公开(公告)号：US12004303B2

公开(公告)日：2024-06-04

申请号：US16761850

申请日：2018-11-09

Applicant: NORDSON CORPORATION

Inventor： Michel Van De Vijver ,  Stephane Etienne ,  Ronny Franken ,  Marc Knippenberg

IPC: H05K3/22 ,  B05D3/02 ,  H05K3/00 ,  H05K3/28 ,  H01L21/67

CPC classification number: H05K3/0091 ,  B05D3/0272 ,  H05K3/227 ,  H05K3/28 ,  H01L21/67178 ,  H05K2203/0736 ,  H05K2203/085 ,  H05K2203/1366 ,  H05K2203/1545 ,  H05K2203/163

Abstract: A system for applying a coating to a substrate. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

公开(公告)号：US11792942B2

公开(公告)日：2023-10-17

申请号：US16766511

申请日：2018-11-22

Applicant: FONDAZIONE ISTITUTO ITALIANO DI TECNOLOGIA

Inventor： Alessandro Chiolerio

IPC: H05K3/12 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/125 ,  H05K3/0091 ,  H05K3/1283 ,  H05K3/287 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/1377 ,  H05K2203/163

Abstract: Apparatus for transferring conductive patterns to a substrate (56), comprising a module (52) configured to transfer a pattern (63) of sinterable material (63a) to said substrate (56) and an optical module (12) to perform a sintering of the transferred pattern (63a). Said apparatus comprises one or more self-propelled pattern transferring units (52) comprising a module configured to move said self-propelled unit (14, 20) over said substrate (56) under the control of movement instructions (53b) associated to a motor (16, 21), said self-propelled unit (14, 20) comprising said module (52) configured to transfer a pattern (63a) of sinterable material (CI) to said substrate (56) obtaining a transferred pattern (63a) and comprising also said optical module (12) to perform a sintering of the transferred pattern (63a) on said substrate (56) obtaining a sintered pattern (63b, 63c).

公开(公告)号：US20190240689A1

公开(公告)日：2019-08-08

申请号：US16178572

申请日：2018-11-01

Applicant: NORDSON CORPORATION

Inventor： Timothy A. Girvin ,  Camille I. Sybert ,  Alan R. Lewis ,  Gary A. Kephart

IPC: B05B12/08 ,  B05B9/04 ,  B05B12/12 ,  H05K3/28 ,  H05K3/00

CPC classification number: B05B12/085 ,  B05B9/0403 ,  B05B12/12 ,  B05C11/1005 ,  G05D7/0623 ,  H05K3/0091 ,  H05K3/28 ,  H05K2203/1366

Abstract: Systems and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes calibrating flow rate of a material through a coating system. A target flow rate for the material through a spray nozzle is received, a first operating pressure of the coating system based upon the target flow rate is calculated, and the material is ejected onto a least part of a surface with the material flowing through the spray nozzle at the first operating pressure of the coating system. Subsequent to a comparison between an operating flow rate and the target flow rate, the operating pressure is adjusted to a second operating pressure and at least part of the substrate is sprayed with the material flowing through the spray nozzle at the second operating pressure of the coating system.

公开(公告)号：US20180199436A1

公开(公告)日：2018-07-12

申请号：US15911623

申请日：2018-03-05

Applicant: THE TRUSTEES OF PRINCETON UNIVERSITY ,  VORBECK MATERIALS CORPORATION

Inventor： John M. CRAIN ,  John S. LETTOW ,  Ilhan A. AKSAY ,  Sibel KORKUT ,  Katherine S. CHIANG ,  Chuan-Hua CHEN ,  Robert K. PRUD'HOMME

