10 while pulling out workpiece member 10 processed in the first processing section to space section 24 that has a pressurized steam atmosphere and is provided above organic fatty acid-containing solution 31; a third processing section having ejection unit 34 to spray organic fatty acid-containing solution 31 to excess molten solder 5a on workpiece member 10 for removal while pulling down workpiece member 10 processed in the second processing section after horizontally moving in space section 24; and a fourth processing section that picks up workpiece member 10 processed in the third processing section by pulling out from organic fatty acid-containing solution 31 after horizontally moving in organic fatty acid-containing solution 31.

摘要翻译： 提供了一种能够以低成本，高产率和高可靠性老化的焊接装置和方法。 为了解决上述问题，焊接装置具有：将具有铜电极2的工件10浸渍在含有有机脂肪酸的溶液中的水平移动浸渍的有机脂肪酸溶液31中的浸渍工件10的第一处理部， 第二处理部分具有喷射单元33，以将熔融焊料5a的喷射流喷射到工件10上，同时将在第一处理部分中加工的工件10拉出到具有加压蒸汽气氛的空间部分24并且设置在有机脂肪酸之上 含有溶液31; 具有喷射单元34的喷射单元34，用于在空间部24中水平移动之后，将在第二处理部中处理的工件10拉下的同时，将含有机脂肪酸的溶液31喷射到工件10上的多余的熔融焊料5a以进行除去; 以及第四处理部，其通过在含有有机脂肪酸的溶液31中水平移动之后从含有机脂肪酸的溶液31中拉出而拾取在第三处理部中处理的工件10。

公开(公告)号：US08753462B2

公开(公告)日：2014-06-17

申请号：US12476216

申请日：2009-06-01

申请人： Beom Joon Cho ,  Eun Tae Park ,  Hyoung Ho Kim

发明人： Beom Joon Cho ,  Eun Tae Park ,  Hyoung Ho Kim

IPC分类号： C03B29/00

CPC分类号： H05K3/4611 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/1126 ,  H05K2203/1366 ,  H05K2203/308 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

摘要翻译： 公开了一种制造非闪烁多层陶瓷基板的方法。 该方法包括在多个陶瓷生片中的至少一个中形成至少一个导电通孔和电极图案，层压陶瓷生片以形成陶瓷层压体，选择性地形成耐烧结粉末的收缩抑制薄膜 在陶瓷层叠体的两个表面的至少一个表面中包括导电通孔及其周边的区域，使用气溶胶沉积，设置用于抑制陶瓷层压体在陶瓷层压体的两个表面中的至少一个上的收缩的收缩抑制生片 包括用于形成非烧结多层陶瓷衬底的收缩抑制薄膜，以及烧结非烧结多层陶瓷衬底。