IPC: H05K1/09 ,  C09D11/037 ,  C09D7/65 ,  C09C1/46

CPC classification number: H05K1/095 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/02 ,  C01P2006/12 ,  C01P2006/40 ,  C08K3/04 ,  C09C1/46 ,  C09D7/65 ,  C09D7/70 ,  C09D11/037 ,  C09D11/102 ,  C09D11/52 ,  C09D171/02 ,  C09D177/00 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/0091 ,  H05K3/12 ,  H05K2201/0323 ,  Y10S977/734 ,  Y10S977/847 ,  Y10S977/932 ,  H01L2924/00

Abstract: Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

公开(公告)号：US09888573B2

公开(公告)日：2018-02-06

申请号：US14428454

申请日：2013-09-13

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Dominique Vicard ,  Jean Brun

IPC: H05K1/18 ,  H05K3/46 ,  H01L23/10 ,  H01L23/31 ,  H05K1/11 ,  H01L23/00 ,  H05K3/00

CPC classification number: H05K1/11 ,  H01L23/10 ,  H01L23/3157 ,  H01L24/66 ,  H01L24/69 ,  H01L2224/66 ,  H01L2224/69 ,  H01L2224/72 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0091 ,  H05K3/46 ,  H05K2201/09036 ,  H01L2224/48 ,  H01L2924/00

Abstract: The cap (1) is intended to be assembled with at least one chipped element (2), said cap comprising a stack of a plurality of electrically insulating layers (1a) delimiting at least one shoulder (3) forming a part of a first groove (4) for housing a wired element (12). The cap further comprises: at least one electrical bump contact (6) arranged at an assembly surface (7) of the stack intended to be mounted on a face of the chipped element (2); at least one electrical connection terminal (5, 5′) arranged at a wall of the shoulder (3); an electrical link element (8), electrically linking said electrical connection terminal (5) to the electrical bump contact (6).

公开(公告)号：US09862857B2

公开(公告)日：2018-01-09

申请号：US15254006

申请日：2016-09-01

Applicant: Mercene Labs AB

Inventor： Carl Fredrik Carlborg ,  Tommy Haraldsson

IPC: B32B3/00 ,  C09D163/04 ,  C08F283/10 ,  C08G59/40 ,  C09D163/00 ,  C09D4/00 ,  B05D3/06 ,  B05D7/00 ,  H05K3/00 ,  B05D1/02 ,  B05D1/28 ,  B05D1/30 ,  G03F7/027 ,  C08F222/10 ,  G03F7/038

CPC classification number: C09D163/04 ,  B05D1/02 ,  B05D1/28 ,  B05D1/305 ,  B05D3/06 ,  B05D3/067 ,  B05D7/50 ,  B05D7/58 ,  C08F222/1006 ,  C08F283/105 ,  C08G59/4064 ,  C09D4/00 ,  C09D163/00 ,  G03F7/0275 ,  G03F7/038 ,  H05K3/0091 ,  Y10T428/24851 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31522

Abstract: An object with a coating comprising: a) covalent bonds formed by reaction of a thiol group and a carbon-carbon double bond, b) covalent bonds formed by reaction of a thiol group and epoxide group, c) covalent bonds formed by a reaction of a carbon-carbon double bond and an epoxide group, said coating comprising a first primer coating and a second coating, said coating comprising covalent bonds between said first and second coatings, said first primer coating comprising covalent cross links between compounds, in the first coating the fraction (r3=ta/tc) of unreacted thiol groups (ta) to thiol groups which have reacted to form a covalent bond (tc) does not exceed 0.11, wherein the half height peak width of tan delta does not exceed 30° C. Advantages of the dual cure composition is that excellent strength is obtained and that the second curing is slow compared to the first initial curing.

公开(公告)号：US20170273193A1

公开(公告)日：2017-09-21

申请号：US15615306

申请日：2017-06-06

Applicant: Eric Sari ,  Brian Stumm ,  Roger Plough

Inventor： Eric Sari ,  Brian Stumm ,  Roger Plough

IPC: H05K3/28 ,  G05B19/042 ,  B65G43/00 ,  B65G37/00

CPC classification number: G05B19/0421 ,  B65G43/00 ,  H05K3/0091 ,  H05K3/28 ,  H05K3/287 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: A unit can include a power supply interface; a processor board power interface operatively coupled to the power supply interface where the processor board power interface operatively couples to and supplies power to a processor board; a serial interface that operatively couples to the processor board; a microcontroller operatively coupled to the serial interface; memory operatively coupled to the microcontroller; a motor control interface operatively coupled to the microcontroller; an optically isolated digital input interface operatively coupled to the microcontroller; a digital output interface operatively coupled to the microcontroller; and instructions stored in the memory and executable by the microcontroller to instruct the unit to receive digital input via the optically isolated digital input interface from a machine and to output motor control signals via the motor control interface to at least one motor of the machine.

公开(公告)号：US09769922B2

公开(公告)日：2017-09-19

申请号：US14373885

申请日：2012-06-15

Applicant: Heung Sang Yu

Inventor： Heung Sang Yu

IPC: C23C14/34 ,  H05K1/03 ,  G06F3/041 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  C23C14/04 ,  C23C14/08

CPC classification number: H05K1/0306 ,  C23C14/04 ,  C23C14/08 ,  C23C14/34 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/0284 ,  H05K3/0011 ,  H05K3/0091 ,  H05K3/108 ,  H05K2201/0326 ,  H05K2201/10128 ,  H05K2201/2054

Abstract: Disclosed is a white coating layer-formed touch screen panel. The coating layer includes a glass substrate, a white coating layers selectively formed on an edge portion of the glass substrate, a black color coating layer selectively formed on an edge portion, and a transparent conductive layer formed on the glass substrate including the edge portion.

公开(公告)号：US20170238423A1

公开(公告)日：2017-08-17

申请号：US15581367

申请日：2017-04-28

Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY

Inventor： Jungho HWANG ,  Jaehong PARK

IPC: H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/12

CPC classification number: H05K3/0091 ,  H05K1/0393 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/09681

Abstract: A method for manufacturing a flexible transparent electrode includes: preparing a substrate made of a flexible and transparent material, a metal nanocolloidal solution and an electrohydrodynamic jet printing device; fixing the substrate at a position spaced apart from an injection nozzle of the electrohydrodynamic jet printing device at a predetermined interval in order to print a metal pattern on the substrate using the electrohydrodynamic jet printing device; applying AC voltage of a predetermined power to the substrate and the injection nozzle of the electrohydrodynamic jet printing device; printing the metal pattern on an upper side of the substrate by the metal nanocolloidal solution using the electrohydrodynamic jet printing device in a state where the AC voltage of the predetermined power is applied to the substrate and the injection nozzle; and sintering the metal pattern formed on the substrate.

公开(公告)号：US09504150B2

公开(公告)日：2016-11-22

申请号：US14751418

申请日：2015-06-26

Applicant: The Trustees of Princeton University ,  Vorbeck Materials Corporation

Inventor： John M. Crain ,  John S. Lettow ,  Ilhan A. Aksay ,  Sibel Korkut ,  Katherine S. Chiang ,  Chuan-Hua Chen ,  Robert K. Prud'Homme

IPC: H05K1/09 ,  H05K3/12 ,  C09C1/46 ,  C09D7/12 ,  C09D11/52 ,  H05K3/00 ,  C08K3/04

CPC classification number: H05K1/095 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/02 ,  C01P2006/12 ,  C01P2006/40 ,  C08K3/04 ,  C09C1/46 ,  C09D7/65 ,  C09D7/70 ,  C09D11/037 ,  C09D11/102 ,  C09D11/52 ,  C09D171/02 ,  C09D177/00 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/0091 ,  H05K3/12 ,  H05K2201/0323 ,  Y10S977/734 ,  Y10S977/847 ,  Y10S977/932 ,  H01L2924/00

Abstract: Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.